JP2009076065A5 - - Google Patents
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- Publication number
- JP2009076065A5 JP2009076065A5 JP2008213553A JP2008213553A JP2009076065A5 JP 2009076065 A5 JP2009076065 A5 JP 2009076065A5 JP 2008213553 A JP2008213553 A JP 2008213553A JP 2008213553 A JP2008213553 A JP 2008213553A JP 2009076065 A5 JP2009076065 A5 JP 2009076065A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- element layer
- chip
- semiconductor element
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims 18
- 239000011347 resin Substances 0.000 claims 18
- 239000004065 semiconductor Substances 0.000 claims 16
- 239000000835 fiber Substances 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- -1 polyethylene Polymers 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229920005992 thermoplastic resin Polymers 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 239000010409 thin film Substances 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 1
- 229920000049 Carbon (fiber) Polymers 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 239000004697 Polyetherimide Substances 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 claims 1
- 239000004721 Polyphenylene oxide Substances 0.000 claims 1
- 239000004372 Polyvinyl alcohol Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229920006231 aramid fiber Polymers 0.000 claims 1
- 239000004917 carbon fiber Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000003365 glass fiber Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 150000002484 inorganic compounds Chemical class 0.000 claims 1
- 229910010272 inorganic material Inorganic materials 0.000 claims 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000004745 nonwoven fabric Substances 0.000 claims 1
- 150000002894 organic compounds Chemical class 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920001601 polyetherimide Polymers 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 229920006380 polyphenylene oxide Polymers 0.000 claims 1
- 229920002451 polyvinyl alcohol Polymers 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 229920006337 unsaturated polyester resin Polymers 0.000 claims 1
- 239000002759 woven fabric Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008213553A JP5248240B2 (ja) | 2007-08-30 | 2008-08-22 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007223342 | 2007-08-30 | ||
| JP2007223342 | 2007-08-30 | ||
| JP2008213553A JP5248240B2 (ja) | 2007-08-30 | 2008-08-22 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009076065A JP2009076065A (ja) | 2009-04-09 |
| JP2009076065A5 true JP2009076065A5 (https=) | 2011-07-28 |
| JP5248240B2 JP5248240B2 (ja) | 2013-07-31 |
Family
ID=40406131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008213553A Expired - Fee Related JP5248240B2 (ja) | 2007-08-30 | 2008-08-22 | 半導体装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7759788B2 (https=) |
| JP (1) | JP5248240B2 (https=) |
| KR (1) | KR101545650B1 (https=) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2372756A1 (en) * | 2007-03-13 | 2011-10-05 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device and manufacturing method thereof |
| EP1970951A3 (en) * | 2007-03-13 | 2009-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP2008246104A (ja) * | 2007-03-30 | 2008-10-16 | Angel Shoji Kk | Ｒｆｉｄを内蔵したゲームカードおよびその製造方法 |
| WO2009031482A1 (en) | 2007-09-07 | 2009-03-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US8284557B2 (en) * | 2007-10-18 | 2012-10-09 | Kyocera Corporation | Circuit board, mounting structure, and method for manufacturing circuit board |
| JP2009205669A (ja) * | 2008-01-31 | 2009-09-10 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP5460108B2 (ja) | 2008-04-18 | 2014-04-02 | 株式会社半導体エネルギー研究所 | 半導体装置及び半導体装置の作製方法 |
| WO2009148001A1 (en) * | 2008-06-06 | 2009-12-10 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| KR102026604B1 (ko) | 2008-07-10 | 2019-10-01 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 전자 기기 |
| JP2010041040A (ja) * | 2008-07-10 | 2010-02-18 | Semiconductor Energy Lab Co Ltd | 光電変換装置および光電変換装置の製造方法 |
| WO2010032573A1 (en) | 2008-09-17 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| WO2010032611A1 (en) | 2008-09-19 | 2010-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| WO2010035625A1 (en) * | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semi conductor device |
| WO2010035627A1 (en) * | 2008-09-25 | 2010-04-01 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| CN102460722B (zh) * | 2009-06-05 | 2015-04-01 | 株式会社半导体能源研究所 | 光电转换装置及其制造方法 |
| WO2010140522A1 (en) * | 2009-06-05 | 2010-12-09 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and manufacturing method thereof |
| KR101677076B1 (ko) * | 2009-06-05 | 2016-11-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 광전 변환 디바이스 및 그 제조 방법 |
| TWI517268B (zh) * | 2009-08-07 | 2016-01-11 | 半導體能源研究所股份有限公司 | 端子構造的製造方法和電子裝置的製造方法 |
| JP5719560B2 (ja) * | 2009-10-21 | 2015-05-20 | 株式会社半導体エネルギー研究所 | 端子構造の作製方法 |
| KR101473684B1 (ko) * | 2009-12-25 | 2014-12-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| EP3124236A1 (en) | 2011-06-17 | 2017-02-01 | Fiberweb, Inc. | Vapor permeable, substantially water impermeable multilayer article |
| US10369769B2 (en) | 2011-06-23 | 2019-08-06 | Fiberweb, Inc. | Vapor-permeable, substantially water-impermeable multilayer article |
| EP2723568B1 (en) | 2011-06-23 | 2017-09-27 | Fiberweb, LLC | Vapor permeable, substantially water impermeable multilayer article |
| EP2723567A4 (en) | 2011-06-24 | 2014-12-24 | Fiberweb Inc | MULTILAYER ARTICLE PERMEABLE TO WATER VAPOR, BUT ESSENTIALLY WATERPROOF |
| DE102013210668A1 (de) * | 2013-06-07 | 2014-12-11 | Würth Elektronik GmbH & Co. KG | Verfahren zur Herstellung eines optischen Moduls |
| EP3146475B1 (en) | 2014-05-23 | 2022-11-16 | Avery Dennison Retail Information Services LLC | Merchandise tags incorporating a durable antenna |
| CN109808280B (zh) * | 2018-12-27 | 2021-11-05 | 浙江华正新材料股份有限公司 | 一种芳纶布高强度高柔韧性覆铜板的制备方法 |
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| JPH0633020B2 (ja) * | 1988-03-04 | 1994-05-02 | シチズン時計株式会社 | 樹脂封止方法 |
| EP0541795B1 (en) | 1989-01-25 | 1998-04-01 | Asahi Kasei Kogyo Kabushiki Kaisha | New prepreg and composite molding, and production of composite molding |
| DE3907757A1 (de) | 1989-03-10 | 1990-09-13 | Mtu Muenchen Gmbh | Schutzfolie |
| JPH05190582A (ja) | 1992-01-08 | 1993-07-30 | Oki Electric Ind Co Ltd | 樹脂封止半導体装置及びその製造方法 |
| JP3024399B2 (ja) | 1992-11-13 | 2000-03-21 | 松下電器産業株式会社 | 半導体集積回路 |
| JP3523718B2 (ja) | 1995-02-06 | 2004-04-26 | 株式会社ルネサステクノロジ | 半導体装置 |
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| US5757456A (en) | 1995-03-10 | 1998-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of fabricating involving peeling circuits from one substrate and mounting on other |
| CN1107922C (zh) | 1995-06-16 | 2003-05-07 | 罗姆股份有限公司 | 半导体器件,使用同样器件的ic卡和通信系统 |
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| KR101148653B1 (ko) | 2002-10-18 | 2012-05-23 | 심볼테크놀로지스,인코포레이티드 | 수동 ｒｆｉｄ 태그의 원치않는 재교섭을 최소화시키는시스템 및 방법 |
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| JP4864649B2 (ja) * | 2005-11-11 | 2012-02-01 | 株式会社半導体エネルギー研究所 | 機能性を有する層、及びそれを有する可撓性基板の形成方法、並びに半導体装置の作製方法 |
| JP4831312B2 (ja) * | 2006-01-17 | 2011-12-07 | 大日本印刷株式会社 | 非接触ｉｃタグの製造方法 |
| CN101401112B (zh) | 2006-03-10 | 2013-01-02 | 株式会社半导体能源研究所 | 半导体器件 |
| CN101385039B (zh) | 2006-03-15 | 2012-03-21 | 株式会社半导体能源研究所 | 半导体器件 |
| TWI431726B (zh) | 2006-06-01 | 2014-03-21 | 半導體能源研究所股份有限公司 | 非揮發性半導體記憶體裝置 |
| CN101479747B (zh) | 2006-06-26 | 2011-05-18 | 株式会社半导体能源研究所 | 包括半导体器件的纸及其制造方法 |
| KR101349880B1 (ko) | 2006-10-02 | 2014-01-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 |
-
2008
- 2008-08-22 JP JP2008213553A patent/JP5248240B2/ja not_active Expired - Fee Related
- 2008-08-26 KR KR1020080083443A patent/KR101545650B1/ko not_active Expired - Fee Related
- 2008-08-29 US US12/230,484 patent/US7759788B2/en not_active Expired - Fee Related
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