JPS57152485A - Copper foil and its surface treatment - Google Patents

Copper foil and its surface treatment

Info

Publication number
JPS57152485A
JPS57152485A JP3730881A JP3730881A JPS57152485A JP S57152485 A JPS57152485 A JP S57152485A JP 3730881 A JP3730881 A JP 3730881A JP 3730881 A JP3730881 A JP 3730881A JP S57152485 A JPS57152485 A JP S57152485A
Authority
JP
Japan
Prior art keywords
foil
chromium
copper foil
magnesium
roughened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3730881A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6145720B2 (enExample
Inventor
Mutsumi Shinozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Denkai Co Ltd
Original Assignee
Nippon Denkai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Denkai Co Ltd filed Critical Nippon Denkai Co Ltd
Priority to JP3730881A priority Critical patent/JPS57152485A/ja
Publication of JPS57152485A publication Critical patent/JPS57152485A/ja
Publication of JPS6145720B2 publication Critical patent/JPS6145720B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP3730881A 1981-03-17 1981-03-17 Copper foil and its surface treatment Granted JPS57152485A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3730881A JPS57152485A (en) 1981-03-17 1981-03-17 Copper foil and its surface treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3730881A JPS57152485A (en) 1981-03-17 1981-03-17 Copper foil and its surface treatment

Publications (2)

Publication Number Publication Date
JPS57152485A true JPS57152485A (en) 1982-09-20
JPS6145720B2 JPS6145720B2 (enExample) 1986-10-09

Family

ID=12494061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3730881A Granted JPS57152485A (en) 1981-03-17 1981-03-17 Copper foil and its surface treatment

Country Status (1)

Country Link
JP (1) JPS57152485A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015038253A (ja) * 2013-08-01 2015-02-26 長春石油化學股▲分▼有限公司 電解銅箔
CN110983386A (zh) * 2019-12-30 2020-04-10 中国科学院青海盐湖研究所 一步电解法制备多孔铜箔的方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5142575A (en) * 1974-10-08 1976-04-10 Matsushita Electric Industrial Co Ltd Koondosensaa

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5142575A (en) * 1974-10-08 1976-04-10 Matsushita Electric Industrial Co Ltd Koondosensaa

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015038253A (ja) * 2013-08-01 2015-02-26 長春石油化學股▲分▼有限公司 電解銅箔
CN110983386A (zh) * 2019-12-30 2020-04-10 中国科学院青海盐湖研究所 一步电解法制备多孔铜箔的方法
CN110983386B (zh) * 2019-12-30 2021-09-28 中国科学院青海盐湖研究所 一步电解法制备多孔铜箔的方法

Also Published As

Publication number Publication date
JPS6145720B2 (enExample) 1986-10-09

Similar Documents

Publication Publication Date Title
US3808576A (en) Circuit board with resistance layer
US3220897A (en) Conducting element and method
MY112930A (en) Method of surface-roughening treatment of copper foil
JPS5573872A (en) Etching of surface comprising coppur or coppur alloy
JPS57152485A (en) Copper foil and its surface treatment
JPS644091A (en) Plating
JPS57152490A (en) Surface treatment of copper foil
JPS5687677A (en) Method of producing copper foil for printed circuit
JPS5687695A (en) Copper foil for printed circuit and its manufacture
JPS5921392B2 (ja) プリント回路用銅箔の製造方法
JP2697874B2 (ja) 印刷配線板の製造方法
JP2654126B2 (ja) 印刷配線板の製造方法
DE2537725A1 (de) Verfahren zur herstellung von flachdruckplattentraegern aus aluminium durch elektrochemisches aufrauhen der oberflaeche
JPS5789499A (en) Composite electrodeposition of boron nitride and metal
JPS56166384A (en) Anode coated with lead dioxide
JPS6479393A (en) Production of zinc-chromium electroplated steel sheet
JPS57177988A (en) Manufacture of silver plated copper material
GB1531454A (en) Electroplated copper foil
Takami Surface Treatment of a Copper Foil for Printed Circuit Boards by Electroplating and Chromate Treatment
JPS5554589A (en) Plating method of electronic parts which prevent production of zinc whisker
JPS5798698A (en) Coloring method for aluminum or aluminum alloy
JPS5620188A (en) Cathode plate
JPS57207192A (en) Production of steel plate plated with zinc-nikel alloy on both sides
JPS57140895A (en) Ac electrolytic coloring method of aluminum
JPS57174442A (en) Formation of black nickel film