JP4870699B2 - 銅の表面処理方法およびプリント配線板の表面処理方法 - Google Patents
銅の表面処理方法およびプリント配線板の表面処理方法 Download PDFInfo
- Publication number
- JP4870699B2 JP4870699B2 JP2008060140A JP2008060140A JP4870699B2 JP 4870699 B2 JP4870699 B2 JP 4870699B2 JP 2008060140 A JP2008060140 A JP 2008060140A JP 2008060140 A JP2008060140 A JP 2008060140A JP 4870699 B2 JP4870699 B2 JP 4870699B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- surface treatment
- treatment method
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 49
- 238000000034 method Methods 0.000 title claims description 37
- 238000004381 surface treatment Methods 0.000 title claims description 35
- 239000010949 copper Substances 0.000 title claims description 15
- 229910052802 copper Inorganic materials 0.000 title claims description 14
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 74
- 229960004643 cupric oxide Drugs 0.000 claims description 56
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 33
- 239000011889 copper foil Substances 0.000 claims description 33
- 239000005751 Copper oxide Substances 0.000 claims description 32
- 229910000431 copper oxide Inorganic materials 0.000 claims description 32
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 14
- -1 copper oxide ions Chemical class 0.000 claims description 11
- 239000007864 aqueous solution Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000002048 anodisation reaction Methods 0.000 claims description 4
- 229920006395 saturated elastomer Polymers 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 18
- 238000011282 treatment Methods 0.000 description 14
- 239000008151 electrolyte solution Substances 0.000 description 12
- 239000000243 solution Substances 0.000 description 8
- 238000005553 drilling Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000002585 base Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 3
- 229960002218 sodium chlorite Drugs 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 238000007743 anodising Methods 0.000 description 2
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 2
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical group [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 2
- 229940112669 cuprous oxide Drugs 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000005750 Copper hydroxide Substances 0.000 description 1
- 239000002000 Electrolyte additive Substances 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 229910001919 chlorite Inorganic materials 0.000 description 1
- 229910052619 chlorite group Inorganic materials 0.000 description 1
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
- Chemical Treatment Of Metals (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008060140A JP4870699B2 (ja) | 2008-03-10 | 2008-03-10 | 銅の表面処理方法およびプリント配線板の表面処理方法 |
| TW098104922A TW201004517A (en) | 2008-03-10 | 2009-02-17 | Method of treating surface of copper and method of treating surface of printed wiring board |
| PCT/JP2009/053411 WO2009113396A1 (ja) | 2008-03-10 | 2009-02-25 | 銅の表面処理方法およびプリント配線板の表面処理方法 |
| US12/921,656 US20110036493A1 (en) | 2008-03-10 | 2009-02-25 | Surface treatment method for copper and surface treatment method for printed wiring board |
| CN2009801082006A CN101965760A (zh) | 2008-03-10 | 2009-02-25 | 铜的表面处理方法及印刷配线板的表面处理方法 |
| KR1020107020269A KR20100124287A (ko) | 2008-03-10 | 2009-02-25 | 구리의 표면처리방법 및 프린트 배선판의 표면처리방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008060140A JP4870699B2 (ja) | 2008-03-10 | 2008-03-10 | 銅の表面処理方法およびプリント配線板の表面処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009218368A JP2009218368A (ja) | 2009-09-24 |
| JP2009218368A5 JP2009218368A5 (enExample) | 2010-11-04 |
| JP4870699B2 true JP4870699B2 (ja) | 2012-02-08 |
Family
ID=41065065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008060140A Expired - Fee Related JP4870699B2 (ja) | 2008-03-10 | 2008-03-10 | 銅の表面処理方法およびプリント配線板の表面処理方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20110036493A1 (enExample) |
| JP (1) | JP4870699B2 (enExample) |
| KR (1) | KR20100124287A (enExample) |
| CN (1) | CN101965760A (enExample) |
| TW (1) | TW201004517A (enExample) |
| WO (1) | WO2009113396A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101354386B1 (ko) | 2010-12-07 | 2014-01-23 | 엘지디스플레이 주식회사 | 액정표시장치 |
| GB2489974B (en) | 2011-04-14 | 2015-10-21 | Conductive Inkjet Tech Ltd | Improvements in and relating to transparent components |
| JP5750686B2 (ja) * | 2011-10-14 | 2015-07-22 | メック株式会社 | プリント配線板の製造方法及びこれに用いる表面処理剤 |
| US20130256143A1 (en) * | 2012-03-30 | 2013-10-03 | GM Global Technology Operations LLC | Anodized inserts for coulomb damping or frictional damping |
| US9202639B2 (en) | 2012-08-17 | 2015-12-01 | Nokia Technologies Oy | Apparatus and associated methods |
| CN105256359A (zh) * | 2015-11-27 | 2016-01-20 | 中国船舶重工集团公司第七二五研究所 | 一种铜合金钝化液及钝化层制备方法 |
| CN112601473B (zh) | 2018-09-06 | 2023-02-03 | Ykk株式会社 | 紧固件部件 |
| US11078589B2 (en) * | 2019-08-28 | 2021-08-03 | Saudi Arabian Oil Company | Hydrophobic stainless-steel copper-coated mesh and method of synthesizing same |
| US20220342126A1 (en) * | 2019-09-03 | 2022-10-27 | 3M Innovative Properties Company | Optical films and methods of manufacturing such optical films |
| CN110923797A (zh) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | 利用电解清洗、清洁改善dpc电镀填孔均匀性的工艺 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1417413A (en) * | 1920-06-30 | 1922-05-23 | Sestron Foreign Patents Ltd | Coloration of metallic surfaces |
| JPH05259611A (ja) * | 1992-03-12 | 1993-10-08 | Hitachi Chem Co Ltd | プリント配線板の製造法 |
| JP3229701B2 (ja) * | 1993-03-09 | 2001-11-19 | 臼井国際産業株式会社 | 銅素材表面における電気絶縁層の形成方法 |
| JP3486543B2 (ja) * | 1997-11-12 | 2004-01-13 | キヤノン株式会社 | 酸化第１銅膜の堆積法及び該酸化第１銅膜堆積法を用いた半導体デバイスの製造方法 |
| PL192904B1 (pl) * | 1999-09-29 | 2006-12-29 | Europa Metalli Spa | Elektrochemiczny sposób wytwarzania nieorganicznej warstwy powłokowej na powierzchni elementu z miedzi lub ze stopu na bazie miedzi oraz wyrób miedziany |
| JP2002060967A (ja) * | 2000-08-23 | 2002-02-28 | Mec Kk | 銅または銅合金の表面処理法 |
| JP3968433B2 (ja) * | 2003-03-27 | 2007-08-29 | 独立行政法人物質・材料研究機構 | 低反射材料とその作製方法 |
| JP3883543B2 (ja) * | 2003-04-16 | 2007-02-21 | 新光電気工業株式会社 | 導体基材及び半導体装置 |
| TW200541434A (en) * | 2004-04-30 | 2005-12-16 | Hitachi Via Mechanics Ltd | Printed circuit board and method for processing printed circuit board and method for manufacturing printed circuit board |
-
2008
- 2008-03-10 JP JP2008060140A patent/JP4870699B2/ja not_active Expired - Fee Related
-
2009
- 2009-02-17 TW TW098104922A patent/TW201004517A/zh unknown
- 2009-02-25 WO PCT/JP2009/053411 patent/WO2009113396A1/ja not_active Ceased
- 2009-02-25 KR KR1020107020269A patent/KR20100124287A/ko not_active Withdrawn
- 2009-02-25 US US12/921,656 patent/US20110036493A1/en not_active Abandoned
- 2009-02-25 CN CN2009801082006A patent/CN101965760A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW201004517A (en) | 2010-01-16 |
| CN101965760A (zh) | 2011-02-02 |
| KR20100124287A (ko) | 2010-11-26 |
| US20110036493A1 (en) | 2011-02-17 |
| WO2009113396A1 (ja) | 2009-09-17 |
| JP2009218368A (ja) | 2009-09-24 |
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