JP2008066714A - チップ間の熱伝達遮断スペーサを備えるマルチチップパッケージ - Google Patents
チップ間の熱伝達遮断スペーサを備えるマルチチップパッケージ Download PDFInfo
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- JP2008066714A JP2008066714A JP2007190045A JP2007190045A JP2008066714A JP 2008066714 A JP2008066714 A JP 2008066714A JP 2007190045 A JP2007190045 A JP 2007190045A JP 2007190045 A JP2007190045 A JP 2007190045A JP 2008066714 A JP2008066714 A JP 2008066714A
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Abstract
【解決手段】印刷回路基板100上に相互対向するように搭載された第1機能を持つ第1半導体チップ112及び第2機能を持つ第2半導体チップ114を備える半導体チップ積層構造と、第1半導体チップ112と第2半導体チップ114との間に介在されている熱伝達遮断スペーサ120と、を備えるマルチチップパッケージ100。これにより、相互隣接した2個の半導体チップのうち、比較的大きい消費電力を持つチップから比較的低い消費電力を持つ他のチップへの熱伝達を遮断して、比較的低い消費電力を持つチップでのTjを低下させ、熱による特性低下を防止する。
【選択図】図1
Description
本発明によるマルチチップパッケージで、熱伝達遮断部材によってチップ間の熱的干渉を制限する熱的バリア特性を評価するために、図6に例示されたような構造の半導体チップ積層構造を持つサンプルを用意した。
対照例として、前記炭酸マグネシウムスペーサの代わりにシリコンスペーサを使用したことを除いて、例1と同じ条件で評価した。
長方形のスペーサの代わりに、図4に例示されたような十字型スペーサを使用したことを除いて例1と同じ条件で評価した。
102 印刷回路基板
110、610、710 半導体チップ積層構造
112 第1半導体チップ
114 第2半導体チップ
120、320、420、520 熱伝達遮断スペーサ
130 ソルダーボール
132 電極パッド
142 電極パッド
144 ワイヤー
150 封止用樹脂
160 ヒートシンク
612、614、616、712、714、716 半導体チップ
622、722 第1熱伝達遮断スペーサ
624、724 第2熱伝達遮断スペーサ
730 バンプ
Claims (20)
- 印刷回路基板上に相互対向するように搭載された第1機能を持つ第1半導体チップ及び第2機能を持つ第2半導体チップを備える半導体チップ積層構造と、
前記第1半導体チップと前記第2半導体チップとの間に介在されている熱伝達遮断スペーサと、を備えることを特徴とするマルチチップパッケージ。 - 前記第1半導体チップの上面で、前記第2半導体チップと対向する第1領域内には、前記熱伝達遮断スペーサにより覆われる第2領域が存在し、
前記熱伝達遮断スペーサは、前記第1半導体チップと前記第2半導体チップとの間にある前記第2領域で所定厚さをもって延びていることを特徴とする請求項1に記載のマルチチップパッケージ。 - 前記第1半導体チップの上面で、前記第1領域は、前記熱伝達遮断スペーサにより完全に覆われることを特徴とする請求項2に記載のマルチチップパッケージ。
- 前記第1半導体チップの上面で、前記第1領域は、前記熱伝達遮断スペーサによりその一部のみ覆われることを特徴とする請求項2に記載のマルチチップパッケージ。
- 前記第1半導体チップの上面で、前記第1領域のうち、前記熱伝達遮断スペーサにより覆われる第2領域は、前記熱伝達遮断スペーサにより覆われていない第3領域と同じか、またはさらに大きい面積を持つことを特徴とする請求項4に記載のマルチチップパッケージ。
- 前記熱伝達遮断スペーサは、円形、楕円形または多角形の上面を持つシート型部材から形成されることを特徴とする請求項5に記載のマルチチップパッケージ。
- 前記第1半導体チップの上面で、前記第1領域のうち、前記熱伝達遮断スペーサにより覆われる第2領域は、前記熱伝達遮断スペーサにより覆われていない第3領域よりさらに小さな面積を持つことを特徴とする請求項4に記載のマルチチップパッケージ。
- 前記熱伝達遮断スペーサは、環形、十字型、曲線型または矩形の上面を持つことを特徴とする請求項7に記載のマルチチップパッケージ。
- 前記熱伝達遮断スペーサは、エポキシ樹脂、炭酸マグネシウム、ケイ酸カルシウム、マグネシア、パーライト、コルク、綿フェルト、炭化コルク、石綿、ガラス綿、石英綿、硅藻土、またはこれらの混合物から形成されることを特徴とする請求項1に記載のマルチチップパッケージ。
- 前記第1機能及び前記第2機能は、相異なる機能であることを特徴とする請求項1に記載のマルチチップパッケージ。
- 前記第1半導体チップはロジックチップであり、前記第2半導体チップはメモリチップであることを特徴とする請求項10に記載のマルチチップパッケージ。
- 前記第1半導体チップ及び第2半導体チップは、それぞれ相異なる種類のメモリチップであることを特徴とする請求項1に記載のマルチチップパッケージ。
- 前記第1半導体チップは、及び第2半導体チップのうちいずれか一つは揮発性メモリチップであり、他の一つは不揮発性メモリチップであることを特徴とする請求項12に記載のマルチチップパッケージ。
- 前記印刷回路基板で、前記第1半導体チップ及び第2半導体チップのうち消費電力がさらに大きい半導体チップにさらに近い位置に形成されたソルダーボールで構成されるBGAをさらに備えることを特徴とする請求項1に記載のマルチチップパッケージ。
- 前記半導体チップ積層構造から発生する熱を外部に放出させるために、前記半導体チップ積層構造の上部に設置されたヒートシンクをさらに備え、
前記第1半導体チップ及び第2半導体チップは、これらのうち、消費電力がさらに大きい半導体チップが前記ヒートシンクにさらに近接して配置されていることを特徴とする請求項1に記載のマルチチップパッケージ。 - 前記印刷回路基板で、前記第1半導体チップ及び第2半導体チップのうち、消費電力がさらに大きい半導体チップにさらに近い位置に形成されたソルダーボールで構成されるBGAと、
前記半導体チップ積層構造から発生する熱を外部に放出させるために、前記半導体チップ積層構造の上部に設置されたヒートシンクと、をさらに備え、
前記第1半導体チップ及び第2半導体チップは、これらのうち、消費電力がさらに大きい半導体チップが前記ヒートシンクにさらに近接して配置されていることを特徴とする請求項1に記載のマルチチップパッケージ。 - 前記半導体チップ積層構造は、ロジックチップで形成される1つの半導体チップと、メモリチップで形成される複数の半導体チップと、を備えることを特徴とする請求項1に記載のマルチチップパッケージ。
- 前記第1半導体チップ及び第2半導体チップは、前記印刷回路基板の第1表面上に順に積層されていることを特徴とする請求項1に記載のマルチチップパッケージ。
- 前記第1半導体チップ及び第2半導体チップは、前記印刷回路基板を介して相互対向して前記印刷回路基板上に搭載されていることを特徴とする請求項1に記載のマルチチップパッケージ。
- 前記第1半導体チップと前記熱伝達遮断スペーサとの間、そして、前記第2半導体チップと前記熱伝達遮断スペーサとの間には、それぞれ接着層が介在されていることを特徴とする請求項1に記載のマルチチップパッケージ。
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JP2003303937A (ja) * | 2002-04-05 | 2003-10-24 | Nec Electronics Corp | 半導体装置及びその製造方法 |
JP2004228485A (ja) * | 2003-01-27 | 2004-08-12 | Hitachi Ltd | 半導体チップ積層パッケージ構造、及び、かかるパッケージ構造に好適な半導体装置 |
JP2005347390A (ja) * | 2004-06-01 | 2005-12-15 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP2006066816A (ja) * | 2004-08-30 | 2006-03-09 | Toshiba Corp | 半導体装置の製造方法及び半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012015225A (ja) * | 2010-06-30 | 2012-01-19 | Hitachi Ltd | 半導体装置 |
Also Published As
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US20080054433A1 (en) | 2008-03-06 |
KR100809701B1 (ko) | 2008-03-06 |
US8698304B2 (en) | 2014-04-15 |
JP5247079B2 (ja) | 2013-07-24 |
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