WO2009113396A1 - 銅の表面処理方法およびプリント配線板の表面処理方法 - Google Patents
銅の表面処理方法およびプリント配線板の表面処理方法 Download PDFInfo
- Publication number
- WO2009113396A1 WO2009113396A1 PCT/JP2009/053411 JP2009053411W WO2009113396A1 WO 2009113396 A1 WO2009113396 A1 WO 2009113396A1 JP 2009053411 W JP2009053411 W JP 2009053411W WO 2009113396 A1 WO2009113396 A1 WO 2009113396A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper
- surface treatment
- wiring board
- printed wiring
- mol
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Definitions
- the present invention relates to a copper surface treatment method for forming a copper oxide film containing cupric oxide as a main component on a copper surface, and a surface treatment method for a printed wiring board in which a copper foil is bonded to a base resin.
- Interlayer connection methods include a method using a through hole (through hole) and a blind via hole (hole with a bottom), a method using an interstitial via hole, and the like.
- the hole forming method includes a drilling method, a laser processing method, and the like, but the laser processing method is mainly used from the viewpoint of reducing the diameter of the processing hole and high processing speed. Among them, the CO 2 laser having high laser energy is most popular.
- a conformal mask method or a large window method is employed in which laser processing is performed after only the copper foil around the hole forming periphery is removed by etching.
- the conformal mask method and the large window method require a copper foil patterning process and it is difficult to correct the misalignment of the holes.
- Surface treatment technology is being studied.
- Patent Document 1 since processing takes time, it is difficult to improve productivity. Further, since sodium chlorite used for the treatment is expensive, the running cost is high. Furthermore, the strong oxidative sodium chlorite has a high reactivity, which makes it difficult to handle and maintain.
- An object of the present invention is to provide a surface treatment method (surface blackening treatment method) of a printed wiring board that is excellent in productivity, can reduce running costs, and is easy to handle and maintain.
- the first means of the present invention is a copper surface treatment method for forming a copper oxide film containing cupric oxide as a main component on the surface of copper, and oxidation of 0.001 [mol / l] or more and a saturation concentration or less. Electrolytic anodizing is performed in an alkaline aqueous solution containing copper ions.
- the alkaline aqueous solution preferably contains 2 [mol / l] to 6 [mol / l] sodium hydroxide or potassium hydroxide.
- the liquid temperature of the alkaline aqueous solution is preferably 50 ° C. to 90 ° C.
- the second means of the present invention is that the outer layer copper foil (5) and the inner layer copper of the printed wiring board (10) in which the resin (1, 4) and the copper foil (3, 5) are alternately laminated.
- electrolysis is performed in an alkaline aqueous solution (30) containing 0.001 [mol / l] or more and a saturated concentration of copper oxide ions or less.
- a copper oxide film (6) containing cupric oxide as a main component is formed on the surface of the outer layer copper foil by anodizing.
- the thickness of the cupric oxide is preferably 0.6 ⁇ m to 3.0 ⁇ m.
- the working efficiency of forming a copper oxide film on the surface of the copper foil of a printed wiring board can be improved, and the running cost can be reduced.
- FIG. 1 is a diagram showing a surface treatment process of the present embodiment, where (A) shows a cross section before the surface treatment, (B) shows a surface treatment state, and (C) shows a cross section after the surface treatment. ing.
- the printed wiring board 10 before surface treatment does not contain a glass cloth in the surface side and back surface side of the inner-layer base material 1 which is resin in which the inner-layer circuit which consists of copper foil 3 was formed.
- a resin-coated copper foil for example, a copper-clad laminate MCL-E679 manufactured by Hitachi Chemical Co., Ltd.
- a resin insulating layer 4 and a copper foil 5 are integrated is laminated by pressing. It has four layers of copper foil consisting of five and two inner layer circuits 3. The thickness of the copper foil 5 is 9 ⁇ m.
- pre-treatment of the printed wiring board 10 (in this case, the copper foil 5 is not formed with a pattern but is referred to as the printed wiring board 10) is subjected to the following pretreatments (1) to (3).
- the surface of the copper foil 5 is degreased by dipping in a sodium hydroxide solution having a liquid temperature of 50 ° C. and a concentration of 5% for 3 minutes, and then washed with water.
- the surface of the copper foil 5 is etched by immersion for 1 minute in an ammonium persulfate solution having a liquid temperature of 30 ° C. and a concentration of 20%, and then washed with water.
- it is immersed in a dilute sulfuric acid solution having a liquid temperature of 25 ° C. and a concentration of 5% for 1 minute, and the surface of the copper foil 5 is further etched and then washed with water.
- the treatments (2) and (3) are for cleaning the surface of the copper foil 5 (removing the oxide film on the surface of the copper foil 5), and no copper oxide film is formed on the surface of the copper foil 5. .
- electrolytic anodization surface blackening treatment
- FIG. 1B the pre-processed printed wiring board 10 is placed in an electrolytic solution 30 that is an alkaline aqueous solution, and the electrode 21 is used as a cathode and the copper foil 5 is used as an anode by a DC power source 20.
- the electrode 21 is used as a cathode
- the copper foil 5 is used as an anode by a DC power source 20.
- 1B shows a vertical electrolytic treatment tank, a horizontal type may be used.
- FIG.1 (C) after forming the copper oxide 6 in the surface of the copper foil 5, it is washed with water and dried.
- FIG. 2 is a diagram showing specific conditions and results of the surface treatment, and is a case where a sodium hydroxide solution is used as the electrolytic solution.
- the treatment conditions for the surface treatment are the following (a) to (e).
- stainless steel is used as the electrode 21, titanium, platinum or copper may be used.
- a copper oxide ion is electrolyte additive of (b), present in alkali (HCuO 2) - and (CuO 2) 2-and (CuO 2) - refers to copper oxide ions, such as.
- copper hydroxide ions are used for providing copper oxide ions, but copper chloride, copper pyrophosphate, copper sulfate, copper oxide, and copper may be used.
- the copper oxides produced by the electrolytic anodization in this embodiment are cuprous oxide and cupric oxide, and the production ratio is about 10% to 20% for cuprous oxide and cupric oxide. Is about 90% to 80%. Thus, since the copper oxide 6 is mostly cupric oxide, it is described as cupric oxide in FIG. 2 and FIGS. 3 and 4 described later.
- Cupric oxide film thickness Measured at three points in the substrate using the electrochemical reduction potential method. The measurement conditions of the electrochemical reduction potential method are as follows: the electrode area is 4.5 ⁇ 10 ⁇ 2 cm 2 , the electrolyte is a 0.1 [mol / l] NaOH aqueous solution, and the reference electrode is a saturated KCl silver / silver chloride electrode.
- the current value was 1 mA.
- G Evaluation of drilling workability: 400 holes were drilled with a CO 2 laser, and the target hole diameter was evaluated based on the ratio of the number of processed holes. As the drilling conditions, the target hole diameter was 80 ⁇ m, the laser energy was 10 mJ, and one shot was processed. Here, in practice, there is no problem if the drilled hole diameter is 90% or more with respect to the target hole diameter. Therefore, the drilling workability is good when the drilled hole diameter is 90% or more with respect to the target hole diameter. It was supposed to be.
- FIG. 3 shows the case where a potassium hydroxide solution is used as the electrolytic solution, and the specific conditions for the surface treatment are the same as when a sodium hydroxide solution is used as the electrolytic solution.
- FIG. 4 is a diagram showing the results of the prior art, and the pre-processing and are the same as those described above.
- the processing conditions in the prior art are the following (h) to (j).
- Processing time 7 minutes Note that the preprocessing and the evaluation conditions are the same as those in FIGS.
- the results of the electrolytic process are summarized as follows.
- (A) Regarding the thickness of the copper oxide The laser drilling workability of the copper foil depends on the thickness of the copper oxide, and is good if the thickness of the cupric oxide is 0.6 ⁇ m or more. .
- the sodium hydroxide concentration or potassium hydroxide is 2 [mol / l] to 6 [mol / l]
- the Cu ion concentration is 0.001 [mol / l. l]
- the cupric oxide film thickness can be 0.6 ⁇ m or more (0.6 ⁇ m to 3.0 ⁇ m), and It can be seen that the film thickness variation range in the substrate can be within 0.1 ⁇ m.
- the cupric oxide film thickness can be uniformly formed by adding copper oxide ions.
- the processing time can be shortened by increasing the current density. That is, in Examples 9, 10, 15, 16, 20, 21, 21, 24, and 26, the processing time could be reduced to 1 minute or less. This processing time is 7 times or more faster than the conventional technique (7 minutes in Comparative Examples 2 to 4).
- the cupric oxide film thickness cannot be 0.6 ⁇ m or more.
- Copper oxide ions are also generated by Cu ions eluted from the copper foil of the printed wiring board during the electrolytic treatment. Moreover, since the amount of saturation or more is precipitated as copper oxide, the amount in the electrolyte does not change. Therefore, it is not necessary to replenish according to work, and management of the copper oxide ion concentration is easy.
- the upper limit of the cupric oxide film thickness may be 3.0 ⁇ m or less (that is, 0.6 ⁇ m to 3.0 ⁇ m). It is practical.
- the present invention can be applied to a rigid or flexible generally known printed wiring board having a copper foil on both sides or one side of a resin or resin including glass cloth.
- the present invention is not limited to the printed wiring board, but is used for other purposes (for example, a collection of batteries requiring a high surface area by utilizing the fine crystal shape of cupric oxide.
- the present invention can also be applied to the surface treatment of a heat integrated device such as solar energy.
- the copper surface treatment method and the printed wiring board surface treatment method according to the present invention are used for electronic devices such as mobile phones, computers, digital cameras, and televisions, signs, and parts of mechanical devices such as automobiles and robots. It can be used for processing copper material, and in particular, processing for increasing the absorption rate of laser light of copper, for example, performed when processing holes for interlayer connection on the printed circuit board of the electronic device by laser, It is suitable for use in surface treatment of the copper foil of the wiring layer, and is suitable for those requiring improvement in productivity and ease of maintenance management.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
Description
(1)先ず、液温度50°C、濃度5%の水酸化ナトリウム溶液中に3分間浸漬して銅箔5の表面を脱脂し、その後水洗する。
(2)次に、液温度30°C、濃度20%の過硫酸アンモニウム液中に1分間浸漬して銅箔5の表面をエッチングし、その後水洗する。
(3)さらに、液温25°C、濃度5%の希硫酸液中に1分間浸漬し、銅箔5の表面をさらにエッチングし、その後水洗する。
(a)電解液:水酸化ナトリウム溶液。濃度は2~6〔mol/l〕
(b)電解液添加剤:酸化銅イオン濃度0.001〔mol/l〕以上
(c)電解液の液温:50~90°C
(d)電流密度:5~45mA/cm2
(e)処理時間:0.5分~8分
なお、電極21としてはステンレスを使用したが、チタンや白金あるいは銅でもよい。また、(b)の電解液添加剤である酸化銅イオンとは、アルカリ中に存在する(HCuO2)-や(CuO2)2-および(CuO2)-などの酸化銅イオンを指す。本実施形態では酸化銅イオンの付与は水酸化銅を用いたが、塩化銅、ピロリン酸銅、硫酸銅、酸化銅、銅でもよい。
(f)酸化第二銅の膜厚:電気化学的還元電位法を用いて基板内の3点で測定した。電気化学的還元電位法の測定条件は、電極面積を4.5×10-2cm2とし、電解液を0.1〔mol/l〕NaOH水溶液、参照極を飽和KCl銀/塩化銀電極として電流値1mAで行った。
(g)穴明け加工性の評価:CO2レーザにより400個の穴明け加工を行い、目標穴径を得られた加工穴数の割合で評価した。穴加工条件としては、目標の穴径を80μmとし、レーザエネルギを10mJとして1ショット加工した。ここで、実用上、加工穴径が目標穴径に対して90%以上であれば問題ないので、加工穴径が目標穴径に対して90%以上である場合を穴明け加工性が良好であるとした。
(h)処理液:亜塩素酸ナトリウム濃度は1.1〔mol/l〕~1.8〔mol/l〕、水酸化ナトリウム濃度は0.75〔mol/l〕~2.5〔mol/l〕
(i)処理液温度:70°C
(j)処理時間:7分
なお、前処理および評価条件は図2、3の場合と同じである。
(A)銅酸化物の膜厚に関して
銅箔のレーザ穴明け加工性は、銅酸化物の膜厚に依存しており、酸化第二銅の厚さが0.6μm以上であれば良好である。図2、図3から明らかなように、本実施形態の場合、水酸化ナトリウム濃度または水酸化カリウムを2〔mol/l〕~6〔mol/l〕、Cuイオン濃度を0.001〔mol/l〕以上を含む電解液とし、液温を50℃~90℃にすることで、酸化第二銅の膜厚を0.6μm以上(0.6μm~3.0μm)とすることができ、かつ、基板内の膜厚ばらつき範囲を0.1μm以内にすることができていることが分かる。
本実施例1~26と比較例2~4を比較すると、実施例1~26の総てにおいて比較例2~4と同様に加工性90%以上であり、良好な結果を得られた。なお、比較例1は、酸化銅イオンを添加していないために酸化第二銅の膜厚分布が不均一であり酸化第二銅膜厚0.4μmの薄い部分にて穴径が小さくなり加工性が62%に低下した。
本実施形態では、電流密度を高くすることにより、処理時間を短縮することができる。すなわち、実施例9,10,15,16,20,21,23,24,26の場合は処理時間を1分以下にすることができた。この処理時間は、従来技術(比較例2~4では7分)に比べて7倍以上高速化されている。
(D1)電解液を水酸化ナトリウム溶液または水酸化カリウム溶液とすることにより、従来の化学的な表面黒化処理液の強酸化性の亜塩素酸塩と比較し、安価となり、取り扱いも容易になる。
Claims (5)
- 銅の表面に酸化第二銅を主成分とする銅酸化物膜を形成する銅の表面処理方法において、0.001〔mol/l〕以上飽和濃度以下の酸化銅イオンを含むアルカリ性水溶液中で電解陽極処理することを特徴とする銅の表面処理方法。
- 前記アルカリ性水溶液は、2〔mol/l〕乃至6〔mol/l〕の水酸化ナトリウムまたは水酸化カリウムを含むことを特徴とする請求項1に記載の銅の表面処理方法。
- 前記アルカリ性水溶液の液温は、50°C乃至90°Cであることを特徴とする請求項1又は2に記載の銅の表面処理方法。
- 樹脂と銅箔とが交互に積層されたプリント配線板の外層の銅箔と内層の銅箔を接続する穴をレーザで加工するためのプリント配線板の表面処理方法において、0.001〔mol/l〕以上飽和濃度以下の酸化銅イオンを含むアルカリ性水溶液中で電解陽極処理することにより外層銅箔の表面に酸化第二銅を主成分とする銅酸化物膜を形成することを特徴とするプリント配線板の表面処理方法。
- 前記酸化第二銅の厚さが、0.6μm乃至3.0μmであることを特徴とする請求項4に記載のプリント配線板の表面処理方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US12/921,656 US20110036493A1 (en) | 2008-03-10 | 2009-02-25 | Surface treatment method for copper and surface treatment method for printed wiring board |
CN2009801082006A CN101965760A (zh) | 2008-03-10 | 2009-02-25 | 铜的表面处理方法及印刷配线板的表面处理方法 |
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JP2008-060140 | 2008-03-10 | ||
JP2008060140A JP4870699B2 (ja) | 2008-03-10 | 2008-03-10 | 銅の表面処理方法およびプリント配線板の表面処理方法 |
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US (1) | US20110036493A1 (ja) |
JP (1) | JP4870699B2 (ja) |
KR (1) | KR20100124287A (ja) |
CN (1) | CN101965760A (ja) |
TW (1) | TW201004517A (ja) |
WO (1) | WO2009113396A1 (ja) |
Cited By (1)
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US20130256143A1 (en) * | 2012-03-30 | 2013-10-03 | GM Global Technology Operations LLC | Anodized inserts for coulomb damping or frictional damping |
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KR101354386B1 (ko) | 2010-12-07 | 2014-01-23 | 엘지디스플레이 주식회사 | 액정표시장치 |
GB2489974B (en) | 2011-04-14 | 2015-10-21 | Conductive Inkjet Tech Ltd | Improvements in and relating to transparent components |
JP5750686B2 (ja) * | 2011-10-14 | 2015-07-22 | メック株式会社 | プリント配線板の製造方法及びこれに用いる表面処理剤 |
US9202639B2 (en) | 2012-08-17 | 2015-12-01 | Nokia Technologies Oy | Apparatus and associated methods |
CN105256359A (zh) * | 2015-11-27 | 2016-01-20 | 中国船舶重工集团公司第七二五研究所 | 一种铜合金钝化液及钝化层制备方法 |
CN112601473B (zh) | 2018-09-06 | 2023-02-03 | Ykk株式会社 | 紧固件部件 |
US11078589B2 (en) * | 2019-08-28 | 2021-08-03 | Saudi Arabian Oil Company | Hydrophobic stainless-steel copper-coated mesh and method of synthesizing same |
CN110923797A (zh) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | 利用电解清洗、清洁改善dpc电镀填孔均匀性的工艺 |
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JP3229701B2 (ja) * | 1993-03-09 | 2001-11-19 | 臼井国際産業株式会社 | 銅素材表面における電気絶縁層の形成方法 |
JP3486543B2 (ja) * | 1997-11-12 | 2004-01-13 | キヤノン株式会社 | 酸化第1銅膜の堆積法及び該酸化第1銅膜堆積法を用いた半導体デバイスの製造方法 |
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TW200541434A (en) * | 2004-04-30 | 2005-12-16 | Hitachi Via Mechanics Ltd | Printed circuit board and method for processing printed circuit board and method for manufacturing printed circuit board |
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2008
- 2008-03-10 JP JP2008060140A patent/JP4870699B2/ja not_active Expired - Fee Related
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2009
- 2009-02-17 TW TW098104922A patent/TW201004517A/zh unknown
- 2009-02-25 US US12/921,656 patent/US20110036493A1/en not_active Abandoned
- 2009-02-25 KR KR1020107020269A patent/KR20100124287A/ko not_active Application Discontinuation
- 2009-02-25 CN CN2009801082006A patent/CN101965760A/zh active Pending
- 2009-02-25 WO PCT/JP2009/053411 patent/WO2009113396A1/ja active Application Filing
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JPH05259611A (ja) * | 1992-03-12 | 1993-10-08 | Hitachi Chem Co Ltd | プリント配線板の製造法 |
JP2003510466A (ja) * | 1999-09-29 | 2003-03-18 | エウローパ メッタリ ソシエタ ペル アチオニ | 銅材料の表面上に無機被覆層を形成するための電気化学的方法 |
JP2002060967A (ja) * | 2000-08-23 | 2002-02-28 | Mec Kk | 銅または銅合金の表面処理法 |
JP2004292898A (ja) * | 2003-03-27 | 2004-10-21 | National Institute For Materials Science | 低反射材料の作製方法 |
Cited By (1)
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US20130256143A1 (en) * | 2012-03-30 | 2013-10-03 | GM Global Technology Operations LLC | Anodized inserts for coulomb damping or frictional damping |
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US20110036493A1 (en) | 2011-02-17 |
TW201004517A (en) | 2010-01-16 |
CN101965760A (zh) | 2011-02-02 |
JP2009218368A (ja) | 2009-09-24 |
JP4870699B2 (ja) | 2012-02-08 |
KR20100124287A (ko) | 2010-11-26 |
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