JP4881916B2 - 表面粗化剤 - Google Patents
表面粗化剤 Download PDFInfo
- Publication number
- JP4881916B2 JP4881916B2 JP2008153066A JP2008153066A JP4881916B2 JP 4881916 B2 JP4881916 B2 JP 4881916B2 JP 2008153066 A JP2008153066 A JP 2008153066A JP 2008153066 A JP2008153066 A JP 2008153066A JP 4881916 B2 JP4881916 B2 JP 4881916B2
- Authority
- JP
- Japan
- Prior art keywords
- surface roughening
- acid
- aminotetrazole
- copper
- roughening agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007788 roughening Methods 0.000 title claims description 69
- 239000003795 chemical substances by application Substances 0.000 claims description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 50
- 229910052802 copper Inorganic materials 0.000 claims description 49
- 239000010949 copper Substances 0.000 claims description 49
- -1 tetrazole compounds Chemical class 0.000 claims description 27
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 26
- 229910045601 alloy Inorganic materials 0.000 claims description 22
- 239000000956 alloy Substances 0.000 claims description 22
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 claims description 20
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 18
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 14
- 239000002738 chelating agent Substances 0.000 claims description 14
- 239000002253 acid Substances 0.000 claims description 7
- HWHNFJYQDMSYAF-UHFFFAOYSA-N 1,5-dimethyltetrazole Chemical compound CC1=NN=NN1C HWHNFJYQDMSYAF-UHFFFAOYSA-N 0.000 claims description 3
- ULIDRMKBVYYVIQ-UHFFFAOYSA-N 1-phenyltetrazol-5-amine Chemical compound NC1=NN=NN1C1=CC=CC=C1 ULIDRMKBVYYVIQ-UHFFFAOYSA-N 0.000 claims description 3
- SZHQPBJEOCHCKM-UHFFFAOYSA-N 2-phosphonobutane-1,2,4-tricarboxylic acid Chemical compound OC(=O)CCC(P(O)(O)=O)(C(O)=O)CC(O)=O SZHQPBJEOCHCKM-UHFFFAOYSA-N 0.000 claims description 3
- ZHCLIFKUVIFYBY-UHFFFAOYSA-N 2h-tetrazol-5-ylmethanamine Chemical compound NCC1=NN=NN1 ZHCLIFKUVIFYBY-UHFFFAOYSA-N 0.000 claims description 3
- KYRMPMCAOPMOIR-UHFFFAOYSA-N 5-ethyl-2h-tetrazole Chemical compound CCC=1N=NNN=1 KYRMPMCAOPMOIR-UHFFFAOYSA-N 0.000 claims description 3
- XZGLNCKSNVGDNX-UHFFFAOYSA-N 5-methyl-2h-tetrazole Chemical compound CC=1N=NNN=1 XZGLNCKSNVGDNX-UHFFFAOYSA-N 0.000 claims description 3
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims description 3
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 claims description 3
- 150000003536 tetrazoles Chemical class 0.000 claims description 3
- GTKOKCQMHAGFSM-UHFFFAOYSA-N 1-methyltetrazol-5-amine Chemical compound CN1N=NN=C1N GTKOKCQMHAGFSM-UHFFFAOYSA-N 0.000 claims description 2
- MTBUOESFHRORQT-UHFFFAOYSA-N 5-(2-methylphenyl)-2h-tetrazole Chemical compound CC1=CC=CC=C1C1=NNN=N1 MTBUOESFHRORQT-UHFFFAOYSA-N 0.000 claims description 2
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 claims description 2
- JAHCQVVOKAFXQU-UHFFFAOYSA-N 5-propyl-2h-tetrazole Chemical compound CCCC=1N=NNN=1 JAHCQVVOKAFXQU-UHFFFAOYSA-N 0.000 claims description 2
- 229940120146 EDTMP Drugs 0.000 claims description 2
- KIDJHPQACZGFTI-UHFFFAOYSA-N [6-[bis(phosphonomethyl)amino]hexyl-(phosphonomethyl)amino]methylphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCCCCCN(CP(O)(O)=O)CP(O)(O)=O KIDJHPQACZGFTI-UHFFFAOYSA-N 0.000 claims description 2
- ZYHQGITXIJDDKC-UHFFFAOYSA-N 2-[2-(2-aminophenyl)ethyl]aniline Chemical group NC1=CC=CC=C1CCC1=CC=CC=C1N ZYHQGITXIJDDKC-UHFFFAOYSA-N 0.000 claims 1
- 229910021645 metal ion Inorganic materials 0.000 claims 1
- 238000005530 etching Methods 0.000 description 18
- 229920005989 resin Polymers 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- 239000000758 substrate Substances 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 15
- 239000002390 adhesive tape Substances 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 12
- 229910000881 Cu alloy Inorganic materials 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- 230000003078 antioxidant effect Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000007522 mineralic acids Chemical class 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229940126062 Compound A Drugs 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000003851 azoles Chemical class 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000012756 surface treatment agent Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 150000003852 triazoles Chemical class 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- GUCGQKSPWMDAEX-UHFFFAOYSA-N 2-(2h-tetrazol-5-yl)aniline Chemical compound NC1=CC=CC=C1C1=NNN=N1 GUCGQKSPWMDAEX-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000008378 aryl ethers Chemical class 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229940090960 diethylenetriamine pentamethylene phosphonic acid Drugs 0.000 description 1
- DUYCTCQXNHFCSJ-UHFFFAOYSA-N dtpmp Chemical compound OP(=O)(O)CN(CP(O)(O)=O)CCN(CP(O)(=O)O)CCN(CP(O)(O)=O)CP(O)(O)=O DUYCTCQXNHFCSJ-UHFFFAOYSA-N 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000004715 keto acids Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
ガラスエポキシ基材〔日立化成工業(株)製、品番:GEA−67N、厚さ:1.6mm〕の両面に、厚さ18μmの銅箔が貼付された両面銅張積層板を用意し、この両面にさらにめっき層の厚さが20μmとなるように電解銅めっきを施し、縦8.5cm、横11.0cmに切断したものを試験基板とした。
各試験基板をJIS K5600−5−6に従って、1mm×1mmの碁盤目にクロスカットし、10重量%塩酸水溶液に室温で10分間浸漬し、水洗し、乾燥し、JIS K5600−5−6に従って、テープピールテストを行ない、以下の評価基準に基づいて、密着性を評価した。その結果を表1に示す。
A:粘着テープにソルダーレジスト膜がまったく付着しなかったもの
B:粘着テープにソルダーレジスト膜がわずかに付着したもの
C:粘着テープにソルダーレジスト膜が多量に付着したもの
表1に示す組成からなる表面粗化剤を用いてエッチング量0.5μmでガラスエポキシ基材をエッチングした後の各試験基板を40℃、相対湿度95%の恒温槽に入れ、30分間経過した後の表面を金属顕微鏡で観察し、以下の評価基準に基づいて評価した。
A:色の変化がほとんどないもの(酸化していない)
B:部分的に薄い茶色に変化していたもの(部分的に酸化している)
C:全面的に茶色に変化しているもの(全面的に酸化が進んでいる)
Claims (10)
- 銅又はその合金からなる表面を粗化するための表面粗化剤であって、硫酸、過酸化水素、5−アミノテトラゾール、5−アミノテトラゾール以外のテトラゾール化合物、及びホスホン酸系キレート剤を含有することを特徴とする表面粗化剤。
- 5−アミノテトラゾール以外のテトラゾール化合物が、5−メチルテトラゾール、5−エチルテトラゾール、5−n−プロピルテトラゾール、5−フェニルテトラゾール、5−トルイルテトラゾール、5−アミノメチルテトラゾール、5−(2−アミノフェニル)テトラゾール、5−アミノ−1−メチルテトラゾール、1−フェニル−5−アミノテトラゾール、1,5−ジメチルテトラゾール及びビステトラゾールジアンモニウムからなる群より選ばれた少なくとも1種のテトラゾール化合物である請求項1に記載の表面粗化剤。
- ホスホン酸系キレート剤が、アミノトリメチレンホスホン酸、1−ヒドロキシエタン−1,1−ジホスホン酸、ホスホノブタントリカルボン酸、エチレンジアミンテトラメチレンホスホン酸ナトリウム塩、ヘキサメチレンジアミンテトラメチレンホスホン酸、ジエチレントリアミンペンタメチレンホスホン酸、ポリアミノメチレンホスホン酸及びビスヘキサメチレントリアミンペンタメチレンホスホン酸からなる群より選ばれた少なくとも1種のホスホン酸系キレート剤である請求項1又は2に記載の表面粗化剤。
- 硫酸の濃度が、3〜20重量%である請求項1〜3のいずれかに記載の表面粗化剤。
- 過酸化水素の濃度が、2〜10重量%である請求項1〜4のいずれかに記載の表面粗化剤。
- 5−アミノテトラゾールの濃度が、0.01〜1.0重量%である請求項1〜5のいずれかに記載の表面粗化剤。
- 5−アミノテトラゾール以外のテトラゾール化合物の濃度が、0.003〜0.3重量%である請求項1〜6のいずれかに記載の表面粗化剤。
- 5−アミノテトラゾールと5−アミノテトラゾール以外のテトラゾール化合物との濃度の比(5−アミノテトラゾール:5−アミノテトラゾール以外のテトラゾール化合物)が、1:1〜5:1(重量比)である請求項1〜7のいずれかに記載の表面粗化剤。
- ホスホン酸系キレート剤の濃度が、0.05〜2.0重量%である請求項1〜8のいずれかに記載の表面粗化剤。
- 銅よりも電位が貴である金属イオンを含有しない請求項1〜9のいずれかに記載の表面粗化剤。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008153066A JP4881916B2 (ja) | 2007-06-14 | 2008-06-11 | 表面粗化剤 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007157734 | 2007-06-14 | ||
JP2007157734 | 2007-06-14 | ||
JP2008153066A JP4881916B2 (ja) | 2007-06-14 | 2008-06-11 | 表面粗化剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009019270A JP2009019270A (ja) | 2009-01-29 |
JP4881916B2 true JP4881916B2 (ja) | 2012-02-22 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008153066A Active JP4881916B2 (ja) | 2007-06-14 | 2008-06-11 | 表面粗化剤 |
Country Status (1)
Country | Link |
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JP (1) | JP4881916B2 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6101421B2 (ja) | 2010-08-16 | 2017-03-22 | インテグリス・インコーポレーテッド | 銅または銅合金用エッチング液 |
US8524540B2 (en) | 2011-02-01 | 2013-09-03 | Nilesh Kapadia | Adhesion promoting composition for metal leadframes |
JP6120147B2 (ja) * | 2012-06-29 | 2017-04-26 | 三菱瓦斯化学株式会社 | エッチング用液体組成物およびそれを用いた多層プリント配線板の製造方法 |
TWI606760B (zh) * | 2013-04-23 | 2017-11-21 | Mitsubishi Gas Chemical Co | Circuit board processing method and printed circuit board manufactured by the method |
JP6464578B2 (ja) | 2013-08-01 | 2019-02-06 | 三菱瓦斯化学株式会社 | プリント配線板の製造方法 |
JP6180298B2 (ja) * | 2013-11-27 | 2017-08-16 | 株式会社Adeka | エッチング液組成物及びエッチング方法 |
CN105648453B (zh) * | 2016-01-25 | 2018-03-06 | 奥士康科技股份有限公司 | 一种pcb板上去钯液的清洗方法 |
JP6354086B1 (ja) * | 2017-01-21 | 2018-07-11 | メック株式会社 | 被膜形成用組成物、表面処理金属部材の製造方法、および金属‐樹脂複合体の製造方法 |
JP2018184624A (ja) * | 2017-04-24 | 2018-11-22 | 三洋化成工業株式会社 | 銅又は銅合金用エッチング液 |
JP7032239B2 (ja) * | 2018-05-28 | 2022-03-08 | 古河電気工業株式会社 | リードフレーム材およびその製造方法ならびに半導体パッケージ |
CN111334800B (zh) * | 2020-04-24 | 2022-04-29 | 信丰正天伟电子科技有限公司 | Pcb微蚀液及其制备方法 |
Family Cites Families (2)
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JP2000282265A (ja) * | 1999-03-31 | 2000-10-10 | Mec Kk | 銅または銅合金のマイクロエッチング剤およびそれを用いる表面処理法 |
JP3930885B2 (ja) * | 2000-12-27 | 2007-06-13 | 荏原ユージライト株式会社 | 銅および銅合金用のマイクロエッチング剤 |
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