JP2009503139A5 - - Google Patents

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JP2009503139A5
JP2009503139A5 JP2008522785A JP2008522785A JP2009503139A5 JP 2009503139 A5 JP2009503139 A5 JP 2009503139A5 JP 2008522785 A JP2008522785 A JP 2008522785A JP 2008522785 A JP2008522785 A JP 2008522785A JP 2009503139 A5 JP2009503139 A5 JP 2009503139A5
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composition
polymerizable material
functional group
imprint lithography
substrate
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JP2008522785A
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JP5084728B2 (ja
JP2009503139A (ja
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Priority claimed from US11/187,406 external-priority patent/US7759407B2/en
Priority claimed from US11/187,407 external-priority patent/US8557351B2/en
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Claims (12)

  1. インプリントリソグラフィの基板に層を接着する方法であって、
    (i)有機主鎖基(a)と、前記有機主鎖基の対向する両端に結合された、互いに異なる第1官能基と第2官能基(b)とを有する多官能性反応性化合物を含んだ組成物を前記インプリントリソグラフィの基板に堆積するステップと、
    (ii)前記組成物を架橋、重合させるステップ、および前記第2官能基を介して前記インプリントリソグラフィの基板と前記多官能性反応性化合物間の相互作用を形成するステップとを含む、前記組成物を熱硬化させるステップと、
    (iii)前記熱硬化された組成物上に重合可能な材料を堆積させて前記層を形成するステップと、
    (iv)前記重合可能な材料を化学線エネルギーに曝露し、前記重合可能な材料を重合するステップと、
    から成り、
    前記重合可能な材料を重合するステップは、前記第1官能基を介して前記熱硬化された組成物にある重合可能な材料と前記多官能性化合物との間に共有結合を形成することを特徴とする方法。
  2. 前記相互作用は、共有結合、イオン結合、ファンデルワールス力から構成される接着機構の中から選択されることを特徴とする請求項1記載の方法。
  3. 前記重合可能な材料を堆積させるステップは、前記熱硬化された組成物上に前記重合可能な材料の液滴を離散して堆積させることを特徴とする請求項1記載の方法。
  4. 前記組成物は、架橋剤をさらに有することを特徴とする請求項1記載の方法。
  5. 前記第1官能基は、アクリル酸基であることを特徴とする請求項1記載の方法。
  6. 前記有機主鎖基は脂肪族および芳香族から構成される複数の群から選択されることを特徴とする請求項1記載の方法。
  7. インプリントリソグラフィの基板に層を接着する方法であって、
    (i)有機主鎖基(a)と前記有機主鎖基の対向する両端に結合された第1官能基と第2官能基(b)とを有する多官能性反応性化合物を含んだ組成物を、前記インプリントリソグラフィの基板に堆積するステップと、
    (ii)前記組成物を架橋、重合させるステップ、および前記第2官能基と前記インプリントリソグラフィの基板との間に相互作用を形成するステップを含む、前記組成物を凝固させて前記インプリントリソグラフィの基板に接着するステップと、
    (iii)前記凝固された組成物上に重合可能な材料の液滴を離散して堆積するステップと、
    (iv)前記重合可能な材料をインプリントリソグラフィのモールドに接触させるステップと、
    (v)前記重合可能な材料を重合するステップと、
    (vi)前記インプリントリソグラフィのモールドを前記重合された材料から剥離するステップと、
    から成り、前記相互作用は、共有結合、イオン結合、ファンデルワールス力から構成される接着機構の中から選択され、
    前記重合するステップは、重合している間、前記凝固された組成物内の前記重合可能な材料と前記第1官能基との間に共有結合を形成するステップを有することを特徴とする方法。
  8. 前記組成物を凝固するステップは、前記組成物を熱硬化するステップと、化学線エネルギーに前記重合可能な材料を曝露するステップをさらに有することを特徴とする請求項7記載の方法。
  9. 前記第1官能基と前記第2官能基は異なることを特徴とする請求項7記載の方法。
  10. 前記組成物は架橋剤を有し、前記組成物を凝固するステップは、前記第2官能基が前記インプリントリソグラフィの基板と前記架橋と反応するステップをさらに有することを特徴とする請求項7記載の方法。
  11. 前記第1官能基はアクリル酸基であることを特徴とする請求項7記載の方法。
  12. 前記有機主鎖基は、脂肪族および芳香族から構成される複数の群から選択されることを特徴とする請求項1記載の方法。
JP2008522785A 2005-07-22 2006-06-05 材料を相互に接着するための方法及び組成物 Active JP5084728B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US11/187,407 2005-07-22
US11/187,406 2005-07-22
US11/187,406 US7759407B2 (en) 2005-07-22 2005-07-22 Composition for adhering materials together
US11/187,407 US8557351B2 (en) 2005-07-22 2005-07-22 Method for adhering materials together
PCT/US2006/021948 WO2007050133A2 (en) 2005-07-22 2006-06-05 Method and composition for adhering materials together

Publications (3)

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JP2009503139A JP2009503139A (ja) 2009-01-29
JP2009503139A5 true JP2009503139A5 (ja) 2009-07-16
JP5084728B2 JP5084728B2 (ja) 2012-11-28

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US (2) US8557351B2 (ja)
EP (1) EP1915888B1 (ja)
JP (1) JP5084728B2 (ja)
KR (1) KR101416112B1 (ja)
SG (1) SG163605A1 (ja)
TW (1) TWI329239B (ja)
WO (1) WO2007050133A2 (ja)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060108710A1 (en) * 2004-11-24 2006-05-25 Molecular Imprints, Inc. Method to reduce adhesion between a conformable region and a mold
US20050160934A1 (en) * 2004-01-23 2005-07-28 Molecular Imprints, Inc. Materials and methods for imprint lithography
US7307118B2 (en) * 2004-11-24 2007-12-11 Molecular Imprints, Inc. Composition to reduce adhesion between a conformable region and a mold
US7939131B2 (en) * 2004-08-16 2011-05-10 Molecular Imprints, Inc. Method to provide a layer with uniform etch characteristics
US20060062922A1 (en) * 2004-09-23 2006-03-23 Molecular Imprints, Inc. Polymerization technique to attenuate oxygen inhibition of solidification of liquids and composition therefor
US8846195B2 (en) 2005-07-22 2014-09-30 Canon Nanotechnologies, Inc. Ultra-thin polymeric adhesion layer
US7759407B2 (en) * 2005-07-22 2010-07-20 Molecular Imprints, Inc. Composition for adhering materials together
US8808808B2 (en) * 2005-07-22 2014-08-19 Molecular Imprints, Inc. Method for imprint lithography utilizing an adhesion primer layer
US8142703B2 (en) * 2005-10-05 2012-03-27 Molecular Imprints, Inc. Imprint lithography method
US20080110557A1 (en) * 2006-11-15 2008-05-15 Molecular Imprints, Inc. Methods and Compositions for Providing Preferential Adhesion and Release of Adjacent Surfaces
GB0701909D0 (en) * 2007-01-31 2007-03-14 Imp Innovations Ltd Deposition Of Organic Layers
GB2453766A (en) * 2007-10-18 2009-04-22 Novalia Ltd Method of fabricating an electronic device
TWI495951B (zh) * 2007-12-04 2015-08-11 Molecular Imprints Inc 超薄聚合性黏著層
US9323143B2 (en) * 2008-02-05 2016-04-26 Canon Nanotechnologies, Inc. Controlling template surface composition in nano-imprint lithography
JP2010080680A (ja) * 2008-09-26 2010-04-08 Bridgestone Corp 凹凸パターンの形成方法及び凹凸パターンの製造装置
US8361546B2 (en) * 2008-10-30 2013-01-29 Molecular Imprints, Inc. Facilitating adhesion between substrate and patterned layer
US20100109195A1 (en) * 2008-11-05 2010-05-06 Molecular Imprints, Inc. Release agent partition control in imprint lithography
US8529778B2 (en) * 2008-11-13 2013-09-10 Molecular Imprints, Inc. Large area patterning of nano-sized shapes
US20110165412A1 (en) * 2009-11-24 2011-07-07 Molecular Imprints, Inc. Adhesion layers in nanoimprint lithograhy
US20120070572A1 (en) * 2010-09-08 2012-03-22 Molecular Imprints, Inc. Vapor Delivery System For Use in Imprint Lithography
JP5218521B2 (ja) 2010-10-21 2013-06-26 大日本印刷株式会社 インプリント方法とこれに用いる転写基材および密着剤
JP5767615B2 (ja) * 2011-10-07 2015-08-19 富士フイルム株式会社 インプリント用下層膜組成物およびこれを用いたパターン形成方法
WO2013051735A1 (en) * 2011-10-07 2013-04-11 Fujifilm Corporation Underlay film composition for imprints and method of forming pattern and pattern formation method using the same
DE102011086889A1 (de) * 2011-11-22 2013-05-23 Mtu Aero Engines Gmbh Generatives Herstellen eines Bauteils
JP5899145B2 (ja) * 2012-06-18 2016-04-06 富士フイルム株式会社 インプリント用下層膜形成組成物およびパターン形成方法
JP5827180B2 (ja) 2012-06-18 2015-12-02 富士フイルム株式会社 インプリント用硬化性組成物と基板の密着用組成物およびこれを用いた半導体デバイス
JP6029506B2 (ja) 2013-03-26 2016-11-24 富士フイルム株式会社 インプリント用下層膜形成組成物およびパターン形成方法
JP6047049B2 (ja) * 2013-03-27 2016-12-21 富士フイルム株式会社 組成物、硬化物、積層体、下層膜の製造方法、パターン形成方法、パターンおよび半導体レジストの製造方法
TWI656162B (zh) 2014-06-20 2019-04-11 日商富士軟片股份有限公司 下層膜形成用樹脂組成物、積層體、圖案形成方法及元件的製造方法
TWI635365B (zh) 2014-08-21 2018-09-11 日商富士軟片股份有限公司 Sublayer film forming composition, laminate, pattern forming method, imprint forming kit, and device manufacturing method
TWI632188B (zh) 2014-08-27 2018-08-11 日商富士軟片股份有限公司 底層膜形成用樹脂組成物、積層體、圖案形成方法、壓印形成用套組及元件的製造方法
WO2016048053A1 (ko) * 2014-09-26 2016-03-31 한국기계연구원 복수의 나노갭이 형성된 기판 및 이의 제조방법
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
KR102295988B1 (ko) 2014-10-17 2021-09-01 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 cmp 패드 구성
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10488753B2 (en) 2015-09-08 2019-11-26 Canon Kabushiki Kaisha Substrate pretreatment and etch uniformity in nanoimprint lithography
US20170068159A1 (en) * 2015-09-08 2017-03-09 Canon Kabushiki Kaisha Substrate pretreatment for reducing fill time in nanoimprint lithography
US20170066208A1 (en) 2015-09-08 2017-03-09 Canon Kabushiki Kaisha Substrate pretreatment for reducing fill time in nanoimprint lithography
JP6141500B2 (ja) * 2015-09-08 2017-06-07 キヤノン株式会社 ナノインプリントリソグラフィーにおける充填時間を短縮するための基板の前処理
US10618141B2 (en) 2015-10-30 2020-04-14 Applied Materials, Inc. Apparatus for forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10211051B2 (en) 2015-11-13 2019-02-19 Canon Kabushiki Kaisha Method of reverse tone patterning
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10829644B2 (en) 2016-03-31 2020-11-10 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
US10845700B2 (en) * 2016-03-31 2020-11-24 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
US10883006B2 (en) * 2016-03-31 2021-01-05 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
US10754244B2 (en) 2016-03-31 2020-08-25 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
US10095106B2 (en) 2016-03-31 2018-10-09 Canon Kabushiki Kaisha Removing substrate pretreatment compositions in nanoimprint lithography
US10134588B2 (en) 2016-03-31 2018-11-20 Canon Kabushiki Kaisha Imprint resist and substrate pretreatment for reducing fill time in nanoimprint lithography
US10578965B2 (en) * 2016-03-31 2020-03-03 Canon Kabushiki Kaisha Pattern forming method
US10620539B2 (en) 2016-03-31 2020-04-14 Canon Kabushiki Kaisha Curing substrate pretreatment compositions in nanoimprint lithography
US10189188B2 (en) 2016-05-20 2019-01-29 Canon Kabushiki Kaisha Nanoimprint lithography adhesion layer
US10509313B2 (en) 2016-06-28 2019-12-17 Canon Kabushiki Kaisha Imprint resist with fluorinated photoinitiator and substrate pretreatment for reducing fill time in nanoimprint lithography
TW201825617A (zh) 2016-09-16 2018-07-16 日商富士軟片股份有限公司 壓印用底漆層形成用組成物、壓印用底漆層及積層體
TW201817582A (zh) 2016-09-16 2018-05-16 日商富士軟片股份有限公司 圖案形成方法及半導體元件的製造方法
WO2018159576A1 (ja) * 2017-02-28 2018-09-07 富士フイルム株式会社 プライマ層形成用組成物、キット、プライマ層および積層体
JP6712673B2 (ja) * 2017-02-28 2020-06-24 富士フイルム株式会社 インプリント用密着膜形成用組成物、密着膜、積層体、硬化物パターンの製造方法および回路基板の製造方法
US10317793B2 (en) * 2017-03-03 2019-06-11 Canon Kabushiki Kaisha Substrate pretreatment compositions for nanoimprint lithography
WO2018232214A1 (en) * 2017-06-16 2018-12-20 Fujifilm Electronic Materials U.S.A., Inc. Multilayer structure
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7017623B2 (ja) * 2018-03-07 2022-02-08 富士フイルム株式会社 インプリント用下層膜形成組成物、インプリント用硬化性組成物、キット
JP7299970B2 (ja) 2018-09-04 2023-06-28 アプライド マテリアルズ インコーポレイテッド 改良型研磨パッドのための配合物
WO2020059603A1 (ja) * 2018-09-18 2020-03-26 富士フイルム株式会社 インプリント用積層体、インプリント用積層体の製造方法、パターン形成方法およびキット
US10780682B2 (en) * 2018-12-20 2020-09-22 Canon Kabushiki Kaisha Liquid adhesion composition, multi-layer structure and method of making said structure
JP7222811B2 (ja) * 2019-06-04 2023-02-15 キオクシア株式会社 インプリント装置、インプリント方法、及び半導体装置の製造方法
KR20230113640A (ko) 2020-12-22 2023-07-31 캐논 가부시끼가이샤 막 형성 방법 및 물품 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
EP4354488A1 (en) 2021-06-09 2024-04-17 Canon Kabushiki Kaisha Curable composition, film formation method, and article manufacturing method

Family Cites Families (230)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3810874A (en) * 1969-03-10 1974-05-14 Minnesota Mining & Mfg Polymers prepared from poly(perfluoro-alkylene oxide) compounds
US3919351A (en) 1973-08-29 1975-11-11 Ppg Industries Inc Composition useful in making extensible films
US4251277A (en) 1978-04-24 1981-02-17 Sws Silicones Corporation Compositions containing thiofunctional polysiloxanes
JPS573875A (en) 1980-06-11 1982-01-09 Tamura Kaken Kk Photopolymerizable ink composition
DE3023201A1 (de) 1980-06-21 1982-01-07 Hoechst Ag, 6000 Frankfurt Positiv arbeitendes strahlungsempfindliches gemisch
US4617238A (en) * 1982-04-01 1986-10-14 General Electric Company Vinyloxy-functional organopolysiloxane compositions
US4544572A (en) 1982-09-07 1985-10-01 Minnesota Mining And Manufacturing Company Coated ophthalmic lenses and method for coating the same
US4514439A (en) 1983-09-16 1985-04-30 Rohm And Haas Company Dust cover
US4512848A (en) 1984-02-06 1985-04-23 Exxon Research And Engineering Co. Procedure for fabrication of microstructures over large areas using physical replication
US4517337A (en) 1984-02-24 1985-05-14 General Electric Company Room temperature vulcanizable organopolysiloxane compositions and method for making
US4552833A (en) 1984-05-14 1985-11-12 International Business Machines Corporation Radiation sensitive and oxygen plasma developable resist
US4614667A (en) * 1984-05-21 1986-09-30 Minnesota Mining And Manufacturing Company Composite low surface energy liner of perfluoropolyether
EP0166363B1 (en) 1984-06-26 1991-08-07 Asahi Glass Company Ltd. Low reflectance transparent material having antisoiling properties
JPS61116358A (ja) 1984-11-09 1986-06-03 Mitsubishi Electric Corp フオトマスク材料
DE3760773D1 (en) * 1986-07-25 1989-11-16 Oki Electric Ind Co Ltd Negative resist material, method for its manufacture and method for using it
FR2604553A1 (fr) 1986-09-29 1988-04-01 Rhone Poulenc Chimie Substrat polymere rigide pour disque optique et les disques optiques obtenus a partir dudit substrat
US4931351A (en) * 1987-01-12 1990-06-05 Eastman Kodak Company Bilayer lithographic process
US4731155A (en) 1987-04-15 1988-03-15 General Electric Company Process for forming a lithographic mask
US4808511A (en) 1987-05-19 1989-02-28 International Business Machines Corporation Vapor phase photoresist silylation process
JPH01163027A (ja) 1987-12-21 1989-06-27 Matsushita Electric Ind Co Ltd 光学素子の成形方法およびその装置
US5028366A (en) 1988-01-12 1991-07-02 Air Products And Chemicals, Inc. Water based mold release compositions for making molded polyurethane foam
US5108875A (en) 1988-07-29 1992-04-28 Shipley Company Inc. Photoresist pattern fabrication employing chemically amplified metalized material
US5439766A (en) * 1988-12-30 1995-08-08 International Business Machines Corporation Composition for photo imaging
US5169494A (en) 1989-03-27 1992-12-08 Matsushita Electric Industrial Co., Ltd. Fine pattern forming method
JP3001607B2 (ja) 1989-04-24 2000-01-24 シーメンス、アクチエンゲゼルシヤフト 二層法における寸法安定な構造転写方法
US5028511A (en) * 1989-05-30 1991-07-02 E. I. Du Pont De Nemours And Company Process for preparing a precolored image using photosensitive reproduction element containing a photorelease layer
WO1991004151A1 (en) * 1989-09-14 1991-04-04 Avery International Corporation Tackified dual cure pressure-sensitive adhesive
US5139925A (en) * 1989-10-18 1992-08-18 Massachusetts Institute Of Technology Surface barrier silylation of novolak film without photoactive additive patterned with 193 nm excimer laser
US5204381A (en) 1990-02-13 1993-04-20 The United States Of America As Represented By The United States Department Of Energy Hybrid sol-gel optical materials
US5149592A (en) 1990-05-09 1992-09-22 Avery Dennison Corporation Ultraviolet radiation curable clearcoat
JP2586692B2 (ja) * 1990-05-24 1997-03-05 松下電器産業株式会社 パターン形成材料およびパターン形成方法
JP2524436B2 (ja) 1990-09-18 1996-08-14 インターナショナル・ビジネス・マシーンズ・コーポレイション 表面処理方法
US6174931B1 (en) * 1991-02-28 2001-01-16 3M Innovative Properties Company Multi-stage irradiation process for production of acrylic based compositions and compositions made thereby
EP0513690B1 (en) 1991-05-17 1997-02-26 Asahi Glass Company Ltd. Surface-treated substrate
US5206983A (en) * 1991-06-24 1993-05-04 Wisconsin Alumni Research Foundation Method of manufacturing micromechanical devices
US5242711A (en) * 1991-08-16 1993-09-07 Rockwell International Corp. Nucleation control of diamond films by microlithographic patterning
US5458953A (en) * 1991-09-12 1995-10-17 Mannington Mills, Inc. Resilient floor covering and method of making same
DE4228853C2 (de) * 1991-09-18 1993-10-21 Schott Glaswerke Optischer Wellenleiter mit einem planaren oder nur geringfügig gewölbten Substrat und Verfahren zu dessen Herstellung sowie Verwendung eines solchen
JPH0580530A (ja) 1991-09-24 1993-04-02 Hitachi Ltd 薄膜パターン製造方法
US5331020A (en) * 1991-11-14 1994-07-19 Dow Corning Limited Organosilicon compounds and compositions containing them
US5545367A (en) * 1992-04-15 1996-08-13 Soane Technologies, Inc. Rapid prototype three dimensional stereolithography
FR2693727B1 (fr) * 1992-07-20 1994-08-19 Ceramiques Tech Soc D Polycondensat organo-minéral et procédé d'obtention.
US5298556A (en) * 1992-07-21 1994-03-29 Tse Industries, Inc. Mold release composition and method coating a mold core
US5601641A (en) 1992-07-21 1997-02-11 Tse Industries, Inc. Mold release composition with polybutadiene and method of coating a mold core
GB9220986D0 (en) 1992-10-06 1992-11-18 Ciba Geigy Ag Chemical composition
DE4234423C2 (de) 1992-10-13 1996-10-10 Inst Mikrotechnik Mainz Gmbh Mit einem Resist beschichtete Metall- oder Halbleitersubstrate und Verfahren zur Erzielung einer stabilen Resist-Substrat-Haftung
US5432700A (en) * 1992-12-21 1995-07-11 Ford Motor Company Adaptive active vehicle suspension system
US5368942A (en) * 1993-01-15 1994-11-29 The United States Of America As Represented By The Secreatary Of Commerce Method of adhering substrates
DE69405451T2 (de) 1993-03-16 1998-03-12 Koninkl Philips Electronics Nv Verfahren und Vorrichtung zur Herstellung eines strukturierten Reliefbildes aus vernetztem Photoresist auf einer flachen Substratoberfläche
US5482768A (en) 1993-05-14 1996-01-09 Asahi Glass Company Ltd. Surface-treated substrate and process for its production
US5594042A (en) * 1993-05-18 1997-01-14 Dow Corning Corporation Radiation curable compositions containing vinyl ether functional polyorganosiloxanes
US5861467A (en) * 1993-05-18 1999-01-19 Dow Corning Corporation Radiation curable siloxane compositions containing vinyl ether functionality and methods for their preparation
US5380474A (en) 1993-05-20 1995-01-10 Sandia Corporation Methods for patterned deposition on a substrate
US5389696A (en) 1993-09-17 1995-02-14 Miles Inc. Process for the production of molded products using internal mold release agents
US5512131A (en) 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US5776748A (en) 1993-10-04 1998-07-07 President And Fellows Of Harvard College Method of formation of microstamped patterns on plates for adhesion of cells and other biological materials, devices and uses therefor
US6776094B1 (en) 1993-10-04 2004-08-17 President & Fellows Of Harvard College Kit For Microcontact Printing
US5462700A (en) * 1993-11-08 1995-10-31 Alliedsignal Inc. Process for making an array of tapered photopolymerized waveguides
US5417802A (en) 1994-03-18 1995-05-23 At&T Corp. Integrated circuit manufacturing
US5837314A (en) * 1994-06-10 1998-11-17 Johnson & Johnson Vision Products, Inc. Method and apparatus for applying a surfactant to mold surfaces
US5542978A (en) * 1994-06-10 1996-08-06 Johnson & Johnson Vision Products, Inc. Apparatus for applying a surfactant to mold surfaces
US5578683A (en) * 1994-06-27 1996-11-26 Avery Dennison Corporation Crosslinkable graft pressure-sensitive adhesives
US5523878A (en) 1994-06-30 1996-06-04 Texas Instruments Incorporated Self-assembled monolayer coating for micro-mechanical devices
FR2721939B1 (fr) 1994-06-30 1997-01-03 Atochem Elf Sa Materieau d'emballage comprenant une couche d'oxyde de silicum et une couche de polyolefine
US5459198A (en) * 1994-07-29 1995-10-17 E. I. Du Pont De Nemours And Company Fluoroinfused composites, articles of manufacture formed therefrom, and processes for the preparation thereof
JP3278306B2 (ja) * 1994-10-31 2002-04-30 富士写真フイルム株式会社 ポジ型フォトレジスト組成物
US5550196A (en) 1994-11-09 1996-08-27 Shell Oil Company Low viscosity adhesive compositions containing asymmetric radial polymers
US5868966A (en) 1995-03-30 1999-02-09 Drexel University Electroactive inorganic organic hybrid materials
US5849209A (en) 1995-03-31 1998-12-15 Johnson & Johnson Vision Products, Inc. Mold material made with additives
US5820769A (en) 1995-05-24 1998-10-13 Regents Of The University Of Minnesota Method for making magnetic storage having discrete elements with quantized magnetic moments
WO1997007429A1 (en) * 1995-08-18 1997-02-27 President And Fellows Of Harvard College Self-assembled monolayer directed patterning of surfaces
US5849222A (en) 1995-09-29 1998-12-15 Johnson & Johnson Vision Products, Inc. Method for reducing lens hole defects in production of contact lens blanks
US6468642B1 (en) * 1995-10-03 2002-10-22 N.V. Bekaert S.A. Fluorine-doped diamond-like coatings
US5772905A (en) 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US20040036201A1 (en) 2000-07-18 2004-02-26 Princeton University Methods and apparatus of field-induced pressure imprint lithography
US6309580B1 (en) 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US20040137734A1 (en) * 1995-11-15 2004-07-15 Princeton University Compositions and processes for nanoimprinting
US7758794B2 (en) 2001-10-29 2010-07-20 Princeton University Method of making an article comprising nanoscale patterns with reduced edge roughness
US6518189B1 (en) 1995-11-15 2003-02-11 Regents Of The University Of Minnesota Method and apparatus for high density nanostructures
US6482742B1 (en) 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
US5684066A (en) 1995-12-04 1997-11-04 H.B. Fuller Licensing & Financing, Inc. Protective coatings having enhanced properties
JP2978435B2 (ja) 1996-01-24 1999-11-15 チッソ株式会社 アクリロキシプロピルシランの製造方法
US5942302A (en) 1996-02-23 1999-08-24 Imation Corp. Polymer layer for optical media
US5669303A (en) 1996-03-04 1997-09-23 Motorola Apparatus and method for stamping a surface
US5725788A (en) * 1996-03-04 1998-03-10 Motorola Apparatus and method for patterning a surface
US6355198B1 (en) 1996-03-15 2002-03-12 President And Fellows Of Harvard College Method of forming articles including waveguides via capillary micromolding and microtransfer molding
BR9708357A (pt) 1996-03-27 1999-08-03 Novartis Ag Processo para produção de um polímero poroso a partir de uma mistura
CN1214708A (zh) 1996-03-27 1999-04-21 诺瓦提斯公司 使用成孔材料制造多孔聚合物的方法
AU716787B2 (en) 1996-03-27 2000-03-09 Biocure, Inc. High water content porous polymer
JP2000508084A (ja) * 1996-03-28 2000-06-27 ミネソタ マイニング アンド マニュファクチャリング カンパニー 有機光受容体のためのペルフルオロエーテル剥離塗料
JP3715021B2 (ja) * 1996-04-09 2005-11-09 Jsr株式会社 液状硬化性樹脂組成物
US5888650A (en) 1996-06-03 1999-03-30 Minnesota Mining And Manufacturing Company Temperature-responsive adhesive article
US6204343B1 (en) * 1996-12-11 2001-03-20 3M Innovative Properties Company Room temperature curable resin
US5895263A (en) * 1996-12-19 1999-04-20 International Business Machines Corporation Process for manufacture of integrated circuit device
US5792821A (en) 1997-01-06 1998-08-11 American Dental Association Health Foundation Polymerizable cyclodextrin derivatives
US6667082B2 (en) 1997-01-21 2003-12-23 Cryovac, Inc. Additive transfer film suitable for cook-in end use
US6495624B1 (en) 1997-02-03 2002-12-17 Cytonix Corporation Hydrophobic coating compositions, articles coated with said compositions, and processes for manufacturing same
US6156389A (en) 1997-02-03 2000-12-05 Cytonix Corporation Hydrophobic coating compositions, articles coated with said compositions, and processes for manufacturing same
US6335149B1 (en) 1997-04-08 2002-01-01 Corning Incorporated High performance acrylate materials for optical interconnects
US5948470A (en) 1997-04-28 1999-09-07 Harrison; Christopher Method of nanoscale patterning and products made thereby
US6174932B1 (en) 1998-05-20 2001-01-16 Denovus Llc Curable sealant composition
US6132632A (en) * 1997-09-11 2000-10-17 International Business Machines Corporation Method and apparatus for achieving etch rate uniformity in a reactive ion etcher
US6475704B1 (en) 1997-09-12 2002-11-05 Canon Kabushiki Kaisha Method for forming fine structure
US6117708A (en) * 1998-02-05 2000-09-12 Micron Technology, Inc. Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device
US6114404A (en) 1998-03-23 2000-09-05 Corning Incorporated Radiation curable ink compositions and flat panel color filters made using same
WO1999053381A1 (en) * 1998-04-15 1999-10-21 Etec Systems, Inc. Photoresist developer and method of development
JP3780700B2 (ja) 1998-05-26 2006-05-31 セイコーエプソン株式会社 パターン形成方法、パターン形成装置、パターン形成用版、パターン形成用版の製造方法、カラーフィルタの製造方法、導電膜の製造方法及び液晶パネルの製造方法
DE19828969A1 (de) 1998-06-29 1999-12-30 Siemens Ag Verfahren zur Herstellung von Halbleiterbauelementen
KR100273172B1 (ko) 1998-08-01 2001-03-02 윤덕용 아크릴 측쇄에 디옥사스피로환기 유도체를 갖는 화합물을 이용한 포토레지스트
US6523803B1 (en) * 1998-09-03 2003-02-25 Micron Technology, Inc. Mold apparatus used during semiconductor device fabrication
TWI230712B (en) 1998-09-15 2005-04-11 Novartis Ag Polymers
US6713238B1 (en) 1998-10-09 2004-03-30 Stephen Y. Chou Microscale patterning and articles formed thereby
US6261469B1 (en) * 1998-10-13 2001-07-17 Honeywell International Inc. Three dimensionally periodic structural assemblies on nanometer and longer scales
US6218316B1 (en) 1998-10-22 2001-04-17 Micron Technology, Inc. Planarization of non-planar surfaces in device fabrication
US6238798B1 (en) 1999-02-22 2001-05-29 3M Innovative Properties Company Ceramer composition and composite comprising free radically curable fluorochemical component
US6334960B1 (en) * 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
US6342097B1 (en) 1999-04-23 2002-01-29 Sdc Coatings, Inc. Composition for providing an abrasion resistant coating on a substrate with a matched refractive index and controlled tintability
BR0012307A (pt) * 1999-06-11 2002-03-12 Bausch & Lomb Moldes para lente com revestimentos protetores para produção de lentes de contato e outros produtos oftálmicos
US6344105B1 (en) * 1999-06-30 2002-02-05 Lam Research Corporation Techniques for improving etch rate uniformity
US6190929B1 (en) * 1999-07-23 2001-02-20 Micron Technology, Inc. Methods of forming semiconductor devices and methods of forming field emission displays
US6723396B1 (en) * 1999-08-17 2004-04-20 Western Washington University Liquid crystal imprinting
AU7361200A (en) * 1999-09-10 2001-04-10 Nano-Tex, Llc Water-repellent and soil-resistant finish for textiles
US6517995B1 (en) 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
US6391217B2 (en) 1999-12-23 2002-05-21 University Of Massachusetts Methods and apparatus for forming submicron patterns on films
DE10008109A1 (de) 2000-02-22 2001-08-23 Krauss Maffei Kunststofftech Verfahren und Vorrichtung zum Herstellen einer DVD
US6696157B1 (en) 2000-03-05 2004-02-24 3M Innovative Properties Company Diamond-like glass thin films
US6756165B2 (en) 2000-04-25 2004-06-29 Jsr Corporation Radiation sensitive resin composition for forming barrier ribs for an EL display element, barrier rib and EL display element
US6774183B1 (en) * 2000-04-27 2004-08-10 Bostik, Inc. Copolyesters having improved retained adhesion
US6262464B1 (en) * 2000-06-19 2001-07-17 International Business Machines Corporation Encapsulated MEMS brand-pass filter for integrated circuits
KR100827741B1 (ko) * 2000-07-17 2008-05-07 보드 오브 리전츠, 더 유니버시티 오브 텍사스 시스템 임프린트 리소그래피 공정을 위한 자동 유체 분배 방법 및시스템
US7635262B2 (en) 2000-07-18 2009-12-22 Princeton University Lithographic apparatus for fluid pressure imprint lithography
US7211214B2 (en) 2000-07-18 2007-05-01 Princeton University Laser assisted direct imprint lithography
US20050037143A1 (en) 2000-07-18 2005-02-17 Chou Stephen Y. Imprint lithography with improved monitoring and control and apparatus therefor
US6531407B1 (en) 2000-08-31 2003-03-11 Micron Technology, Inc. Method, structure and process flow to reduce line-line capacitance with low-K material
US6448301B1 (en) 2000-09-08 2002-09-10 3M Innovative Properties Company Crosslinkable polymeric compositions and use thereof
CN100365507C (zh) 2000-10-12 2008-01-30 德克萨斯州大学系统董事会 用于室温下低压微刻痕和毫微刻痕光刻的模板
US6503914B1 (en) * 2000-10-23 2003-01-07 Board Of Regents, The University Of Texas System Thienopyrimidine-based inhibitors of the Src family
KR20020047490A (ko) 2000-12-13 2002-06-22 윤종용 실리콘을 함유하는 감광성 폴리머 및 이를 포함하는레지스트 조성물
US6783719B2 (en) 2001-01-19 2004-08-31 Korry Electronics, Co. Mold with metal oxide surface compatible with ionic release agents
JP4176998B2 (ja) 2001-01-25 2008-11-05 積水化学工業株式会社 熱現像性感光材料、セラミックグリーンシート用スラリー及びセラミックグリーンシート
EP1369439B1 (en) 2001-01-25 2006-08-09 Sekisui Chemical Co., Ltd. Polyvinyl acetal, polyvinyl acetal composition, ink, coating material, dispersant, heat-developable photosensitive material, ceramic green sheet, primer for plastic lens, recording agent for water-based ink, and adhesive for metal foil
DE10103586A1 (de) 2001-01-26 2002-08-01 Roland Goebel Primer zur Bildung einer haftfesten und feuchtestabilen Legierungs-Kunststoff-Verbundschicht und Verfahren zu seiner Herstellung
JP2004524564A (ja) 2001-02-27 2004-08-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 新規ポリマー、ポリマー合成方法およびフォトレジスト組成物
US20020123592A1 (en) * 2001-03-02 2002-09-05 Zenastra Photonics Inc. Organic-inorganic hybrids surface adhesion promoter
US6387787B1 (en) 2001-03-02 2002-05-14 Motorola, Inc. Lithographic template and method of formation and use
US6664026B2 (en) 2001-03-22 2003-12-16 International Business Machines Corporation Method of manufacturing high aspect ratio photolithographic features
JP5201379B2 (ja) * 2001-03-26 2013-06-05 リケンテクノス株式会社 アンカーコート剤、易接着性基材フィルム及び積層フィルム
KR100442859B1 (ko) 2001-04-04 2004-08-02 삼성전자주식회사 실리콘을 함유하는 알킬 비닐 에테르의 중합체로이루어지는 감광성 폴리머 및 이를 포함하는 레지스트조성물
TWI225187B (en) * 2001-04-10 2004-12-11 Nissan Chemical Ind Ltd Composite for forming anti-reflective film in lithography
US7011932B2 (en) * 2001-05-01 2006-03-14 E. I. Du Pont De Nemours And Company Polymer waveguide fabrication process
US6541356B2 (en) * 2001-05-21 2003-04-01 International Business Machines Corporation Ultimate SIMOX
US6737489B2 (en) * 2001-05-21 2004-05-18 3M Innovative Properties Company Polymers containing perfluorovinyl ethers and applications for such polymers
US6736857B2 (en) * 2001-05-25 2004-05-18 3M Innovative Properties Company Method for imparting soil and stain resistance to carpet
US7141188B2 (en) 2001-05-30 2006-11-28 Honeywell International Inc. Organic compositions
US6610458B2 (en) * 2001-07-23 2003-08-26 Kodak Polychrome Graphics Llc Method and system for direct-to-press imaging
IL159865A0 (en) 2001-07-25 2004-06-20 Univ Princeton Nanochannel arrays and their preparation and use for high throughput macromolecular analysis
US20030054115A1 (en) * 2001-09-14 2003-03-20 Ralph Albano Ultraviolet curing process for porous low-K materials
US6721529B2 (en) * 2001-09-21 2004-04-13 Nexpress Solutions Llc Release agent donor member having fluorocarbon thermoplastic random copolymer overcoat
CN100347608C (zh) 2001-09-25 2007-11-07 米卢塔技术株式会社 利用毛细作用力在基体上形成微型图案的方法
US6790905B2 (en) * 2001-10-09 2004-09-14 E. I. Du Pont De Nemours And Company Highly repellent carpet protectants
US20030080472A1 (en) 2001-10-29 2003-05-01 Chou Stephen Y. Lithographic method with bonded release layer for molding small patterns
US6716767B2 (en) 2001-10-31 2004-04-06 Brewer Science, Inc. Contact planarization materials that generate no volatile byproducts or residue during curing
WO2003064495A2 (en) 2001-11-07 2003-08-07 Dow Global Technologies Inc. Planarized microelectronic substrates
US6649272B2 (en) 2001-11-08 2003-11-18 3M Innovative Properties Company Coating composition comprising fluorochemical polyether silane polycondensate and use thereof
US6605849B1 (en) * 2002-02-14 2003-08-12 Symmetricom, Inc. MEMS analog frequency divider
US7309560B2 (en) * 2002-02-19 2007-12-18 Nissan Chemical Industries, Ltd. Composition for forming anti-reflective coating
TWI339680B (en) 2002-02-19 2011-04-01 Kanto Kagaku Washing liquid composition for semiconductor substrate
US7455955B2 (en) 2002-02-27 2008-11-25 Brewer Science Inc. Planarization method for multi-layer lithography processing
JP2004002702A (ja) 2002-02-28 2004-01-08 Merck Patent Gmbh プレポリマー材料、ポリマー材料、インプリンティングプロセスおよびその使用
EP1342736B1 (en) 2002-02-28 2013-05-08 Merck Patent GmbH Prepolymer material, polymer material, imprinting process and their Use
DE10217151A1 (de) 2002-04-17 2003-10-30 Clariant Gmbh Nanoimprint-Resist
US7037639B2 (en) * 2002-05-01 2006-05-02 Molecular Imprints, Inc. Methods of manufacturing a lithography template
US6849558B2 (en) 2002-05-22 2005-02-01 The Board Of Trustees Of The Leland Stanford Junior University Replication and transfer of microstructures and nanostructures
US6720076B2 (en) * 2002-05-31 2004-04-13 Omnova Solutions Inc. In-mold primer coating for thermoplastic substrates
US20030235787A1 (en) 2002-06-24 2003-12-25 Watts Michael P.C. Low viscosity high resolution patterning material
US6932934B2 (en) 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US6900881B2 (en) 2002-07-11 2005-05-31 Molecular Imprints, Inc. Step and repeat imprint lithography systems
US6908861B2 (en) 2002-07-11 2005-06-21 Molecular Imprints, Inc. Method for imprint lithography using an electric field
US7077992B2 (en) * 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
WO2004009505A1 (en) 2002-07-23 2004-01-29 Shell Internationale Research Maatschappij B.V. Hydrophobic surface treatment composition and method of making and using same
US6916584B2 (en) * 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US6957608B1 (en) 2002-08-02 2005-10-25 Kovio, Inc. Contact print methods
DE10237280A1 (de) 2002-08-14 2004-03-11 Micronas Holding Gmbh Verfahren zum Verbinden von Oberflächen, Halbleiter mit verbundenen Oberflächen sowie Bio-Chip und Bio-Sensor
US6808745B2 (en) 2002-08-22 2004-10-26 Eastman Kodak Company Method of coating micro-electromechanical devices
US7754131B2 (en) 2002-08-27 2010-07-13 Obducat Ab Device for transferring a pattern to an object
US6936194B2 (en) * 2002-09-05 2005-08-30 Molecular Imprints, Inc. Functional patterning material for imprint lithography processes
US20040065252A1 (en) * 2002-10-04 2004-04-08 Sreenivasan Sidlgata V. Method of forming a layer on a substrate to facilitate fabrication of metrology standards
US8349241B2 (en) * 2002-10-04 2013-01-08 Molecular Imprints, Inc. Method to arrange features on a substrate to replicate features having minimal dimensional variability
DE60325629D1 (de) * 2002-10-21 2009-02-12 Nanoink Inc Verfahren zur herstellung von strukturen im nanometerbereich zur anwendung im bereich der maskenreparatur
US7750059B2 (en) 2002-12-04 2010-07-06 Hewlett-Packard Development Company, L.P. Polymer solution for nanoimprint lithography to reduce imprint temperature and pressure
US7241823B2 (en) 2002-12-11 2007-07-10 Shin-Etsu Chemical Co., Ltd. Radiation curing silicone rubber composition, adhesive silicone elastomer film formed from same, semiconductor device using same, and method of producing semiconductor device
US20040112862A1 (en) 2002-12-12 2004-06-17 Molecular Imprints, Inc. Planarization composition and method of patterning a substrate using the same
US7365103B2 (en) 2002-12-12 2008-04-29 Board Of Regents, The University Of Texas System Compositions for dark-field polymerization and method of using the same for imprint lithography processes
US7452574B2 (en) * 2003-02-27 2008-11-18 Molecular Imprints, Inc. Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer
US20040168613A1 (en) 2003-02-27 2004-09-02 Molecular Imprints, Inc. Composition and method to form a release layer
US6830819B2 (en) 2003-03-18 2004-12-14 Xerox Corporation Fluorosilicone release agent for fluoroelastomer fuser members
US7179396B2 (en) 2003-03-25 2007-02-20 Molecular Imprints, Inc. Positive tone bi-layer imprint lithography method
WO2004086471A1 (en) 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
US20040202865A1 (en) 2003-04-08 2004-10-14 Andrew Homola Release coating for stamper
US7396475B2 (en) 2003-04-25 2008-07-08 Molecular Imprints, Inc. Method of forming stepped structures employing imprint lithography
TWI228638B (en) 2003-06-10 2005-03-01 Ind Tech Res Inst Method for and apparatus for bonding patterned imprint to a substrate by adhering means
US20060108710A1 (en) * 2004-11-24 2006-05-25 Molecular Imprints, Inc. Method to reduce adhesion between a conformable region and a mold
US7157036B2 (en) 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
US7307118B2 (en) 2004-11-24 2007-12-11 Molecular Imprints, Inc. Composition to reduce adhesion between a conformable region and a mold
US20050160934A1 (en) 2004-01-23 2005-07-28 Molecular Imprints, Inc. Materials and methods for imprint lithography
JP2005014348A (ja) 2003-06-25 2005-01-20 Fuji Photo Film Co Ltd 平版印刷版原版及び平版印刷方法
US20050084804A1 (en) * 2003-10-16 2005-04-21 Molecular Imprints, Inc. Low surface energy templates
US7122482B2 (en) * 2003-10-27 2006-10-17 Molecular Imprints, Inc. Methods for fabricating patterned features utilizing imprint lithography
US20050098534A1 (en) 2003-11-12 2005-05-12 Molecular Imprints, Inc. Formation of conductive templates employing indium tin oxide
US6958531B2 (en) 2003-11-14 2005-10-25 The Regents Of The University Of Michigan Multi-substrate package and method for assembling same
DE60336322D1 (de) 2003-11-21 2011-04-21 Obducat Ab Nanoimprint Lithographie in Mehrschichtsystemem
US8076386B2 (en) 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
US7229732B2 (en) * 2004-08-04 2007-06-12 Xerox Corporation Imaging members with crosslinked polycarbonate in charge transport layer
JP4130668B2 (ja) * 2004-08-05 2008-08-06 富士通株式会社 基体の加工方法
SG119379A1 (en) * 2004-08-06 2006-02-28 Nippon Catalytic Chem Ind Resin composition method of its composition and cured formulation
US7309225B2 (en) 2004-08-13 2007-12-18 Molecular Imprints, Inc. Moat system for an imprint lithography template
US7939131B2 (en) * 2004-08-16 2011-05-10 Molecular Imprints, Inc. Method to provide a layer with uniform etch characteristics
US7252862B2 (en) 2004-08-30 2007-08-07 Hewlett-Packard Development Company, L.P. Increasing adhesion in an imprinting procedure
US20060062922A1 (en) * 2004-09-23 2006-03-23 Molecular Imprints, Inc. Polymerization technique to attenuate oxygen inhibition of solidification of liquids and composition therefor
US20060081557A1 (en) * 2004-10-18 2006-04-20 Molecular Imprints, Inc. Low-k dielectric functional imprinting materials
US7163888B2 (en) 2004-11-22 2007-01-16 Motorola, Inc. Direct imprinting of etch barriers using step and flash imprint lithography
US20060145398A1 (en) * 2004-12-30 2006-07-06 Board Of Regents, The University Of Texas System Release layer comprising diamond-like carbon (DLC) or doped DLC with tunable composition for imprint lithography templates and contact masks
US20070059211A1 (en) * 2005-03-11 2007-03-15 The College Of Wooster TNT sensor containing molecularly imprinted sol gel-derived films
US8808808B2 (en) 2005-07-22 2014-08-19 Molecular Imprints, Inc. Method for imprint lithography utilizing an adhesion primer layer
US8846195B2 (en) * 2005-07-22 2014-09-30 Canon Nanotechnologies, Inc. Ultra-thin polymeric adhesion layer
US7759407B2 (en) * 2005-07-22 2010-07-20 Molecular Imprints, Inc. Composition for adhering materials together
US20070042173A1 (en) * 2005-08-22 2007-02-22 Fuji Photo Film Co., Ltd. Antireflection film, manufacturing method thereof, and polarizing plate using the same, and image display device
US7419611B2 (en) 2005-09-02 2008-09-02 International Business Machines Corporation Processes and materials for step and flash imprint lithography
US20080110557A1 (en) 2006-11-15 2008-05-15 Molecular Imprints, Inc. Methods and Compositions for Providing Preferential Adhesion and Release of Adjacent Surfaces

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