CN114025501B - 一种pcb板蚀刻加工去铜的方法 - Google Patents
一种pcb板蚀刻加工去铜的方法 Download PDFInfo
- Publication number
- CN114025501B CN114025501B CN202111397752.2A CN202111397752A CN114025501B CN 114025501 B CN114025501 B CN 114025501B CN 202111397752 A CN202111397752 A CN 202111397752A CN 114025501 B CN114025501 B CN 114025501B
- Authority
- CN
- China
- Prior art keywords
- copper
- etching
- pcb
- parts
- developing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 239000010949 copper Substances 0.000 title claims abstract description 54
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 54
- 238000005530 etching Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000007788 liquid Substances 0.000 claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 claims abstract description 25
- 238000005406 washing Methods 0.000 claims abstract description 15
- 238000011161 development Methods 0.000 claims abstract description 11
- 238000001514 detection method Methods 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 claims description 10
- 229910000360 iron(III) sulfate Inorganic materials 0.000 claims description 10
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 8
- 229910021641 deionized water Inorganic materials 0.000 claims description 8
- HKVFISRIUUGTIB-UHFFFAOYSA-O azanium;cerium;nitrate Chemical compound [NH4+].[Ce].[O-][N+]([O-])=O HKVFISRIUUGTIB-UHFFFAOYSA-O 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 239000007888 film coating Substances 0.000 claims description 2
- 238000009501 film coating Methods 0.000 claims description 2
- 239000003814 drug Substances 0.000 abstract description 6
- 239000006260 foam Substances 0.000 abstract description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical group [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 229910000029 sodium carbonate Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 2
- 239000011790 ferrous sulphate Substances 0.000 description 2
- 235000003891 ferrous sulphate Nutrition 0.000 description 2
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 2
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229960004887 ferric hydroxide Drugs 0.000 description 1
- IEECXTSVVFWGSE-UHFFFAOYSA-M iron(3+);oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Fe+3] IEECXTSVVFWGSE-UHFFFAOYSA-M 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
数量(PNL) | 残铜缺陷数 | 不良率(%) | |
实施例1 | 50 | 0 | 0 |
实施例2 | 50 | 0 | 0 |
实施例3 | 50 | 1 | 2 |
对比例1 | 50 | 5 | 10 |
对比例2 | 50 | 2 | 4 |
对比例3 | 50 | 4 | 8 |
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111397752.2A CN114025501B (zh) | 2021-11-19 | 2021-11-19 | 一种pcb板蚀刻加工去铜的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111397752.2A CN114025501B (zh) | 2021-11-19 | 2021-11-19 | 一种pcb板蚀刻加工去铜的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114025501A CN114025501A (zh) | 2022-02-08 |
CN114025501B true CN114025501B (zh) | 2024-03-29 |
Family
ID=80065818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111397752.2A Active CN114025501B (zh) | 2021-11-19 | 2021-11-19 | 一种pcb板蚀刻加工去铜的方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114025501B (zh) |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1050865A (en) * | 1975-09-22 | 1979-03-20 | Jo Wynschenk | Alkaline compositions and process for etching copper |
JPH0846330A (ja) * | 1994-07-27 | 1996-02-16 | Mitsubishi Paper Mills Ltd | プリント配線板の製造方法 |
JP2002180095A (ja) * | 2000-12-11 | 2002-06-26 | Fujitsu Ltd | 残渣物除去液、及びそれを使ったプリント配線板の製造方法 |
JP2004006584A (ja) * | 2001-11-16 | 2004-01-08 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線板の製造方法及びその製造方法で得られたフレキシブルプリント配線板 |
JP2004319918A (ja) * | 2003-04-18 | 2004-11-11 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線板の製造方法及びその製造方法で得られたフレキシブルプリント配線板 |
JP2005023340A (ja) * | 2003-06-30 | 2005-01-27 | Nihon Kagaku Sangyo Co Ltd | プリント配線板のエッチング方法及びエッチング液 |
KR20090050390A (ko) * | 2007-11-15 | 2009-05-20 | (주)인터플렉스 | 저항 내장형 인쇄회로기판의 제조방법 |
CN101730389A (zh) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | 制作单面镂空柔性电路板的方法 |
CN105208778A (zh) * | 2015-09-23 | 2015-12-30 | 安捷利电子科技(苏州)有限公司 | 一种片式生产高密度柔性印制电路板的制作方式 |
CN108289379A (zh) * | 2018-02-08 | 2018-07-17 | 江西景旺精密电路有限公司 | Pcb内层显影蚀刻及自动光学检测连线设备及连线方法 |
CN110446363A (zh) * | 2019-08-13 | 2019-11-12 | 广东达源设备科技有限公司 | 一种线路板蚀刻方法及线路板 |
CN111867266A (zh) * | 2020-07-14 | 2020-10-30 | 江门崇达电路技术有限公司 | 一种防止pcb孤立线路短路的线路设计方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8486281B2 (en) * | 2009-10-05 | 2013-07-16 | Kesheng Feng | Nickel-chromium alloy stripper for flexible wiring boards |
-
2021
- 2021-11-19 CN CN202111397752.2A patent/CN114025501B/zh active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1050865A (en) * | 1975-09-22 | 1979-03-20 | Jo Wynschenk | Alkaline compositions and process for etching copper |
JPH0846330A (ja) * | 1994-07-27 | 1996-02-16 | Mitsubishi Paper Mills Ltd | プリント配線板の製造方法 |
JP2002180095A (ja) * | 2000-12-11 | 2002-06-26 | Fujitsu Ltd | 残渣物除去液、及びそれを使ったプリント配線板の製造方法 |
JP2004006584A (ja) * | 2001-11-16 | 2004-01-08 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線板の製造方法及びその製造方法で得られたフレキシブルプリント配線板 |
JP2004319918A (ja) * | 2003-04-18 | 2004-11-11 | Mitsui Mining & Smelting Co Ltd | フレキシブルプリント配線板の製造方法及びその製造方法で得られたフレキシブルプリント配線板 |
JP2005023340A (ja) * | 2003-06-30 | 2005-01-27 | Nihon Kagaku Sangyo Co Ltd | プリント配線板のエッチング方法及びエッチング液 |
KR20090050390A (ko) * | 2007-11-15 | 2009-05-20 | (주)인터플렉스 | 저항 내장형 인쇄회로기판의 제조방법 |
CN101730389A (zh) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | 制作单面镂空柔性电路板的方法 |
CN105208778A (zh) * | 2015-09-23 | 2015-12-30 | 安捷利电子科技(苏州)有限公司 | 一种片式生产高密度柔性印制电路板的制作方式 |
CN108289379A (zh) * | 2018-02-08 | 2018-07-17 | 江西景旺精密电路有限公司 | Pcb内层显影蚀刻及自动光学检测连线设备及连线方法 |
CN110446363A (zh) * | 2019-08-13 | 2019-11-12 | 广东达源设备科技有限公司 | 一种线路板蚀刻方法及线路板 |
CN111867266A (zh) * | 2020-07-14 | 2020-10-30 | 江门崇达电路技术有限公司 | 一种防止pcb孤立线路短路的线路设计方法 |
Also Published As
Publication number | Publication date |
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CN114025501A (zh) | 2022-02-08 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20240307 Address after: 343000 Zongsi Road, Industrial Park Zone 2, Wan'an County, Ji'an City, Jiangxi Province Applicant after: Ji'an Sanqiang Line Co.,Ltd. Country or region after: China Address before: 518100 xueziwei Industrial Zone, Yabian village, Shajing Town, Bao'an District, Shenzhen City, Guangdong Province Applicant before: Shenzhen Maslan Circuit Technology Industrial Development Co.,Ltd. Country or region before: China |
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GR01 | Patent grant |