JP2008536336A5 - - Google Patents
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- Publication number
- JP2008536336A5 JP2008536336A5 JP2008506611A JP2008506611A JP2008536336A5 JP 2008536336 A5 JP2008536336 A5 JP 2008536336A5 JP 2008506611 A JP2008506611 A JP 2008506611A JP 2008506611 A JP2008506611 A JP 2008506611A JP 2008536336 A5 JP2008536336 A5 JP 2008536336A5
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- trench
- forming
- select
- random access
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009792 diffusion process Methods 0.000 claims 14
- 238000000034 method Methods 0.000 claims 14
- 239000004065 semiconductor Substances 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 11
- 150000004767 nitrides Chemical class 0.000 claims 5
- 239000004020 conductor Substances 0.000 claims 4
- 238000002955 isolation Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 238000005468 ion implantation Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 229920005591 polysilicon Polymers 0.000 claims 1
- 229910021332 silicide Inorganic materials 0.000 claims 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/907,686 | 2005-04-12 | ||
| US10/907,686 US7816728B2 (en) | 2005-04-12 | 2005-04-12 | Structure and method of fabricating high-density trench-based non-volatile random access SONOS memory cells for SOC applications |
| PCT/US2006/013561 WO2006110781A2 (en) | 2005-04-12 | 2006-04-12 | Structure and method of fabricating high-density, trench-based non-volatile random access sonos memory cells for soc applications |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008536336A JP2008536336A (ja) | 2008-09-04 |
| JP2008536336A5 true JP2008536336A5 (enExample) | 2009-02-19 |
| JP5241485B2 JP5241485B2 (ja) | 2013-07-17 |
Family
ID=37082387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008506611A Expired - Fee Related JP5241485B2 (ja) | 2005-04-12 | 2006-04-12 | Soc用途のための高密度トレンチ・ベース不揮発性ランダム・アクセスsonosメモリ・セルの構造及びこれを製造する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7816728B2 (enExample) |
| EP (1) | EP1869709A4 (enExample) |
| JP (1) | JP5241485B2 (enExample) |
| CN (1) | CN101147263A (enExample) |
| TW (1) | TW200707765A (enExample) |
| WO (1) | WO2006110781A2 (enExample) |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US7514323B2 (en) * | 2005-11-28 | 2009-04-07 | International Business Machines Corporation | Vertical SOI trench SONOS cell |
| JP5164333B2 (ja) * | 2005-12-28 | 2013-03-21 | オンセミコンダクター・トレーディング・リミテッド | 半導体装置 |
| JP2007201220A (ja) * | 2006-01-27 | 2007-08-09 | Mitsubishi Electric Corp | 半導体装置 |
| US8614124B2 (en) | 2007-05-25 | 2013-12-24 | Cypress Semiconductor Corporation | SONOS ONO stack scaling |
| US9299568B2 (en) | 2007-05-25 | 2016-03-29 | Cypress Semiconductor Corporation | SONOS ONO stack scaling |
| US7951666B2 (en) | 2007-10-16 | 2011-05-31 | International Business Machines Corporation | Deep trench capacitor and method |
| US9431549B2 (en) | 2007-12-12 | 2016-08-30 | Cypress Semiconductor Corporation | Nonvolatile charge trap memory device having a high dielectric constant blocking region |
| US8120095B2 (en) * | 2007-12-13 | 2012-02-21 | International Business Machines Corporation | High-density, trench-based non-volatile random access SONOS memory SOC applications |
| DE102008007002B4 (de) * | 2008-01-31 | 2013-03-28 | Advanced Micro Devices, Inc. | Verfahren zum Bilden von Substratkontakten für moderne SOI-Bauelemente auf der Grundlage einer tiefen Grabenkondensatorkonfiguration |
| US7919387B2 (en) * | 2008-03-17 | 2011-04-05 | International Business Machines Corporation | Structure and method for manufacturing memory |
| JP5316532B2 (ja) * | 2008-03-31 | 2013-10-16 | 富士通セミコンダクター株式会社 | 半導体装置 |
| US8081515B2 (en) * | 2008-04-04 | 2011-12-20 | Trom | Trench monos memory cell and array |
| KR20100098147A (ko) * | 2009-02-27 | 2010-09-06 | 삼성전자주식회사 | 한 쌍의 채널이 게이트 양 측면에서 수직으로 형성되는 트렌치형 셀 구조와, 상기 채널을 셸로우 이온주입으로 코딩하는 마스크롬 셀 제조방법 |
| US9102522B2 (en) | 2009-04-24 | 2015-08-11 | Cypress Semiconductor Corporation | Method of ONO integration into logic CMOS flow |
| US8071453B1 (en) | 2009-04-24 | 2011-12-06 | Cypress Semiconductor Corporation | Method of ONO integration into MOS flow |
| KR20110045632A (ko) * | 2009-10-27 | 2011-05-04 | 삼성전자주식회사 | 반도체 칩, 스택 모듈 및 메모리 카드 |
| GB2475561A (en) * | 2009-11-24 | 2011-05-25 | Nano Eprint Ltd | Planar electronic devices |
| JP2011134981A (ja) * | 2009-12-25 | 2011-07-07 | Sanyo Electric Co Ltd | 不揮発性半導体記憶装置及びその製造方法 |
| US9608119B2 (en) | 2010-03-02 | 2017-03-28 | Micron Technology, Inc. | Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structures |
| US9646869B2 (en) | 2010-03-02 | 2017-05-09 | Micron Technology, Inc. | Semiconductor devices including a diode structure over a conductive strap and methods of forming such semiconductor devices |
| US8507966B2 (en) | 2010-03-02 | 2013-08-13 | Micron Technology, Inc. | Semiconductor cells, arrays, devices and systems having a buried conductive line and methods for forming the same |
| US8692381B1 (en) * | 2011-01-06 | 2014-04-08 | Xilinx, Inc. | Integrated circuits with a resistance to single event upset occurrence and methods for providing the same |
| US8598621B2 (en) | 2011-02-11 | 2013-12-03 | Micron Technology, Inc. | Memory cells, memory arrays, methods of forming memory cells, and methods of forming a shared doped semiconductor region of a vertically oriented thyristor and a vertically oriented access transistor |
| US8435859B2 (en) | 2011-02-16 | 2013-05-07 | Micron Technology, Inc. | Methods of forming electrical contacts |
| US8952418B2 (en) | 2011-03-01 | 2015-02-10 | Micron Technology, Inc. | Gated bipolar junction transistors |
| US8519431B2 (en) | 2011-03-08 | 2013-08-27 | Micron Technology, Inc. | Thyristors |
| US8518812B2 (en) | 2011-05-23 | 2013-08-27 | Micron Technology, Inc. | Methods of forming electrical contacts |
| US8421127B2 (en) * | 2011-07-15 | 2013-04-16 | Windbond Electronics Corp. | Semiconductor device and method for fabricating the same |
| US8772848B2 (en) | 2011-07-26 | 2014-07-08 | Micron Technology, Inc. | Circuit structures, memory circuitry, and methods |
| CN103022041B (zh) * | 2011-09-22 | 2015-10-14 | 上海华虹宏力半导体制造有限公司 | Sonos非挥发性存储器 |
| CN103137194A (zh) * | 2011-11-23 | 2013-06-05 | 上海华虹Nec电子有限公司 | 闪存存储器的存储单元电路结构 |
| US9006100B2 (en) * | 2012-08-07 | 2015-04-14 | Globalfoundries Inc. | Middle-of-the-line constructs using diffusion contact structures |
| US8796098B1 (en) * | 2013-02-26 | 2014-08-05 | Cypress Semiconductor Corporation | Embedded SONOS based memory cells |
| US20150171104A1 (en) | 2013-12-12 | 2015-06-18 | Cypress Semiconductor Corporation | Complementary sonos integration into cmos flow |
| US9508844B2 (en) * | 2014-01-06 | 2016-11-29 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor arrangement and formation thereof |
| US8916432B1 (en) | 2014-01-21 | 2014-12-23 | Cypress Semiconductor Corporation | Methods to integrate SONOS into CMOS flow |
| US9349634B2 (en) * | 2014-02-21 | 2016-05-24 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor arrangement and formation thereof |
| US9209187B1 (en) | 2014-08-18 | 2015-12-08 | Micron Technology, Inc. | Methods of forming an array of gated devices |
| US9224738B1 (en) | 2014-08-18 | 2015-12-29 | Micron Technology, Inc. | Methods of forming an array of gated devices |
| US9673054B2 (en) | 2014-08-18 | 2017-06-06 | Micron Technology, Inc. | Array of gated devices and methods of forming an array of gated devices |
| KR102298775B1 (ko) * | 2015-01-21 | 2021-09-07 | 에스케이하이닉스 주식회사 | 싱글 폴리 비휘발성 메모리 소자 및 그 제조방법 |
| JP6466211B2 (ja) * | 2015-03-11 | 2019-02-06 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| US9484431B1 (en) * | 2015-07-29 | 2016-11-01 | International Business Machines Corporation | Pure boron for silicide contact |
| FR3059458B1 (fr) | 2016-11-25 | 2019-03-29 | Stmicroelectronics (Rousset) Sas | Dispositif compact de memoire non volatile du type a piegeages de charge dans une interface dielectrique |
| WO2019005135A1 (en) * | 2017-06-30 | 2019-01-03 | Intel Corporation | USE OF TRENCH CONTACT IN DEADLY MEMORY PROGRAMMING |
| JP2019102520A (ja) * | 2017-11-29 | 2019-06-24 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| CN108269808B (zh) * | 2018-01-11 | 2020-09-25 | 上海华虹宏力半导体制造有限公司 | Sonos器件及其制造方法 |
| CN108878439A (zh) * | 2018-06-29 | 2018-11-23 | 上海华虹宏力半导体制造有限公司 | Sonos非挥发性存储器及其制造方法 |
| TWI679752B (zh) * | 2018-12-18 | 2019-12-11 | 力晶積成電子製造股份有限公司 | 記憶體元件及其製造方法 |
| US10991702B2 (en) * | 2019-05-15 | 2021-04-27 | Nanya Technology Corporation | Semiconductor device and method of preparing the same |
| CN111403400B (zh) * | 2020-03-31 | 2023-05-26 | 长江存储科技有限责任公司 | 存储器的阵列共源极及其形成方法 |
| TWI745919B (zh) * | 2020-04-08 | 2021-11-11 | 旺宏電子股份有限公司 | 記憶體元件 |
| US11393836B2 (en) | 2020-11-18 | 2022-07-19 | Sandisk Technologies Llc | Three-dimensional memory device with separated source-side lines and method of making the same |
| US11889684B2 (en) | 2020-11-18 | 2024-01-30 | Sandisk Technologies Llc | Three-dimensional memory device with separated source-side lines and method of making the same |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4875570U (enExample) * | 1971-12-20 | 1973-09-19 | ||
| US5051917A (en) * | 1987-02-24 | 1991-09-24 | International Business Machines Corporation | Method of combining gate array and standard cell circuits on a common semiconductor chip |
| US5386132A (en) | 1992-11-02 | 1995-01-31 | Wong; Chun C. D. | Multimedia storage system with highly compact memory device |
| US5313419A (en) * | 1993-02-01 | 1994-05-17 | National Semiconductor Corporation | Self-aligned trench isolation scheme for select transistors in an alternate metal virtual ground (AMG) EPROM array |
| US5387534A (en) | 1994-05-05 | 1995-02-07 | Micron Semiconductor, Inc. | Method of forming an array of non-volatile sonos memory cells and array of non-violatile sonos memory cells |
| US5598367A (en) | 1995-06-07 | 1997-01-28 | International Business Machines Corporation | Trench EPROM |
| US5885863A (en) * | 1997-03-31 | 1999-03-23 | Kabushiki Kaisha Toshiba | Method of making a contact for contacting an impurity region formed in a semiconductor substrate |
| JP3743189B2 (ja) * | 1999-01-27 | 2006-02-08 | 富士通株式会社 | 不揮発性半導体記憶装置及びその製造方法 |
| KR100364803B1 (ko) * | 2000-11-15 | 2002-12-16 | 주식회사 하이닉스반도체 | 비휘발성 메모리 제조 방법 |
| US6509216B2 (en) * | 2001-03-07 | 2003-01-21 | United Microelectronics Corp. | Memory structure with thin film transistor and method for fabricating the same |
| TW546778B (en) * | 2001-04-20 | 2003-08-11 | Koninkl Philips Electronics Nv | Two-transistor flash cell |
| TW484213B (en) * | 2001-04-24 | 2002-04-21 | Ememory Technology Inc | Forming method and operation method of trench type separation gate nonvolatile flash memory cell structure |
| US6933556B2 (en) | 2001-06-22 | 2005-08-23 | Fujio Masuoka | Semiconductor memory with gate at least partially located in recess defined in vertically oriented semiconductor layer |
| US6680230B2 (en) * | 2001-07-25 | 2004-01-20 | Kabushiki Kaisha Toshiba | Semiconductor device and method of fabricating the same |
| JP4665368B2 (ja) * | 2001-09-20 | 2011-04-06 | ソニー株式会社 | 不揮発性半導体メモリ装置、その動作方法および半導体装置の製造方法 |
| JP2003209188A (ja) * | 2002-01-17 | 2003-07-25 | Sony Corp | 半導体装置の製造方法 |
| JP2003281897A (ja) * | 2002-03-26 | 2003-10-03 | Hitachi Ltd | 不揮発性メモリ、半導体集積回路およびその製造方法 |
| US6853587B2 (en) | 2002-06-21 | 2005-02-08 | Micron Technology, Inc. | Vertical NROM having a storage density of 1 bit per 1F2 |
| DE10231966A1 (de) * | 2002-07-15 | 2004-02-12 | Infineon Technologies Ag | Feldeffekttransistor, zugehörige Verwendung und zugehöriges Herstellungsverfahren |
| US6894339B2 (en) | 2003-01-02 | 2005-05-17 | Actrans System Inc. | Flash memory with trench select gate and fabrication process |
| US6787419B2 (en) | 2003-01-14 | 2004-09-07 | Ememory Technology Inc. | Method of forming an embedded memory including forming three silicon or polysilicon layers |
| US7118967B1 (en) * | 2003-02-19 | 2006-10-10 | Spansion, Llc | Protection of charge trapping dielectric flash memory devices from UV-induced charging in BEOL processing |
| TW586221B (en) | 2003-03-20 | 2004-05-01 | Powerchip Semiconductor Corp | Flash memory with selective gate within a substrate and method of fabricating the same |
-
2005
- 2005-04-12 US US10/907,686 patent/US7816728B2/en not_active Expired - Lifetime
-
2006
- 2006-04-10 TW TW095112633A patent/TW200707765A/zh unknown
- 2006-04-12 JP JP2008506611A patent/JP5241485B2/ja not_active Expired - Fee Related
- 2006-04-12 CN CNA2006800097797A patent/CN101147263A/zh active Pending
- 2006-04-12 EP EP06749815A patent/EP1869709A4/en not_active Withdrawn
- 2006-04-12 WO PCT/US2006/013561 patent/WO2006110781A2/en not_active Ceased
-
2007
- 2007-10-30 US US11/928,615 patent/US7807526B2/en not_active Expired - Fee Related
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