JPS5372167A - Method of plating electrolytic through hole of printed circuit board - Google Patents

Method of plating electrolytic through hole of printed circuit board

Info

Publication number
JPS5372167A
JPS5372167A JP14709976A JP14709976A JPS5372167A JP S5372167 A JPS5372167 A JP S5372167A JP 14709976 A JP14709976 A JP 14709976A JP 14709976 A JP14709976 A JP 14709976A JP S5372167 A JPS5372167 A JP S5372167A
Authority
JP
Japan
Prior art keywords
hole
circuit board
printed circuit
plating electrolytic
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14709976A
Other languages
Japanese (ja)
Inventor
Masaru Miyasaka
Narimitsu Matsumoto
Kiyuuzou Mitsui
Kiyoshi Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14709976A priority Critical patent/JPS5372167A/en
Publication of JPS5372167A publication Critical patent/JPS5372167A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP14709976A 1976-12-09 1976-12-09 Method of plating electrolytic through hole of printed circuit board Pending JPS5372167A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14709976A JPS5372167A (en) 1976-12-09 1976-12-09 Method of plating electrolytic through hole of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14709976A JPS5372167A (en) 1976-12-09 1976-12-09 Method of plating electrolytic through hole of printed circuit board

Publications (1)

Publication Number Publication Date
JPS5372167A true JPS5372167A (en) 1978-06-27

Family

ID=15422460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14709976A Pending JPS5372167A (en) 1976-12-09 1976-12-09 Method of plating electrolytic through hole of printed circuit board

Country Status (1)

Country Link
JP (1) JPS5372167A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55150295A (en) * 1979-05-14 1980-11-22 Toyo Giken Kogyo Kk Method and device for plating through hole of printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55150295A (en) * 1979-05-14 1980-11-22 Toyo Giken Kogyo Kk Method and device for plating through hole of printed circuit board
JPS5739079B2 (en) * 1979-05-14 1982-08-19

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