JP2009218368A5 - - Google Patents

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Publication number
JP2009218368A5
JP2009218368A5 JP2008060140A JP2008060140A JP2009218368A5 JP 2009218368 A5 JP2009218368 A5 JP 2009218368A5 JP 2008060140 A JP2008060140 A JP 2008060140A JP 2008060140 A JP2008060140 A JP 2008060140A JP 2009218368 A5 JP2009218368 A5 JP 2009218368A5
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JP
Japan
Prior art keywords
copper
surface treatment
treatment method
mol
wiring board
Prior art date
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Application number
JP2008060140A
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English (en)
Japanese (ja)
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JP2009218368A (ja
JP4870699B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2008060140A external-priority patent/JP4870699B2/ja
Priority to JP2008060140A priority Critical patent/JP4870699B2/ja
Priority to TW098104922A priority patent/TW201004517A/zh
Priority to CN2009801082006A priority patent/CN101965760A/zh
Priority to US12/921,656 priority patent/US20110036493A1/en
Priority to PCT/JP2009/053411 priority patent/WO2009113396A1/ja
Priority to KR1020107020269A priority patent/KR20100124287A/ko
Publication of JP2009218368A publication Critical patent/JP2009218368A/ja
Publication of JP2009218368A5 publication Critical patent/JP2009218368A5/ja
Publication of JP4870699B2 publication Critical patent/JP4870699B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008060140A 2008-03-10 2008-03-10 銅の表面処理方法およびプリント配線板の表面処理方法 Expired - Fee Related JP4870699B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008060140A JP4870699B2 (ja) 2008-03-10 2008-03-10 銅の表面処理方法およびプリント配線板の表面処理方法
TW098104922A TW201004517A (en) 2008-03-10 2009-02-17 Method of treating surface of copper and method of treating surface of printed wiring board
PCT/JP2009/053411 WO2009113396A1 (ja) 2008-03-10 2009-02-25 銅の表面処理方法およびプリント配線板の表面処理方法
US12/921,656 US20110036493A1 (en) 2008-03-10 2009-02-25 Surface treatment method for copper and surface treatment method for printed wiring board
CN2009801082006A CN101965760A (zh) 2008-03-10 2009-02-25 铜的表面处理方法及印刷配线板的表面处理方法
KR1020107020269A KR20100124287A (ko) 2008-03-10 2009-02-25 구리의 표면처리방법 및 프린트 배선판의 표면처리방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008060140A JP4870699B2 (ja) 2008-03-10 2008-03-10 銅の表面処理方法およびプリント配線板の表面処理方法

Publications (3)

Publication Number Publication Date
JP2009218368A JP2009218368A (ja) 2009-09-24
JP2009218368A5 true JP2009218368A5 (enExample) 2010-11-04
JP4870699B2 JP4870699B2 (ja) 2012-02-08

Family

ID=41065065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008060140A Expired - Fee Related JP4870699B2 (ja) 2008-03-10 2008-03-10 銅の表面処理方法およびプリント配線板の表面処理方法

Country Status (6)

Country Link
US (1) US20110036493A1 (enExample)
JP (1) JP4870699B2 (enExample)
KR (1) KR20100124287A (enExample)
CN (1) CN101965760A (enExample)
TW (1) TW201004517A (enExample)
WO (1) WO2009113396A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101354386B1 (ko) 2010-12-07 2014-01-23 엘지디스플레이 주식회사 액정표시장치
GB2489974B (en) 2011-04-14 2015-10-21 Conductive Inkjet Tech Ltd Improvements in and relating to transparent components
JP5750686B2 (ja) * 2011-10-14 2015-07-22 メック株式会社 プリント配線板の製造方法及びこれに用いる表面処理剤
US20130256143A1 (en) * 2012-03-30 2013-10-03 GM Global Technology Operations LLC Anodized inserts for coulomb damping or frictional damping
US9202639B2 (en) 2012-08-17 2015-12-01 Nokia Technologies Oy Apparatus and associated methods
CN105256359A (zh) * 2015-11-27 2016-01-20 中国船舶重工集团公司第七二五研究所 一种铜合金钝化液及钝化层制备方法
CN112601473B (zh) 2018-09-06 2023-02-03 Ykk株式会社 紧固件部件
US11078589B2 (en) * 2019-08-28 2021-08-03 Saudi Arabian Oil Company Hydrophobic stainless-steel copper-coated mesh and method of synthesizing same
US20220342126A1 (en) * 2019-09-03 2022-10-27 3M Innovative Properties Company Optical films and methods of manufacturing such optical films
CN110923797A (zh) * 2019-11-08 2020-03-27 东莞市国瓷新材料科技有限公司 利用电解清洗、清洁改善dpc电镀填孔均匀性的工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1417413A (en) * 1920-06-30 1922-05-23 Sestron Foreign Patents Ltd Coloration of metallic surfaces
JPH05259611A (ja) * 1992-03-12 1993-10-08 Hitachi Chem Co Ltd プリント配線板の製造法
JP3229701B2 (ja) * 1993-03-09 2001-11-19 臼井国際産業株式会社 銅素材表面における電気絶縁層の形成方法
JP3486543B2 (ja) * 1997-11-12 2004-01-13 キヤノン株式会社 酸化第１銅膜の堆積法及び該酸化第１銅膜堆積法を用いた半導体デバイスの製造方法
PL192904B1 (pl) * 1999-09-29 2006-12-29 Europa Metalli Spa Elektrochemiczny sposób wytwarzania nieorganicznej warstwy powłokowej na powierzchni elementu z miedzi lub ze stopu na bazie miedzi oraz wyrób miedziany
JP2002060967A (ja) * 2000-08-23 2002-02-28 Mec Kk 銅または銅合金の表面処理法
JP3968433B2 (ja) * 2003-03-27 2007-08-29 独立行政法人物質・材料研究機構 低反射材料とその作製方法
JP3883543B2 (ja) * 2003-04-16 2007-02-21 新光電気工業株式会社 導体基材及び半導体装置
TW200541434A (en) * 2004-04-30 2005-12-16 Hitachi Via Mechanics Ltd Printed circuit board and method for processing printed circuit board and method for manufacturing printed circuit board

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