GB1531454A - Electroplated copper foil - Google Patents

Electroplated copper foil

Info

Publication number
GB1531454A
GB1531454A GB400475A GB400475A GB1531454A GB 1531454 A GB1531454 A GB 1531454A GB 400475 A GB400475 A GB 400475A GB 400475 A GB400475 A GB 400475A GB 1531454 A GB1531454 A GB 1531454A
Authority
GB
United Kingdom
Prior art keywords
copper foil
electro
foil
electroplated copper
jan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB400475A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ELECTROFOILS Ltd
Original Assignee
ELECTROFOILS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ELECTROFOILS Ltd filed Critical ELECTROFOILS Ltd
Priority to GB400475A priority Critical patent/GB1531454A/en
Publication of GB1531454A publication Critical patent/GB1531454A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Abstract

1531454 Electro-plating Cu on to Cu foil ELECTROFOILS Ltd 20 Jan 1976 [29 Jan 1975] 4004/75 Heading C7B Cu foil having a matt and a shiny surface (e.g. electro-formed foil) is electro-plated on the latter from a Cu pyrophosphate bath preferably to a thickness not exceeding 2À5Á. The plated surface is of improved characteristics as regards printed circuit utility.
GB400475A 1976-01-20 1976-01-20 Electroplated copper foil Expired GB1531454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB400475A GB1531454A (en) 1976-01-20 1976-01-20 Electroplated copper foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB400475A GB1531454A (en) 1976-01-20 1976-01-20 Electroplated copper foil

Publications (1)

Publication Number Publication Date
GB1531454A true GB1531454A (en) 1978-11-08

Family

ID=9768965

Family Applications (1)

Application Number Title Priority Date Filing Date
GB400475A Expired GB1531454A (en) 1976-01-20 1976-01-20 Electroplated copper foil

Country Status (1)

Country Link
GB (1) GB1531454A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2134136A (en) * 1983-01-19 1984-08-08 Shell Int Research An electronic conduit and a method of manufacturing it
US4781991A (en) * 1983-12-19 1988-11-01 Microclad Laminates Limited Production of dielectric boards
EP0618755A1 (en) * 1993-03-29 1994-10-05 Japan Energy Corporation Copper foil for printed circuits and process for producing the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2134136A (en) * 1983-01-19 1984-08-08 Shell Int Research An electronic conduit and a method of manufacturing it
US4781991A (en) * 1983-12-19 1988-11-01 Microclad Laminates Limited Production of dielectric boards
EP0618755A1 (en) * 1993-03-29 1994-10-05 Japan Energy Corporation Copper foil for printed circuits and process for producing the same
US5552234A (en) * 1993-03-29 1996-09-03 Japan Energy Corporation Copper foil for printed circuits

Similar Documents

Publication Publication Date Title
AU2225477A (en) Acid copper plating baths
JPS5464025A (en) Acidic copper plating bath
JPS5281032A (en) Tinngold electroplating bath and plating method
GB2120681B (en) Zinc alloy plating baths with brighteners
GB2030596B (en) Combined method of electroplating and deplating electroplated ferrous based wire
GB2047744B (en) Electrolytic alloy plating
GB2034354B (en) Elimination of anode hydrogen cyanide formation in trivalent chromium plating
GB1531454A (en) Electroplated copper foil
DE3473303D1 (en) Electrolytic copper plating
JPS52130437A (en) Brightener in alkalline zinc plating bath
JPS54141345A (en) Electrolytic zinc plating solution and method for forming zinc plated layer
GB2133040B (en) Copper plating bath process and anode therefore
HK42179A (en) Electroless copper plating bath
JPS5681694A (en) Manufacture of porous copper thin film
GB2071697B (en) Bath for electrodeposition of copper alloy
GB2120680B (en) Zinc plating baths with brighteners
EP0147463A4 (en) Zn-Ni ALLOY PLATING SOLUTION BASED ON CHLORIDE BATH.
JPS52107239A (en) Cobaltttin alloy plating bath
GB978793A (en) Improvements in and relating to printed circuits
JPS57165250A (en) Manufacture of copper plated laminated board
JPS54157742A (en) Recovering plating solution from mterial to be plated
JPS5554589A (en) Plating method of electronic parts which prevent production of zinc whisker
GB1485083A (en) Selective electro-plating
JPS5731939A (en) Molding of resin capable of being partially electroplated
JPS5372167A (en) Method of plating electrolytic through hole of printed circuit board

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee