JP2003017691A5 - - Google Patents
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- Publication number
- JP2003017691A5 JP2003017691A5 JP2001201280A JP2001201280A JP2003017691A5 JP 2003017691 A5 JP2003017691 A5 JP 2003017691A5 JP 2001201280 A JP2001201280 A JP 2001201280A JP 2001201280 A JP2001201280 A JP 2001201280A JP 2003017691 A5 JP2003017691 A5 JP 2003017691A5
- Authority
- JP
- Japan
- Prior art keywords
- element isolation
- region
- type element
- substrate
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 22
- 239000004065 semiconductor Substances 0.000 claims 20
- 238000002955 isolation Methods 0.000 claims 17
- 239000004020 conductor Substances 0.000 claims 12
- 239000002344 surface layer Substances 0.000 claims 7
- 230000002093 peripheral effect Effects 0.000 claims 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 239000010410 layer Substances 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- 230000000779 depleting effect Effects 0.000 claims 2
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001201280A JP3798659B2 (ja) | 2001-07-02 | 2001-07-02 | メモリ集積回路 |
| US10/132,520 US6632723B2 (en) | 2001-04-26 | 2002-04-26 | Semiconductor device |
| KR10-2002-0023055A KR100525331B1 (ko) | 2001-04-26 | 2002-04-26 | 반도체 장치 |
| TW091108721A TW544911B (en) | 2001-04-26 | 2002-04-26 | Semiconductor device |
| CNB021410828A CN1230905C (zh) | 2001-04-26 | 2002-04-26 | 半导体器件 |
| EP02009262A EP1253634A3 (en) | 2001-04-26 | 2002-04-26 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001201280A JP3798659B2 (ja) | 2001-07-02 | 2001-07-02 | メモリ集積回路 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003017691A JP2003017691A (ja) | 2003-01-17 |
| JP2003017691A5 true JP2003017691A5 (enExample) | 2005-07-28 |
| JP3798659B2 JP3798659B2 (ja) | 2006-07-19 |
Family
ID=19038276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001201280A Expired - Fee Related JP3798659B2 (ja) | 2001-04-26 | 2001-07-02 | メモリ集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3798659B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4044510B2 (ja) * | 2003-10-30 | 2008-02-06 | 株式会社東芝 | 半導体集積回路装置 |
| JP4058403B2 (ja) | 2003-11-21 | 2008-03-12 | 株式会社東芝 | 半導体装置 |
| KR100618698B1 (ko) * | 2004-06-21 | 2006-09-08 | 주식회사 하이닉스반도체 | 반도체 소자 및 그의 제조방법 |
| KR100702014B1 (ko) * | 2005-05-03 | 2007-03-30 | 삼성전자주식회사 | 수직 채널 트랜지스터 구조를 갖는 단일 트랜지스터 플로팅바디 디램 소자들 및 그 제조방법들 |
| JP4660324B2 (ja) * | 2005-09-06 | 2011-03-30 | 株式会社東芝 | Fbcメモリ装置 |
| JP2007194259A (ja) * | 2006-01-17 | 2007-08-02 | Toshiba Corp | 半導体装置及びその製造方法 |
| KR100900232B1 (ko) | 2007-05-22 | 2009-05-29 | 주식회사 하이닉스반도체 | 반도체 소자 및 그의 제조방법 |
| JP2009117518A (ja) * | 2007-11-05 | 2009-05-28 | Toshiba Corp | 半導体記憶装置およびその製造方法 |
-
2001
- 2001-07-02 JP JP2001201280A patent/JP3798659B2/ja not_active Expired - Fee Related
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