JP2008291348A - 接続端子、接続端子を用いた半導体パッケージ及び半導体パッケージの製造方法 - Google Patents
接続端子、接続端子を用いた半導体パッケージ及び半導体パッケージの製造方法 Download PDFInfo
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- JP2008291348A JP2008291348A JP2008097381A JP2008097381A JP2008291348A JP 2008291348 A JP2008291348 A JP 2008291348A JP 2008097381 A JP2008097381 A JP 2008097381A JP 2008097381 A JP2008097381 A JP 2008097381A JP 2008291348 A JP2008291348 A JP 2008291348A
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- Prior art keywords
- plating film
- connection terminal
- palladium
- electroless
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/1651—Two or more layers only obtained by electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H—ELECTRICITY
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Abstract
【解決手段】 導体層2と、無電解ニッケルめっき皮膜3と、純度が99質量%以上の置換又は無電解パラジウムめっき皮膜である第1のパラジウムめっき皮膜4と、純度が90質量%以上99質量%未満の無電解パラジウムめっき皮膜である第2のパラジウムめっき皮膜5と、置換金めっき皮膜6と、を有し、無電解ニッケルめっき皮膜3、第1のパラジウムめっき皮膜4、第2のパラジウムめっき皮膜5及び置換金めっき皮膜6が導体層2の一方面側においてこの順序に積層され、置換金めっき皮膜6が導体層2とは反対側の最表層に位置している、接続端子110,111。
【選択図】図1
Description
図1は、半導体チップ搭載基板の一実施形態を示す平面図又は断面図である。図1(a)は、半導体チップ搭載用基板を第1の主面側から模式的に示した平面図である。図1(b)は、図1(a)のb−b線に沿った断面図である。図1(c)は、図1(a)のc−c線に沿った断面図である。図1に示される半導体チップ搭載用基板1aは、プリント配線板50と、プリント配線板50を構成する絶縁層であるコア基板100の一表面上に設けられたはんだ接続用接続端子111及び絶縁層109とを備える。プリント配線板50は、コア基板100の他の表面上に設けられた開口部118aを有する絶縁層118と、開口部118a内に配置された複数のワイヤボンディング用接続端子110と、展開配線40と、を備える。
アルミニウム、ホウ酸アルミニウム、窒化アルミニウム、アルミナ等が挙げられる。
ミニウム、ホウ酸アルミニウム、窒化アルミニウム、アルミナ等が挙げられる。
半導体チップ搭載用基板の製造方法の一実施形態を以下に説明する。
工程aでは、図6(a)に示すようにワイヤボンディング用接続端子110を含む第1の配線106aをコア基板100の第1の主面上に形成する。第1の配線106aを構成するパターン化された配線である銅層の一部の表面上に上述のめっき処理を施してワイヤボンディング用接続端子110が形成される。コア基板上の銅層は、コア基板表面にスパッタリング、蒸着、めっき等により銅薄膜を形成した後、電解銅めっき法によって、その膜厚を所望の厚みまでめっきする方法により形成される。
サブトラクト法では、コア基板100の表面上に銅箔を形成した後、銅箔の不要な部分をエッチングにより除去する。銅箔の配線となる箇所、すなわち第1の配線106aとなる部分上にエッチングレジストを形成し、エッチングレジストから露出した箇所に、化学エッチング液をスプレー噴霧し、不要な金属箔をエッチング除去して、第1の配線106aを形成することができる。エッチングレジストは、通常の配線板に用いることのできるエッチングレジスト材料を用いることができる。エッチングレジストは、レジストインクをシルクスクリーン印刷することや、エッチングレジスト用ネガ型感光性ドライフィルムを銅箔の上にラミネートし、その上に配線形状に光を透過するフォトマスクを重ね、紫外線で露光して、露光しなかった箇所を現像液で除去することにより形成することができる。化学エッチング液には、塩化第二銅と塩酸の溶液、塩化第二鉄溶液、硫酸と過酸化水素の溶液、過硫酸アンモニウム溶液等、通常の配線板に用いる化学エッチング液を用いることができる。
アディティブ法では、コア基板100表面上の必要な箇所に、めっきを行うことで第1の配線106aを形成することができる。例えば、コア基板100の表面上に無電解めっき用触媒を付着させた後、めっきが行われない表面部分にめっきレジストを形成する。その後、めっきレジストを形成したコア基板100を無電解めっき液に浸漬して、めっきレジストに覆われていない箇所にのみ、無電解めっきで銅配線及び銅端子を形成することができる。
セミアディティブ法では、コア基板100の表面上に、シード層を形成した後、めっきレジストを必要なパターンに形成し、電解めっきにより第1の配線106aを形成する。その後、めっきレジストを剥離し、シード層をエッチングによって除去する。シード層を形成する方法としては、(a)蒸着による方法、(b)めっきによる方法、(c)金属箔を貼り合わせる方法等がある。なお、これらの方法により、サブトラクト法の金属箔を形成することもできる。
工程bでは、図6(b)に示すように、ワイヤボンディング用接続端子110と、後述する第2の配線106bとを接続するための第1の層間接続用IVH102を形成する。
工程cでは、図6(c)に示すように、コア基板100の第1の配線106aが形成された第1の主面と反対側の第2の主面に第2の配線106b及び第2の層間接続端子103を形成する。第2の配線106b及び第2の層間接続端子103は、第1の配線106a及びワイヤボンディング用接続端子(第1の層間接続端子)110と同様にして、コア基板100の表面上に形成することができる。
工程dでは、図6(d)に示すように上記第2の配線106bを形成した面に第1のビルドアップ層(層間絶縁層)104aを形成する。
工程eは、図6(e)に示すように、上記第1のビルドアップ層104aに第2の層間接続用IVH108b用の貫通孔108aを形成する工程である。第2のバイアホール108bの貫通孔108aの形成手段としては、一般的なレーザ穴あけ装置を使用することができる。レーザ穴あけ機で用いられるレーザの種類はCO2レーザ、YAGレーザ、エキシマレーザ等を用いることができるが、CO2レーザが生産性及び穴品質の点で好ましい。また、IVH穴108aの径が30μm未満の場合は、レーザ光を絞ることが可能なYAGレーザが適している。また、ビルドアップ層が有機溶剤等の薬液による化学エッチング加工が可能な材料からなる場合には、化学エッチングによってIVH穴を形成することができる。
工程fでは、図6(f)に示すように、上記第1のビルドアップ層104aの表面上に、第3の層間接続端子112を含む第3の配線106cを形成する。第3の配線106c及び第3の層間接続端子112は、第1の配線106a及びワイヤボンディング用接続端子(第1の層間接続端子)110と同様にして形成することができる。また、第2の層間接続用のIVH(バイアホール)108bの導体層を、例えばめっき法によって形成する場合、第3の配線106cを形成するのと同時に形成することができる。
工程gでは、図6(f)に示すように第3の配線106cが形成された第1のビルドアップ層104aのコア基板100とは反対の面上に、第2のビルドアップ層104bを形成する。第2のビルドアップ層104bは第1のビルドアップ層104aと同様にして形成することができる。
上述のようにして得られた、コア基板100の第1の主面上の第1の配線106aの一部である接続端子110及び、第2の主面側の最表層の接続端子111に複数のめっき皮膜を積層させる。すなわち、第1の配線106a及びはんだ接続用接続端子の一部である導体の表面に、無電解ニッケルめっき皮膜、純度が99質量%以上の置換又は無電解パラジウムめっき皮膜である第1のパラジウムめっき皮膜、純度が90質量%以上99質量%未満の無電解パラジウムめっき皮膜である第2のパラジウムめっき皮膜、及び置換金めっき皮膜、或いはさらに無電解金めっき皮膜をこの順序で形成することにより、はんだ接続信頼性に優れた接続端子、さらにはワイヤボンディング接続信頼性に優れた接続端子を形成することができる。
配線や端子の表面に凹凸を形成する工程である。凹凸を形成する方法としては、(1)酸性溶液を用いる方法、(2)アルカリ性溶液を用いる方法、(3)酸化剤又は還元剤を有する処理液を用いる方法がある。以下、各方法について詳述する。
酸性溶液としては、塩酸、硫酸、硝酸、リン酸、酢酸、蟻酸、塩化第二銅、硫酸第二鉄などの化合物、アルカリ金属塩化物、過硫酸アンモニウム等から選ばれる化合物、又はこれらを組み合わせた化合物の水溶液、或いは、クロム酸、クロム酸−硫酸、クロム酸−フッ酸、重クロム酸、重クロム酸−ホウフッ酸などの酸性の6価クロムを含む水溶液を用いることができる。なお、これらの溶液の濃度及び処理時間については、銅配線及び銅端子の表面粗さがRaで0.01μm〜0.4μmとなるように適宜条件を選択して用いることが好ましい。
アルカリ性溶液としては、水酸化ナトリウム、水酸化カリウム、炭酸ナトリウム等のアルカリ金属やアルカリ土類金属の水酸化物溶液を用いることができる。なお、これらの溶液の濃度及び処理時間については、銅配線及び銅端子の表面粗さがRaで0.01μm〜0.4μmとなるように適宜条件を選択して用いることが好ましい。
酸化剤を含む処理液としては、亜塩素酸ナトリウムなどの酸化剤を含む水溶液を使用することができる。更に、OH陰イオン源及びリン酸三ナトリウムなどの緩衝剤を含むものが好ましい。還元剤を含む処理液としては、pH9.0から13.5に調整されたアルカリ性溶液中にホルムアルデヒド、パラホルムアルデヒド、芳香族アルデヒド化合物を添加した水溶液、又は次亜リン酸及び次亜リン酸塩などを含んだ水溶液を使用することができる。上記酸化剤を含む処理液に銅配線を浸漬し、銅表面に酸化銅皮膜を形成し、次いで、還元剤を含む処理液により酸化銅皮膜を還元し、銅配線表面に微細な凹凸形状を形成することができる。その場合、上記酸性溶液又はアルカリ性溶液を用いて処理を行った後に、組み合わせて処理を行うことが可能であり、表面粗さがRaで0.01〜0.4μmとなるように処理をすればよい。
凹凸を形成する工程(A)によって、銅配線及び銅端子の表面の表面粗さをRaで0.01〜0.4μmとした後、膜厚が5nm未満、0.4μm以下である、銅、スズ、クロム、ニッケル、亜鉛、アルミニウム、コバルト、金、白金、銀、パラジウムからなる群から選択される金属又は、該金属を含む合金からなる金属を連続的若しくは離散的に銅配線及び銅端子の表面に付着させることによって、表面粗さがRaで0.01〜0.4μmである金属コーティングで覆われた配線及び接続端子を形成できる。好ましくは、銅、スズ、クロム、ニッケル、亜鉛、アルミニウム、コバルトからなる群から選択される金属又は、該金属を含む合金が、銅配線及び銅端子の表面に付着する間又は付着後、自然に若しくは故意に、酸化物、水酸化物又はこれらを組み合わせた化合物に変換させられ、銅配線及び銅端子の表面に上記多価金属の酸化物、水酸化物又はこれらを組み合わせた化合物を含む層が形成されていることである。上記金属の他に、モリブデン、チタン、タングステン、鉛、鉄、インジウム、タリウム、ビスマス、ルテニウム、ロジウム、ガリウム、ゲルマニウム等の金属を使用することも可能で、これらを少なくとも2種類以上含む合金を用いることもできる。上記金属を配線及び接続端子表面に付着させる方法としては、無電解めっき、電解めっき、置換反応、スプレー噴霧、塗布、パッタリング法、蒸着法等が挙げられる。
Si−O−Si結合を形成する化合物を用いて銅配線及び銅端子の表面にSi−O−S
i結合を形成する工程である。Si−O−Si結合を有する化合物としては、(1)シリ
カガラス、(2)ラダー構造を含む化合物などを用いることができる。
シリカガラス(SiO2)の厚さは、0.002μm〜5μm、好ましくは0.005μm〜1μm、さらに好ましくは0.01μm〜0.2μmである。シリカガラスの厚みが5.0μmを超えると、バイアホール形成工程におけるレーザ等によるビア加工が困難となる傾向があり、0.002μmより薄くなると、シリカガラス層の形成が困難になる傾向がある。
ラダー構造を含む化合物は、下記一般式(1)で表されるラダー構造を含む化合物であって、式中、R1、R2、R3及びR4は、各々独立に、水素原子、反応性基、親水性基、疎水性基からなる群から選択される基を表す。
上記のSi−O−Si結合を有する化合物を配線表面に形成した後、さらに、カップリング剤を含む溶液を用いて、処理を行う工程である。カップリング剤を用いることによって、配線及び端子と層間絶縁層(ビルドアップ層)との密着強度を向上させることができる。
銅配線及び銅端子の表面にSi−O−Si結合を有する化合物を形成した後、TiO2,ZnO,SrTiO3,CdS,GaP,InP,GaAs,BaTiO3,BaTi4O9,K2NbO3,Nb2O5,Fe2O3,Ta2O5,K3Ta3Si2O3,WO3,SnO2,Bi2O3,BiVO4,NiO,Cu2O,SiC,MoS2,InPb,RuO2,CeO2等、さらにはTi,Nb,Ta,Vからなる群より選ばれる元素を有する層状酸化物である光触媒粒子を塗布する工程である。これらの光触媒の中で、無害かつ化学的安定性に優れるTiO2が最も好ましい。TiO2としては、アナタ−ゼ、ルチル、ブルッカイトのいずれも使用することが可能である。
きる。光照射には、紫外光、可視光、赤外光などを使用でき、このうち紫外光が最も好ま
しい。
銅配線及び銅端子の表面に、密着性改良剤を塗布する工程である。密着性改良剤としては、熱硬化性樹脂、熱可塑性樹脂、又はそれらの混合樹脂が使用できるが、熱硬化性の有機絶縁材料が主成分であることが好ましい。密着性改良剤としては、フェノール樹脂、尿素樹脂、メラミン樹脂、アルキド樹脂、アクリル樹脂、不飽和ポリエステル樹脂、ジアリルフタレート樹脂、エポキシ樹脂、ポリベンゾイミダゾール樹脂、ポリアミド樹脂、ポリアミドイミド樹脂、シリコーン樹脂、シクロペンタジエンから合成した樹脂、トリス(2−ヒドロキシエチル)イソシアヌラートを含む樹脂、芳香族ニトリルから合成した樹脂、3量化芳香族ジシアナミド樹脂、トリアリルトリメタリレートを含む樹脂、フラン樹脂、ケトン樹脂、キシレン樹脂、縮合多環芳香族を含む熱硬化性樹脂、ベンゾシクロブテン樹脂、フッ素樹脂、ポリイミド樹脂、ポリフェニレンオキサイド樹脂、ポリフェニレンサルファイド樹脂、アラミド樹脂、液晶ポリマ等が使用できる。
銅配線及び銅端子の表面に、腐食抑制剤を塗布する工程である。かかる工程は、凹凸を形成する工程(A)の後、又はカップリング処理を施す工程(D)の前、若しくは後、に行うことができる。なお、腐食抑制剤は上述の酸性溶液、アルカリ性溶液、カップリング剤溶液のいずれか1種に加えて用いてもよい。
図7は、半導体パッケージの一実施形態を示す模式断面図である。半導体パッケージ7aは、ワイヤボンドタイプの半導体パッケージである。半導体パッケージ7aは、上述した半導体チップ搭載用基板2aと、半導体チップ搭載用基板2aに搭載された半導体チップ120とを備える。
図9(a)は、本発明の半導体チップ搭載基板の一実施形態を示す模式平面図である。図9(b)は、図9(a)における領域Aの拡大図である。半導体チップ搭載基板9aの形状は、半導体パッケージの組み立てを効率よく行う観点から、図9(a)に示すようなフレーム形状にすることが好ましい。
ではない。
以下の工程により、図2の実施形態と同様の構成を有する半導体チップ搭載用基板を、図6に示す実施形態に係る製造方法に従って作製した。
コア基板100として厚さ0.4mmのソーダガラス基板(熱膨張係数11ppm/℃)を用意し、スパッタリングによりその片面に200nmの銅薄膜を形成した(以下、第1の主面という)。スパッタリングは、スパッタリング装置(日本真空技術株式会社製、MLH−6315)を用いて、下記条件1の下で行った。さらに、この銅薄膜上に電気銅めっきにより膜厚10μmの銅めっき層を形成した。その後、銅めっき層のうち配線を構成する部分を覆うエッチングレジストを形成し、塩化第二鉄エッチング液を用いてエッチングして、第1の配線106a(ワイヤボンディング用接続端子110を含む)を形成した。
条件1
電流:3.5A
電圧:500V
アルゴン流量:35SCCM
圧力:5×10−3Torr(4.9×10−2Pa)
成膜速度:5nm/秒
ソーダガラス基板の第1の配線106aとは反対側の面(以下、「第2の主面」という)側から、ワイヤボンディング用接続端子110に到達するまで、レーザによって直径が50μmである第1の層間接続用IVH102用の貫通穴を形成した(図6(b))。レーザにはYAGレーザLAVIA−UV2000(住友重機械工業株式会社製、商品名)を使用し、周波数4kHz、ショット数50、マスク径0.4mmの条件にて、貫通穴の形成を行った。形成された貫通穴に導電性ペーストMP−200V(日立化成工業株式会社製、商品名)を充填して、160℃、30分で硬化させ、ワイヤボンディング接続用端子110と電気的に接続された第1の層間接続用IVH102(図6(b))、(以下、「第1のバイアホール102」という)を形成した。
工程bで形成された第1のバイアホール102を介して第1の配線106a及びワイヤボンディング用接続端子110と電気的に接続される厚さ200nmの銅薄膜を、スパッタリングによって第2の主面上に形成した。スパッタリングは、工程aと同様にして行った。そして、この銅薄膜上に電気銅めっきにより膜厚10μmのめっきを施した。さらに、工程aと同様に、銅薄膜のうち配線を構成する部分を覆うエッチングレジストを形成し、塩化第二鉄エッチング液を用いてエッチングして、第2の配線106b(第2の層間接続端子103を含む)を形成した。
第2の配線106bを有する第2の主面側を、200ml/lに調整した液温50℃の酸性脱脂液Z−200(ワールドメタル社製、商品名)へ2分間浸漬させた後、液温50℃の水に2分間浸漬させて湯洗し、さらに1分間水洗した。次いで、同じく第2の主面側を100ml/lの硫酸水溶液へ1分間浸漬させ、1分間水洗した。このような前処理を行った後、酢酸によりpH5に調整した水溶液に濃度が0.5%となるようにイミダゾールシランカップリング剤IS−1000(ジャパンエナジー株式会社製、商品名)を加えた溶液に、第2の配線106bを有する第2の主面側を10分間浸漬させた。そして、1分間水洗を行った後に、常温にて乾燥を行った。続いて、第2の主面上に、シアネ―トエステル系樹脂組成物の絶縁ワニスを1500rpmのスピンコート法により厚さが10μmとなるよう塗布した。塗布された絶縁ワニスを常温から6℃/minの昇温速度にて230℃まで加熱し、更に230℃で1時間保持することにより、シアネート系樹脂組成物を熱硬化させて、ビルドアップ層104aを形成した。
ビルドアップ層104aのソーダガラス基板100とは反対側の面から、第2の層間接続用端子103に到達するまで、レーザによって直径が50μmの第2の層間接続用IVH108b用の貫通穴108aを形成して、図6の(e)に示される構造体6eを得た。レーザにはYAGレーザLAVIA−UV2000(住友重機械工業株式会社製、商品名)を使用し、周波数4kHz、ショット数20、マスク径0.4mmの条件で貫通穴108aを形成した。
構造体6eのビルドアップ層104aのソーダガラス基板100とは反対側の面上に、膜厚20nmのニッケル層及び膜厚200nmの薄膜銅層をこの順にスパッタリングにより形成して、ニッケル層及び薄膜銅層から構成されるシード層を得た。スパッタリングは、工程aと同様の装置を用いて、以下に示した条件2の下で行った。
(ニッケル層の形成)
電流:5.0A
電流:350V
電圧アルゴン流量:35SCCM
圧力:5×10−3Torr(4.9×10−2Pa)
成膜速度:0.3nm/秒
(薄膜銅層の形成)
電流:3.5A
電圧:500V
アルゴン流量:35SCCM
圧力:5×10−3Torr(4.9×10−2Pa)
成膜速度:5nm/秒
名)をスピンコート法によりシード層上に塗布して、膜厚20μmのめっきレジスト層を形成した。そして、めっきレジスト層を露光量1000mJ/cm2にて露光し、液温23℃のPMER現像液P−7Gへ、シード層及びレジスト層を備えた構造体6eを6分間浸漬させた。浸漬後、揺動によって、シード層上にL/S=10μm/10μmのレジストパターンを形成した。そして、レジストパターンの形成された構造体6eを、硫酸銅めっき液へ移し、レジストパターンに覆われていない部分のシード層上に膜厚約5μmのパターン銅めっきを施した。その後、室温(25℃)のメチルエチルケトンへ、レジストパターン及びパターン銅メッキを有する構造体6eを1分間浸漬させることにより、めっきレジストを除去した。次いで、5倍希釈した30℃のCPE−700(三菱瓦斯化学株式会社製、商品名)水溶液へ、パターン銅めっきを有する構造体6eを30秒間浸漬させ、揺動しながらパターン銅めっきによって覆われていない部分のシード層を除去して、第2の層間接続用IVH108b(以下、「第2のバイアホール108」という)及び第3の配線106cを形成した。このようにして図6(f)に示される構造体6fを得た。
工程d〜工程fと同様の操作を再度繰り返すことによって、第2のバイアホール108b及び第3の配線106cを覆うビルドアップ層104bと、はんだ接続用端子111とを含む最外層の配線をさらに一層形成し、最後にソルダレジスト109を形成して、図1(a)(半導体パッケージ1つ分の半導体チップ搭載用基板の模式平面図)、図7(半導体パッケージ1つ分の模式断面図)、及び図9(半導体パッケージ領域を行及び列に複数個配列した半導体チップ搭載基板の模式平面図)のようなファン−インタイプBGA用の半導体チップ搭載基板を作製した。
工程a〜工程gまでを経て得られた図6(g)に示す半導体チップ搭載用基板6g(以下、「構造体6g」という。)を、50℃の脱脂液Z−200(株式会社ワールドメタル製、商品名)へ3分間浸漬させ、2分間水洗した。その後、構造体6gを100g/lの過硫酸アンモニウム溶液へ1分間浸漬させ、2分間水洗した。そして、構造体6gを10%の硫酸へ1分間浸漬させ、2分間水洗した。続いて、構造体6gを、液温25℃のめっき活性処理液であるSA−100(日立化成工業株式会社製、商品名)へ5分間浸漬させた後、2分間水洗した。
液温85℃の無電解ニッケルめっき液であるNIPS−100(日立化成工業株式会社製、商品名)へ、工程hを経た構造体6gを25分間浸漬させた後、1分間水洗した。
99質量%以上のパラジウムからなる無電解パラジウムめっき皮膜を形成するための無電解パラジウムめっき液(a)(表2参照)へ、65℃においてニッケルめっき皮膜を有する接続端子及び配線を備えた構造体6g(以下、「構造体6g−j」という)を7秒間浸漬させ、1分間水洗した。この時、無電解パラジウムめっき皮膜に含まれるパラジウムの含有量(純度)は表2に示すように実質的に100質量%であり、膜厚は0.01μmであった。
続いて、90質量%以上〜99質量%未満のパラジウムからなる無電解パラジウムめっき皮膜を形成する無電解パラジウムめっき液(b)(表2参照)へ、50℃においてニッケルめっき皮膜、99質量%のパラジウムからなる無電解パラジウムめっき皮膜、をこの順に有する接続端子及び配線を備えた構造体6g(以下、「構造体6g−k」という)を5分間浸漬させた後、1分間水洗した。この時、無電解パラジウムめっき皮膜に含まれるパラジウムの含有量は表2に示すようにおよそ95.5質量%(パラジウム:95.5質量%,リン:4.5質量%)であり、膜厚は0.06μmであった。
続いて、置換金めっき液であるHGS−100(日立化成工業株式会社、商品名)へ、85℃においてニッケルめっき皮膜、99質量%のパラジウムからなる無電解パラジウムめっき皮膜、90質量%以上〜99質量%未満のパラジウムからなる無電解パラジウムめっき皮膜、をこの順に有する接続端子及び配線を備えた構造体6g(以下、「構造体6g−l」という)を10分間浸漬させ、1分間水洗した。
続いて、無電解金めっき液であるHGS−2000(日立化成工業株式会社製、商品名
)へ、70℃においてニッケルめっき皮膜、99質量%のパラジウムからなる無電解パラジウムめっき皮膜、90質量%以上〜99質量%未満のパラジウムからなる無電解パラジウムめっき皮膜、置換金めっき皮膜、をこの順に有する端子及び配線を備えた構造体6g(以下、「構造体6g−m」という)を30分間浸漬させ、5分間水洗した。この時、置換金めっき及び無電解金めっき皮膜の膜厚の合計は0.3μmであった。
上記工程a〜工程mを経て得られた半導体チップ搭載用基板について、下記の基準により接続端子の接続信頼性を評価した。結果を表1に示す。
A:1000箇所全てのはんだ用接続端子においてはんだボール内での剪断による破壊が認められた。
B:はんだボール内での剪断による破壊以外のモードによる破壊が1箇所以上10個所以
内で認められた。
C:はんだボール内での剪断による破壊以外のモードによる破壊が11箇所以上50個所
以内で認められた。
D:はんだボール内での剪断による破壊以外のモードによる破壊が51個所以上で認められた。
作製した半導体チップ搭載用基板を150℃で50時間熱処理した後、ワイヤボンディングを行った。ワイヤ径28μmの1000本の金ワイヤを用いて、1000箇所全てにワイヤボンディングを行った。評価基準は以下のとおりであって、下記基準に基づいて、ワイヤボンディング接続信頼性について端子毎にそれぞれ評価した。結果を表1に示した。
A:1000箇所全てのワイヤボンディング用接続端子がワイヤボンディング可能であると認められた。
B:ワイヤの不着箇所が1箇所以上5個所以内で認められた。
C:ワイヤの不着箇所が6箇所以上50個所以内で認められた。
D:ワイヤの不着箇所が51箇所以上で認められた。
実施例1に示した工程mを行わなかったこと以外は全て、実施例1と同様にして各工程を行った。結果を表1に示した。
実施例1に示した工程j及び/又は工程kにおいて、構造体6g−j及び/又は構造体6g−kの浸漬処理時間を表1に示すように変更することにより、構造体6g−jの接続端子及び配線上、並びに配線構造体6g−kの接続端子及び配線上に、種々の膜厚を有する無電解パラジウムめっき皮膜を形成した。それ以外は実施例1と同様にして各工程を行った。結果を表1に示した。
実施例1に示した工程kにおいて、めっき液を表2に示される(b)から(c)に変更し、浸漬時間を表1に示されるように変更した以外は実施例1と同様にして、各工程を行った。結果を表1に示した。
実施例9に示した工程j及び/又は工程kにおいて、構造体6g−j及び/又は構造体6g−kの浸漬処理時間を表1に示すように変更することにより、構造体6g−jの接続端子及び配線上、並びに配線構造体6g−kの接続端子及び配線上に、種々の膜厚を有する無電解パラジウムめっき皮膜を形成した。それ以外は実施例9と同様にして各工程を行った。結果を表1に示した。
実施例1に示した工程kにおいて、めっき液を表2に示される(b)から(d)に変更し、浸漬時間を表1に示されるように変更した以外は実施例1と同様にして、各工程を行った。結果を表1に示した。
実施例16に示した工程j及び/又は工程kにおいて、構造体6g−j及び/又は構造体6g−kの浸漬処理時間を表1に示すように変更することにより、構造体6g−jの接続端子及び配線上、並びに配線構造体6g−kの接続端子及び配線上に、種々の膜厚を有する無電解パラジウムめっき皮膜を形成した。それ以外は実施例16と同様にして各工程を行った。結果を表1に示した。
実施例1に示した工程jにおいて、めっき液を表2に示される(a)から(e)に変更し、工程kにおいて、めっき液を表2に示される(b)から(d)に変更し、浸漬時間を表1に示されるように変更した以外は実施例1と同様にして、各工程を行った。結果を表1に示した。
実施例23に示した工程kにおいて、構造体6g−kの浸漬処理時間を表1に示すように変更することにより、構造体6g−kの接続端子及び配線上に、種々の膜厚を有する無電解パラジウムめっき皮膜を形成した。それ以外は実施例23と同様にして各工程を行った。結果を表1に示した。
実施例1に示した工程jを行わなかったこと以外は全て、実施例1と同様にして各工程を行った。結果を表1に示した。
実施例5に示した工程jを行わなかったこと以外は全て、実施例5と同様にして各工程を行った。結果を表1に示した。
実施例8に示した工程jを行わなかったこと以外は全て、実施例8と同様にして各工程を行った。結果を表1に示した。
実施例9に示した工程jを行わなかったこと以外は全て、実施例9と同様にして各工程を行った。結果を表1に示した。
実施例12に示した工程jを行わなかったこと以外は全て、実施例12と同様にして各工程を行った。結果を表1に示した。
実施例15に示した工程jを行わなかったこと以外は全て、実施例15と同様にして各工程を行った。結果を表1に示した。
実施例16に示した工程jを行わなかったこと以外は全て、実施例16と同様にして各工程を行った。結果を表1に示した。
実施例19に示した工程jを行わなかったこと以外は全て、実施例19と同様にして各工程を行った。結果を表1に示した。
実施例22に示した工程jを行わなかったこと以外は全て、実施例22と同様にして各工程を行った。結果を表1に示した。
実施例1に示した工程kを行わなかったこと以外は全て、実施例1と同様にして各工程を行った。結果を表1に示した。
実施例3に示した工程kを行わなかったこと以外は全て、実施例3と同様にして各工程を行った。結果を表1に示した。
実施例4に示した工程kを行わなかったこと以外は全て、実施例4と同様にして各工程を行った。結果を表1に示した。
Claims (16)
- 導体層と、
無電解ニッケルめっき皮膜と、
純度が99質量%以上の置換又は無電解パラジウムめっき皮膜である第1のパラジウムめっき皮膜と、
純度が90質量%以上99質量%未満の無電解パラジウムめっき皮膜である第2のパラジウムめっき皮膜と、
置換金めっき皮膜と、
を有し、
前記無電解ニッケルめっき皮膜、前記第1のパラジウムめっき皮膜、前記第2のパラジウムめっき皮膜及び前記置換金めっき皮膜が前記導体層の一方面側においてこの順序に積層され、前記置換金めっき皮膜が前記導体層とは反対側の最表層に位置している、
接続端子。 - 前記置換金めっき皮膜の膜厚が0.005μm以上である請求項1記載の接続端子。
- 前記置換金めっき皮膜上に積層された無電解金めっき皮膜を更に有し、該無電解金めっき皮膜が前記導体層とは反対側の最表層に位置している、請求項1記載の接続端子。
- 前記置換金めっき皮膜及び前記無電解金めっき皮膜の膜厚の和が0.005μm以上である請求項3記載の接続端子。
- ワイヤボンディング用接続端子である、請求項1〜4のいずれか一項記載の接続端子。
- はんだ接続用接続端子である、請求項1〜4のいずれか一項記載の接続端子。
- 前記第2のパラジウムめっき皮膜が、パラジウム−リンめっき皮膜である請求項1〜6のいずれか一項記載の接続端子。
- 前記第1のパラジウムめっき皮膜の膜厚が0.4μm以下である請求項1〜7のいずれか一項記載の接続端子。
- 前記第2のパラジウムめっき皮膜の膜厚が0.03〜0.3μmである請求項1〜8のいずれか一項記載の接続端子。
- 前記第1のパラジウムめっき皮膜及び前記第2のパラジウムめっき皮膜の膜厚の和が0.03〜0.5μmである請求項1〜9のいずれか一項記載の接続端子。
- 前記無電解ニッケルめっき皮膜の純度が80質量%以上である、請求項1〜10のいずれか一項記載の接続端子。
- 前記無電解ニッケルめっき皮膜の膜厚が0.1〜20μmである請求項1〜11のいずれか一項記載の接続端子。
- 前記導体層が、銅、タングステン、モリブデン及びアルミニウムからなる群から選択される少なくとも1種の金属を含む、請求項1〜12のいずれか一項記載の接続端子。
- 基板と、該基板上に形成された配線と、請求項1〜13のいずれか一項記載の接続端子であって前記配線の一部分を前記導体層として有する接続端子と、該接続端子と電気的に接続されるように前記基板に搭載された半導体チップと、を備える半導体パッケージ。
- 基板上に形成された導体層の一部分の表面上に、無電解ニッケルめっき皮膜、純度が99質量%以上の置換又は無電解パラジウムめっき皮膜である第1のパラジウムめっき皮膜、純度が90質量%以上99質量%未満の無電解パラジウムめっき皮膜である第2のパラジウムめっき皮膜、及び置換金めっき皮膜をこの順で形成して、前記導体層の一部分、前記第1のパラジウムめっき皮膜、前記第2のパラジウムめっき皮膜、及び前記置換金めっき皮膜を有する接続端子を形成する工程と、
半導体チップを、前記接続端子と電気的に接続されるように前記基板に搭載する工程と、
を備える半導体パッケージの製造方法。 - 基板上に形成された導体層の一部分の表面上に、無電解ニッケルめっき皮膜、純度が99質量%以上の置換又は無電解パラジウムめっき皮膜である第1のパラジウムめっき皮膜、純度が90質量%以上99質量%未満の無電解パラジウムめっき皮膜である第2のパラジウムめっき皮膜、置換金めっき皮膜、及び無電解金めっき皮膜をこの順で形成して、前記導体層の一部分、前記第1のパラジウムめっき皮膜、前記第2のパラジウムめっき皮膜、前記置換金めっき皮膜、及び前記無電解金めっき皮膜を有する接続端子を形成する工程と、
半導体チップを、前記接続端子と電気的に接続されるように前記基板に搭載する工程と、
を備える半導体パッケージの製造方法。
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JP2008097381A JP5286893B2 (ja) | 2007-04-27 | 2008-04-03 | 接続端子、接続端子を用いた半導体パッケージ及び半導体パッケージの製造方法 |
CN2008800135016A CN101668880B (zh) | 2007-04-27 | 2008-04-23 | 连接端子、使用了连接端子的半导体封装件及半导体封装件的制造方法 |
KR1020097024655A KR101107834B1 (ko) | 2007-04-27 | 2008-04-23 | 접속 단자, 접속 단자를 이용한 반도체 패키지 및 반도체 패키지의 제조 방법 |
US12/597,835 US8426742B2 (en) | 2007-04-27 | 2008-04-23 | Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package |
PCT/JP2008/057859 WO2008136327A1 (ja) | 2007-04-27 | 2008-04-23 | 接続端子、接続端子を用いた半導体パッケージ及び半導体パッケージの製造方法 |
TW097115059A TWI340617B (en) | 2007-04-27 | 2008-04-24 | Connection terminal, semiconductor package using the same and method of fabricating for semiconductor package |
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Also Published As
Publication number | Publication date |
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CN101668880A (zh) | 2010-03-10 |
US8426742B2 (en) | 2013-04-23 |
WO2008136327A1 (ja) | 2008-11-13 |
JP5286893B2 (ja) | 2013-09-11 |
TW200850107A (en) | 2008-12-16 |
TWI340617B (en) | 2011-04-11 |
US20100071940A1 (en) | 2010-03-25 |
CN101668880B (zh) | 2011-03-09 |
KR20100007920A (ko) | 2010-01-22 |
KR101107834B1 (ko) | 2012-02-09 |
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