JP2008177565A5 - - Google Patents

Download PDF

Info

Publication number
JP2008177565A5
JP2008177565A5 JP2008003657A JP2008003657A JP2008177565A5 JP 2008177565 A5 JP2008177565 A5 JP 2008177565A5 JP 2008003657 A JP2008003657 A JP 2008003657A JP 2008003657 A JP2008003657 A JP 2008003657A JP 2008177565 A5 JP2008177565 A5 JP 2008177565A5
Authority
JP
Japan
Prior art keywords
region
source
drain
gate electrode
drain region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008003657A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008177565A (ja
JP5383049B2 (ja
Filing date
Publication date
Priority claimed from US11/954,135 external-priority patent/US8058683B2/en
Application filed filed Critical
Publication of JP2008177565A publication Critical patent/JP2008177565A/ja
Publication of JP2008177565A5 publication Critical patent/JP2008177565A5/ja
Application granted granted Critical
Publication of JP5383049B2 publication Critical patent/JP5383049B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008003657A 2007-01-18 2008-01-10 垂直方向のチャンネルを有するアクセス素子、これを含む半導体装置、及びアクセス素子の形成方法 Active JP5383049B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2007-0005477 2007-01-18
KR20070005477 2007-01-18
US11/954,135 US8058683B2 (en) 2007-01-18 2007-12-11 Access device having vertical channel and related semiconductor device and a method of fabricating the access device
US11/954,135 2007-12-11

Publications (3)

Publication Number Publication Date
JP2008177565A JP2008177565A (ja) 2008-07-31
JP2008177565A5 true JP2008177565A5 (enExample) 2011-02-24
JP5383049B2 JP5383049B2 (ja) 2014-01-08

Family

ID=39640401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008003657A Active JP5383049B2 (ja) 2007-01-18 2008-01-10 垂直方向のチャンネルを有するアクセス素子、これを含む半導体装置、及びアクセス素子の形成方法

Country Status (4)

Country Link
US (1) US8058683B2 (enExample)
JP (1) JP5383049B2 (enExample)
KR (1) KR101398494B1 (enExample)
CN (1) CN101226960B (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8482041B2 (en) 2007-10-29 2013-07-09 Unisantis Electronics Singapore Pte Ltd. Semiconductor structure and method of fabricating the semiconductor structure
US8486785B2 (en) 2010-06-09 2013-07-16 Unisantis Electronics Singapore Pte Ltd. Surround gate CMOS semiconductor device
US8487357B2 (en) 2010-03-12 2013-07-16 Unisantis Electronics Singapore Pte Ltd. Solid state imaging device having high sensitivity and high pixel density
US8497548B2 (en) 2009-04-28 2013-07-30 Unisantis Electronics Singapore Pte Ltd. Semiconductor device including a MOS transistor and production method therefor
US8564034B2 (en) 2011-09-08 2013-10-22 Unisantis Electronics Singapore Pte. Ltd. Solid-state imaging device
US8575662B2 (en) 2010-03-08 2013-11-05 Unisantis Electronics Singapore Pte Ltd. Solid state imaging device having high pixel density
US8598650B2 (en) 2008-01-29 2013-12-03 Unisantis Electronics Singapore Pte Ltd. Semiconductor device and production method therefor
US8610202B2 (en) 2009-10-01 2013-12-17 Unisantis Electronics Singapore Pte Ltd. Semiconductor device having a surrounding gate
US8669601B2 (en) 2011-09-15 2014-03-11 Unisantis Electronics Singapore Pte. Ltd. Method for producing semiconductor device and semiconductor device having pillar-shaped semiconductor
US8748938B2 (en) 2012-02-20 2014-06-10 Unisantis Electronics Singapore Pte. Ltd. Solid-state imaging device
US8772175B2 (en) 2011-12-19 2014-07-08 Unisantis Electronics Singapore Pte. Ltd. Method for manufacturing semiconductor device and semiconductor device

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101179193B1 (ko) * 2007-12-07 2012-09-03 삼성전자주식회사 수직 채널 트랜지스터를 갖는 반도체 소자의 제조방법
US8188537B2 (en) * 2008-01-29 2012-05-29 Unisantis Electronics Singapore Pte Ltd. Semiconductor device and production method therefor
JP2010141259A (ja) * 2008-12-15 2010-06-24 Elpida Memory Inc 半導体装置及びその製造方法
JP4577592B2 (ja) 2009-04-20 2010-11-10 日本ユニサンティスエレクトロニクス株式会社 半導体装置の製造方法
KR101567976B1 (ko) 2009-07-23 2015-11-11 삼성전자주식회사 반도체 소자
KR101609252B1 (ko) 2009-09-24 2016-04-06 삼성전자주식회사 매몰 워드 라인을 구비한 반도체 소자
KR101607265B1 (ko) * 2009-11-12 2016-03-30 삼성전자주식회사 수직 채널 트랜지스터의 제조방법
US8497541B2 (en) * 2010-03-10 2013-07-30 Micron Technology, Inc. Memory having buried digit lines and methods of making the same
KR20110101876A (ko) * 2010-03-10 2011-09-16 삼성전자주식회사 매립 비트 라인을 갖는 반도체 장치 및 반도체 장치의 제조 방법
KR101645257B1 (ko) * 2010-05-20 2016-08-16 삼성전자주식회사 수직 채널 트랜지스터를 구비한 반도체 소자
WO2011149768A2 (en) * 2010-05-25 2011-12-01 Ss Sc Ip, Llc Self-aligned semiconductor devices with reduced gate-source leakage under reverse bias and methods of making
JP5087655B2 (ja) 2010-06-15 2012-12-05 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置及びその製造方法
KR101140079B1 (ko) * 2010-07-13 2012-04-30 에스케이하이닉스 주식회사 수직형 트랜지스터를 포함하는 반도체 소자 및 그 형성방법
KR101159985B1 (ko) * 2010-07-23 2012-06-25 에스케이하이닉스 주식회사 반도체 소자 및 그 제조 방법
KR101660433B1 (ko) * 2010-07-29 2016-09-27 삼성전자 주식회사 수직 채널 트랜지스터를 구비한 반도체 소자
TWI415247B (zh) * 2010-12-15 2013-11-11 Powerchip Technology Corp 具有垂直通道電晶體的動態隨機存取記憶胞及陣列
KR101227339B1 (ko) * 2011-05-12 2013-01-28 에스케이하이닉스 주식회사 반도체 소자 및 그 형성 방법
CN102820300B (zh) * 2011-06-10 2016-03-02 华邦电子股份有限公司 动态随机存取存储器及其制造方法
KR101363272B1 (ko) * 2011-09-01 2014-02-14 서울대학교산학협력단 수직채널을 갖는 모스펫 및 이를 이용한 논리 게이트 소자
JP2013088862A (ja) 2011-10-13 2013-05-13 Elpida Memory Inc レイアウトデータ作成装置及び半導体装置
US8759178B2 (en) 2011-11-09 2014-06-24 Unisantis Electronics Singapore Pte. Ltd. Method for manufacturing semiconductor device and semiconductor device
US10438836B2 (en) 2011-11-09 2019-10-08 Unisantis Electronics Singapore Pte. Ltd. Method for manufacturing a semiconductor device
US8916478B2 (en) 2011-12-19 2014-12-23 Unisantis Electronics Singapore Pte. Ltd. Method for manufacturing semiconductor device and semiconductor device
US8614117B2 (en) 2012-02-08 2013-12-24 International Business Machines Corporation Self-aligned process to fabricate a memory cell array with a surrounding-gate access transistor
US9012981B2 (en) 2012-05-17 2015-04-21 Unisantis Electronics Singapore Pte. Ltd. Semiconductor device
US8829601B2 (en) 2012-05-17 2014-09-09 Unisantis Electronics Singapore Pte. Ltd. Semiconductor device
US9166043B2 (en) 2012-05-17 2015-10-20 Unisantis Electronics Singapore Pte. Ltd. Semiconductor device
US8697511B2 (en) 2012-05-18 2014-04-15 Unisantis Electronics Singapore Pte. Ltd. Method for producing semiconductor device and semiconductor device
KR20140009509A (ko) * 2012-05-18 2014-01-22 유니산티스 일렉트로닉스 싱가포르 프라이빗 리미티드 반도체 장치의 제조 방법 및 반도체 장치
US8877578B2 (en) 2012-05-18 2014-11-04 Unisantis Electronics Singapore Pte. Ltd. Method for producing semiconductor device and semiconductor device
KR101881857B1 (ko) 2012-08-27 2018-08-24 삼성전자주식회사 계단형 패턴 형성 방법
KR101965602B1 (ko) 2012-10-16 2019-04-04 삼성전자주식회사 3차원 반도체 장치의 제조 방법 및 이에 따라 제조된 3차원 반도체 장치
KR101961322B1 (ko) 2012-10-24 2019-03-22 삼성전자주식회사 매립 채널 어레이를 갖는 반도체 소자
KR101974352B1 (ko) 2012-12-07 2019-05-02 삼성전자주식회사 수직 셀을 갖는 반도체 소자의 제조 방법 및 그에 의해 제조된 반도체 소자
US8835255B2 (en) * 2013-01-23 2014-09-16 Globalfoundries Inc. Method of forming a semiconductor structure including a vertical nanowire
US8969949B2 (en) * 2013-03-10 2015-03-03 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for static random access memory device of vertical tunneling field effect transistor
KR102084954B1 (ko) 2013-05-02 2020-03-05 삼성전자주식회사 반도체 장치 및 이의 제조 방법
US10008566B2 (en) * 2013-09-12 2018-06-26 Taiwan Semiconductor Manufacturing Company Limited Semiconductor device with reduced electrical resistance and capacitance
US9520494B2 (en) * 2013-09-26 2016-12-13 Intel Corporation Vertical non-planar semiconductor device for system-on-chip (SoC) applications
WO2015195109A1 (en) * 2014-06-18 2015-12-23 Intel Corporation Pillar resistor structures for integrated circuitry
JP5814437B2 (ja) * 2014-08-06 2015-11-17 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置の製造方法と半導体装置
US9373620B2 (en) 2014-09-12 2016-06-21 Taiwan Semiconductor Manufacturing Co., Ltd. Series connected transistor structure and method of manufacturing the same
US9691471B2 (en) 2014-09-15 2017-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. SRAM cells with vertical gate-all-round MOSFETs
US9871111B2 (en) * 2014-09-18 2018-01-16 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method
JP5986618B2 (ja) * 2014-12-04 2016-09-06 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置
US9646973B2 (en) * 2015-03-27 2017-05-09 Taiwan Semiconductor Manufacturing Company, Ltd. Dual-port SRAM cell structure with vertical devices
CN106486369B (zh) * 2015-08-27 2020-04-07 中芯国际集成电路制造(上海)有限公司 晶体管及其形成方法
KR102476143B1 (ko) * 2016-02-26 2022-12-12 삼성전자주식회사 반도체 장치
JP6143913B2 (ja) * 2016-04-06 2017-06-07 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置の製造方法及び半導体装置
US10373878B2 (en) 2017-04-26 2019-08-06 Samsung Electronics Co., Ltd. Semiconductor device and method of manufacturing the same
US10269805B2 (en) * 2017-06-26 2019-04-23 Micron Technology, Inc. Apparatuses having body connection lines coupled with access devices
CN111344841B (zh) * 2017-11-01 2023-07-04 新加坡优尼山帝斯电子私人有限公司 柱状半导体装置、及其制造方法
CN109285836B (zh) 2018-08-28 2023-10-10 中国科学院微电子研究所 半导体存储设备及其制造方法及包括存储设备的电子设备
CN109285838B (zh) * 2018-08-28 2023-05-02 中国科学院微电子研究所 半导体存储设备及其制造方法及包括存储设备的电子设备
DE102019109846A1 (de) 2018-09-27 2020-04-02 Taiwan Semiconductor Manufacturing Co., Ltd. Halbleiterstruktur mit gestaffeltem selektivem wachstum
US10840133B2 (en) 2018-09-27 2020-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure with staggered selective growth
EP3718962B1 (en) * 2019-04-01 2022-11-09 IMEC vzw A method for forming a vertical nanowire or nanosheet field-effect transistor
KR102773664B1 (ko) * 2019-06-18 2025-02-25 삼성전자주식회사 돌출된 얕은 트렌치 분리 구조체를 갖는 수직 전계 효과 트랜지스터 장치 및 수직 전계 효과 트랜지스터 장치를 제조하는 방법
TWI791871B (zh) * 2019-07-19 2023-02-11 力晶積成電子製造股份有限公司 通道全環繞半導體裝置及其製造方法
KR102741647B1 (ko) 2019-12-24 2024-12-16 삼성전자주식회사 반도체 소자
CN113113310B (zh) * 2020-01-13 2024-07-16 中芯国际集成电路制造(北京)有限公司 半导体器件及其形成方法
CN113113308B (zh) * 2020-01-13 2022-09-20 中芯国际集成电路制造(天津)有限公司 半导体器件及其形成方法
US11276781B2 (en) * 2020-04-15 2022-03-15 International Business Machines Corporation Bottom source/drain for fin field effect transistors
US20220328413A1 (en) * 2020-07-01 2022-10-13 Sandisk Technologies Llc Three-dimensional memory device including stairless word line contact structures and method of making the same (as amended)
JP7057032B1 (ja) * 2020-12-25 2022-04-19 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体素子を用いたメモリ装置
US11640987B2 (en) * 2021-02-04 2023-05-02 Applied Materials, Inc. Implant to form vertical FETs with self-aligned drain spacer and junction
US11770923B2 (en) * 2021-03-03 2023-09-26 Micron Technology, Inc. Thin film transistor random access memory
CN116391261A (zh) 2021-10-31 2023-07-04 长江存储科技有限责任公司 具有垂直晶体管的存储器器件及其形成方法
CN116584162A (zh) 2021-10-31 2023-08-11 长江存储科技有限责任公司 具有垂直晶体管的存储器器件及其形成方法
WO2023070640A1 (en) 2021-10-31 2023-05-04 Yangtze Memory Technologies Co., Ltd. Memory devices having vertical transistors in staggered layouts
CN116391452A (zh) 2021-10-31 2023-07-04 长江存储科技有限责任公司 具有垂直晶体管和堆叠存储单元的存储器器件及其形成方法
WO2023070638A1 (en) 2021-10-31 2023-05-04 Yangtze Memory Technologies Co., Ltd. Memory devices having vertical transistors and methods for forming the same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940000513B1 (ko) 1991-08-21 1994-01-21 현대전자산업 주식회사 Dram셀 및 그 제조방법
KR940006679B1 (ko) 1991-09-26 1994-07-25 현대전자산업 주식회사 수직형 트랜지스터를 갖는 dram셀 및 그 제조방법
US5208172A (en) 1992-03-02 1993-05-04 Motorola, Inc. Method for forming a raised vertical transistor
KR0147584B1 (ko) 1994-03-17 1998-08-01 윤종용 매몰 비트라인 셀의 제조방법
KR960016773B1 (en) 1994-03-28 1996-12-20 Samsung Electronics Co Ltd Buried bit line and cylindrical gate cell and forming method thereof
JP3745392B2 (ja) * 1994-05-26 2006-02-15 株式会社ルネサステクノロジ 半導体装置
US5497017A (en) 1995-01-26 1996-03-05 Micron Technology, Inc. Dynamic random access memory array having a cross-point layout, tungsten digit lines buried in the substrate, and vertical access transistors
US5885864A (en) 1996-10-24 1999-03-23 Micron Technology, Inc. Method for forming compact memory cell using vertical devices
EP0899790A3 (de) 1997-08-27 2006-02-08 Infineon Technologies AG DRAM-Zellanordnung und Verfahren zu deren Herstellung
JP2004096065A (ja) * 2002-07-08 2004-03-25 Renesas Technology Corp 半導体記憶装置およびその製造方法
US7276754B2 (en) 2003-08-29 2007-10-02 Micron Technology, Inc. Annular gate and technique for fabricating an annular gate
US7262089B2 (en) * 2004-03-11 2007-08-28 Micron Technology, Inc. Methods of forming semiconductor structures
US20060046392A1 (en) * 2004-08-26 2006-03-02 Manning H M Methods of forming vertical transistor structures
US7285812B2 (en) * 2004-09-02 2007-10-23 Micron Technology, Inc. Vertical transistors
KR100618875B1 (ko) 2004-11-08 2006-09-04 삼성전자주식회사 수직 채널 mos 트랜지스터를 구비한 반도체 메모리소자 및 그 제조방법
US7199419B2 (en) * 2004-12-13 2007-04-03 Micron Technology, Inc. Memory structure for reduced floating body effect
KR100723527B1 (ko) * 2006-02-13 2007-05-30 삼성전자주식회사 수직 채널 트랜지스터를 구비한 반도체 소자의 제조방법 및그에 의해 제조된 반도체 소자

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8482041B2 (en) 2007-10-29 2013-07-09 Unisantis Electronics Singapore Pte Ltd. Semiconductor structure and method of fabricating the semiconductor structure
US8598650B2 (en) 2008-01-29 2013-12-03 Unisantis Electronics Singapore Pte Ltd. Semiconductor device and production method therefor
US8497548B2 (en) 2009-04-28 2013-07-30 Unisantis Electronics Singapore Pte Ltd. Semiconductor device including a MOS transistor and production method therefor
US8647947B2 (en) 2009-04-28 2014-02-11 Unisantis Electronics Singapore Pte Ltd. Semiconductor device including a MOS transistor and production method therefor
US8610202B2 (en) 2009-10-01 2013-12-17 Unisantis Electronics Singapore Pte Ltd. Semiconductor device having a surrounding gate
US8575662B2 (en) 2010-03-08 2013-11-05 Unisantis Electronics Singapore Pte Ltd. Solid state imaging device having high pixel density
US8487357B2 (en) 2010-03-12 2013-07-16 Unisantis Electronics Singapore Pte Ltd. Solid state imaging device having high sensitivity and high pixel density
US8486785B2 (en) 2010-06-09 2013-07-16 Unisantis Electronics Singapore Pte Ltd. Surround gate CMOS semiconductor device
US8609494B2 (en) 2010-06-09 2013-12-17 Unisantis Electronics Singapore Pte Ltd. Surround gate CMOS semiconductor device
US8564034B2 (en) 2011-09-08 2013-10-22 Unisantis Electronics Singapore Pte. Ltd. Solid-state imaging device
US8669601B2 (en) 2011-09-15 2014-03-11 Unisantis Electronics Singapore Pte. Ltd. Method for producing semiconductor device and semiconductor device having pillar-shaped semiconductor
US8772175B2 (en) 2011-12-19 2014-07-08 Unisantis Electronics Singapore Pte. Ltd. Method for manufacturing semiconductor device and semiconductor device
US8748938B2 (en) 2012-02-20 2014-06-10 Unisantis Electronics Singapore Pte. Ltd. Solid-state imaging device

Similar Documents

Publication Publication Date Title
JP2008177565A5 (enExample)
US12089410B2 (en) Semiconductor memory device and method for manufacturing the same
US8441059B2 (en) Memory devices including vertical pillars and methods of manufacturing and operating the same
US7829932B2 (en) Semiconductor device
JP2009135140A5 (enExample)
TW200519948A (en) Memory cell unit, nonvolatile semiconductor storage device including memory cell unit, and memory cell array driving method
JP2006041354A5 (enExample)
WO2010135169A8 (en) Vertically-oriented selection transistor for cross-point memory array
US8395139B1 (en) 1T1R resistive memory device and fabrication method thereof
CN103178068A (zh) 非易失性存储器件及其制造方法
JP2009290189A5 (enExample)
US8178924B2 (en) Semiconductor device having floating body element and bulk body element
TW200629574A (en) Non-volatile memory cells, memory arrays including the same and methods of operating cells and arrays
JP2008205330A5 (enExample)
US20090273088A1 (en) Semiconductor Device and Method for Fabricating the Same
TWI503927B (zh) 包含記憶體陣列的器件及其方法
JP2007294928A5 (enExample)
JP2006339599A5 (enExample)
JP2003017691A5 (enExample)
JP2005039067A5 (enExample)
JP2003152116A5 (enExample)
JP2003188287A5 (enExample)
JP2014138141A5 (enExample)
JP2003037251A5 (enExample)
TW202301562A (zh) 半導體裝置及其製造方法