JP2008506246A - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP2008506246A JP2008506246A JP2006554399A JP2006554399A JP2008506246A JP 2008506246 A JP2008506246 A JP 2008506246A JP 2006554399 A JP2006554399 A JP 2006554399A JP 2006554399 A JP2006554399 A JP 2006554399A JP 2008506246 A JP2008506246 A JP 2008506246A
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- 238000007789 sealing Methods 0.000 claims abstract description 241
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 230000007423 decrease Effects 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims description 96
- 239000003566 sealing material Substances 0.000 claims description 31
- 229920001296 polysiloxane Polymers 0.000 claims description 22
- 230000009477 glass transition Effects 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 claims description 14
- 230000004907 flux Effects 0.000 abstract description 14
- 239000010410 layer Substances 0.000 description 164
- 239000003822 epoxy resin Substances 0.000 description 33
- 229920000647 polyepoxide Polymers 0.000 description 33
- 229920005989 resin Polymers 0.000 description 26
- 239000011347 resin Substances 0.000 description 26
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 17
- 238000005286 illumination Methods 0.000 description 14
- 238000002834 transmittance Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 229920002050 silicone resin Polymers 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 235000019353 potassium silicate Nutrition 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 3
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 2
- 239000004956 Amodel Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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Abstract
【解決手段】発光素子4と、発光素子4を覆う透光性の封止部と、発光素子4が実装された多層基板6と、多層基板6の上に配置された反射板7とを備え、前記封止部は、発光素子4の外面を覆う第1の封止層1と、第1の封止層1を覆う第2の封止層2と、第2の封止層2を覆う第3の封止層3とを含み、反射板7は、発光素子4の周囲を囲み、第3の封止層3は、反射板7を覆い、かつ多層基板6と密着している発光装置とする。
【選択図】図1
Description
ため、黄変などの現象が生じにくい。
イロン樹脂、ポリカーボネート、アクリル樹脂などを用いることができる。
図1は、本発明の発光装置の一例である砲弾型LEDの断面図である。本発光装置は、発光素子4の外面が第1の透光性材料からなる第1の封止層1で覆われ、第1の封止層1の周囲が第2の透光性材料からなる第2の封止層2で覆われ、第2の封止層2の周囲が第3の透光性材料からなる第3の封止層3で覆われている。即ち、本発光装置の封止部は、第1の封止層1と、第2の封止層2と、第3の封止層3とからなる三層構造を有している。
図2は、本発明の発光装置の他の一例である白色LEDの断面図である。本発光装置は、発光素子4の外面が第1の封止層1で覆われ、第1の封止層1の周囲が第2の封止層2で覆われ、第2の封止層2が第3の封止層3で覆われている。即ち、本発光装置の封止部は、第1の封止層1と、第2の封止層2と、第3の封止層3とからなる三層構造を有している。また、第2の封止層2は、光を集光するために凸レンズ状に形成されている。
。
図3は、本発明の発光装置の一例である他の白色LEDの断面図である。本実施形態の
発光装置は、発光素子4の実装方式をフリップチップタイプ(実施形態2)から、シリコンサブマウント方式に変更した以外は、実施形態2の発光装置と同様である。図3において、9は裏面電極、10はワイヤーであり、実施形態2と共通する部材には同一の符号を付けてその説明は省略する。
図4は、本発明の発光装置の一例である他の白色LEDの断面図である。本実施形態の発光装置は、第2の封止層2の形状を凸レンズ形状から、凹レンズ形状に変更した以外は、実施形態2の発光装置と同様である。図4において、実施形態2と共通する部材には同一の符号を付けてその説明は省略する。
図5は、本発明の発光装置の一例である他の白色LEDの断面図である。本実施形態の発光装置は、第2の封止層2の形状を凸レンズ形状から、フラット形状に変更した以外は、実施形態2の発光装置と同様である。図5において、実施形態2と共通する部材には同一の符号を付けてその説明は省略する。
図6は、本発明の発光装置の一例である他の白色LEDの断面図である。本実施形態の発光装置は、第2の封止層2が反射板7の上面まで覆っている以外は、実施形態5の発光装置と同様である。図6において、実施形態5と共通する部材には同一の符号を付けてその説明は省略する。
図7は、本発明の発光装置の一例である他の白色LEDの断面図である。本実施形態の発光装置は、第3の封止層3の形状をフラット形状から、凸レンズ形状に変更した以外は、実施形態5と同様である。図7において、実施形態5と共通する部材には同一の符号を付けてその説明は省略する。
図8は、本発明の発光装置の一例である他の白色LEDの断面図である。本実施形態の発光装置では、第1の封止層1の中には赤色蛍光体11が含まれ、第2の封止層2の中には緑色蛍光体12が含まれ、第3の封止層3の中には青色蛍光体13が含まれている。
は、例えばBaMgAl10O17:Eu2+,Mn2+など、青色蛍光体13としては、例えばBaMgAl10O17:Eu2+などを用いることができる。
色度座標を有する光を取り出すことができる。
図9は、本発明の発光装置の一例である他の白色LEDを用いた照明モジュールの断面図である。本実施形態の発光装置は、実施形態3の白色LEDを平面基板上に複数実装することにより、高出力の照明モジュールとしたものである。但し、本実施形態では、第2の封止層2は凸レンズ状に形成しなかった。図9において、実施形態3と共通する部材の説明は省略する。
三層構造の白色LEDを64個用いた図9と同様の構造の照明モジュールを作製した。即ち、本実施例の照明モジュールは、第3の封止層3によって、多層基板6上の発光素子4、第1の封止層1、第2の封止層2及び反射板7の全てが覆われ、かつ反射板7の最外周部14において第3の封止層3と多層基板6とを密着させた構造とした。
第2の透光性材料として、GE東芝シリコーン社製のシリコーン樹脂(ガラス転移温度:60℃)を用いた以外は、実施例1と同様にして照明モジュールを作製した。
実施例1で用いたビスフェノールA型エポキシ樹脂を用いて第2の封止層2と第3の封止層3とを区別することなく単一層として形成し、第1の封止層1と合わせて二層構造の封止部とした以外は、実施例1と同様にして照明モジュールを作製した。
実施例1において第2の透光性材料として用いた変性エポキシ樹脂のガラス転移温度を変化させた以外は、実施例1と同様にして照明モジュールを作製した。
Claims (20)
- 発光素子と、前記発光素子を覆う透光性の封止部とを備えた発光装置であって、
前記封止部は、前記発光素子の外面を覆う第1の封止層と、前記第1の封止層を覆う第2の封止層と、前記第2の封止層を覆う第3の封止層とを含むことを特徴とする発光装置。 - 前記発光装置は、前記発光素子が実装された基板と、前記基板の上に配置された反射部材とをさらに含み、
前記反射部材は、前記発光素子の周囲を囲み、
前記第3の封止層は、前記反射部材を覆い、かつ前記基板と密着している請求項1に記載の発光装置。 - 前記第2の封止層は、ガラス転移温度が100℃以上の透光性材料から形成されている請求項1に記載の発光装置。
- 前記第1の封止層、前記第2の封止層及び前記第3の封止層から選ばれた少なくとも1つの封止層は、前記発光素子が放つ光によって励起されて発光する蛍光材料を含む請求項1に記載の発光装置。
- 前記第1の封止層は、シリコーン材料から形成されている請求項1に記載の発光装置。
- 前記第2の封止層は、シリコーン材料又はエポキシ材料から形成されている請求項1に記載の発光装置。
- 前記第3の封止層は、エポキシ材料から形成されている請求項1に記載の発光装置。
- 前記第1の封止層を形成する封止材料の線膨張係数と、前記第2の封止層を形成する封止材料の線膨張係数とは、ほぼ等しい請求項1に記載の発光装置。
- 前記第2の封止層を形成する封止材料の線膨張係数と、前記第3の封止層を形成する封止材料の線膨張係数とは、ほぼ等しい請求項1に記載の発光装置。
- 前記第3の封止層の屈折率、前記第2の封止層の屈折率及び前記第1の封止層の屈折率は、前記第3の封止層から前記第1の封止層に向ってこの順番に順次低くなる請求項1に記載の発光装置。
- 前記発光装置は、前記発光素子を複数含む請求項1に記載の発光装置。
- 基板と、前記基板の上に実装された複数の発光素子と、前記発光素子を覆う透光性の封止部と、前記発光素子の周囲を囲むように配置された反射部材とを備えた発光装置であって、
前記封止部は、前記発光素子の外面を覆う第1の封止層と、前記第1の封止層を覆う第2の封止層と、前記第2の封止層を覆う第3の封止層とを含み、
前記第3の封止層は、前記反射部材を覆い、かつ前記基板と密着していることを特徴とする発光装置。 - 前記第2の封止層は、ガラス転移温度が100℃以上の透光性材料から形成されている請求項12に記載の発光装置。
- 前記第1の封止層、前記第2の封止層及び前記第3の封止層から選ばれた少なくとも1つの封止層は、前記発光素子が放つ光によって励起されて発光する蛍光材料を含む請求項12に記載の発光装置。
- 前記第1の封止層は、シリコーン材料から形成されている請求項12に記載の発光装置。
- 前記第2の封止層は、シリコーン材料又はエポキシ材料から形成されている請求項12に記載の発光装置。
- 前記第3の封止層は、エポキシ材料から形成されている請求項12に記載の発光装置。
- 前記第1の封止層を形成する封止材料の線膨張係数と、前記第2の封止層を形成する封止材料の線膨張係数とは、ほぼ等しい請求項12に記載の発光装置。
- 前記第2の封止層を形成する封止材料の線膨張係数と、前記第3の封止層を形成する封止材料の線膨張係数とは、ほぼ等しい請求項12に記載の発光装置。
- 前記第3の封止層の屈折率、前記第2の封止層の屈折率及び前記第1の封止層の屈折率は、前記第3の封止層から前記第1の封止層に向ってこの順番に順次低くなる請求項12に記載の発光装置。
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Also Published As
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TW200614548A (en) | 2006-05-01 |
WO2006006544A1 (en) | 2006-01-19 |
US20070182323A1 (en) | 2007-08-09 |
EP1766696A1 (en) | 2007-03-28 |
EP1766696B1 (en) | 2014-03-05 |
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