JPS6145720B2 - - Google Patents

Info

Publication number
JPS6145720B2
JPS6145720B2 JP56037308A JP3730881A JPS6145720B2 JP S6145720 B2 JPS6145720 B2 JP S6145720B2 JP 56037308 A JP56037308 A JP 56037308A JP 3730881 A JP3730881 A JP 3730881A JP S6145720 B2 JPS6145720 B2 JP S6145720B2
Authority
JP
Japan
Prior art keywords
chromium
magnesium
copper foil
thin film
oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56037308A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57152485A (en
Inventor
Mutsumi Shinozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Denkai Co Ltd
Original Assignee
Nippon Denkai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Denkai Co Ltd filed Critical Nippon Denkai Co Ltd
Priority to JP3730881A priority Critical patent/JPS57152485A/ja
Publication of JPS57152485A publication Critical patent/JPS57152485A/ja
Publication of JPS6145720B2 publication Critical patent/JPS6145720B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP3730881A 1981-03-17 1981-03-17 Copper foil and its surface treatment Granted JPS57152485A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3730881A JPS57152485A (en) 1981-03-17 1981-03-17 Copper foil and its surface treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3730881A JPS57152485A (en) 1981-03-17 1981-03-17 Copper foil and its surface treatment

Publications (2)

Publication Number Publication Date
JPS57152485A JPS57152485A (en) 1982-09-20
JPS6145720B2 true JPS6145720B2 (enExample) 1986-10-09

Family

ID=12494061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3730881A Granted JPS57152485A (en) 1981-03-17 1981-03-17 Copper foil and its surface treatment

Country Status (1)

Country Link
JP (1) JPS57152485A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI539032B (zh) * 2013-08-01 2016-06-21 Chang Chun Petrochemical Co Electrolytic copper foil, cleaning fluid composition and cleaning copper foil method
CN110983386B (zh) * 2019-12-30 2021-09-28 中国科学院青海盐湖研究所 一步电解法制备多孔铜箔的方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5142575A (en) * 1974-10-08 1976-04-10 Matsushita Electric Industrial Co Ltd Koondosensaa

Also Published As

Publication number Publication date
JPS57152485A (en) 1982-09-20

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