JP5042668B2 - 積層パッケージ - Google Patents
積層パッケージ Download PDFInfo
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- JP5042668B2 JP5042668B2 JP2007061029A JP2007061029A JP5042668B2 JP 5042668 B2 JP5042668 B2 JP 5042668B2 JP 2007061029 A JP2007061029 A JP 2007061029A JP 2007061029 A JP2007061029 A JP 2007061029A JP 5042668 B2 JP5042668 B2 JP 5042668B2
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- Prior art keywords
- stacked
- semiconductor chip
- base substrate
- package according
- electrical connection
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/151—Die mounting substrate
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- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Description
前記スペーサは前記半導体チップよりも小さな大きさを有する。
前記外部接続端子ははんだボールである。
図1は本発明の実施形態に従う積層パッケージを図示した断面図であり、図2は本発明の実施形態に従う積層パッケージの分解断面図である。
300a パッケージユニット
110,310 ベース基板
112 接続パッド
114,314 ボールランド
120,320 半導体チップ
130,330 スペーサ
140,340 熱伝達膜
150 貫通孔
160 電気的接続部材
170,370 ヒートシンク
172,372 挿入溝
174,374 分岐部
180,380 外部接続端子
390 パターンテープ
392,394 バンプランド
396 バンプ
Claims (10)
- 上面に接続パッドが具備され、下面にボールランドが具備されたベース基板と、
前記ベース基板上にスペーサを介在して積層され、前記接続パッドに対応する部分に電気的接続用貫通孔が具備された少なくとも2つの半導体チップと、
前記電気的接続用貫通孔に挿入され、前記積層された半導体チップとベース基板との間を電気的に接続する電気的接続部材と、
前記積層された半導体チップの両側面各々と接触しながら前記ベース基板上に垂直に立てて設置された一対のヒートシンクと、
前記ベース基板下面のボールランドに取着された外部接続端子と、を含み、
前記ヒートシンクが、前記積層された半導体チップと接触する一側面に各前記半導体チップが挿入される挿入溝を有することを特徴とする積層パッケージ。 - 前記接続パッドは前記ベース基板上面の両側面縁に配列されるように具備されることを特徴とする請求項1に記載の積層パッケージ。
- 前記スペーサは前記半導体チップよりも小さな大きさを有することを特徴とする請求項1又は請求項2に記載の積層パッケージ。
- 前記ヒートシンクと接触するように前記半導体チップの一面全体に塗布された熱伝達膜をさらに含むことを特徴とする請求項1乃至請求項3の何れか1項に記載の積層パッケージ。
- 前記熱伝達膜は前記半導体チップの後面に塗布されることを特徴とする請求項4に記載の積層パッケージ。
- 前記電気的接続部材は銅ピンであることを特徴とする請求項1乃至請求項5の何れか1項に記載の積層パッケージ。
- 前記銅ピンは、前記積層された半導体チップの前記電気的接続用貫通孔内に挿入されるとともに前記ベース基板の接続パッドと接触することを特徴とする請求項6に記載の積層パッケージ。
- 前記銅ピンは、前記積層された半導体チップの前記電気的接続用貫通孔内に挿入され前記積層された半導体チップと電気的に接続されるとともに前記ベース基板の接続パッドと電気的に接続され、前記積層された半導体チップとベース基板との間を電気的に接続することを特徴とする請求項6又は請求項7に記載の積層パッケージ。
- 前記ヒートシンクには、前記一側面と対向する他側面に、多数の分岐部が具備されることを特徴とする請求項1乃至請求項8の何れか1項に記載の積層パッケージ。
- 前記外部接続端子ははんだボールであることを特徴とする請求項1乃至請求項9の何れか1項に記載の積層パッケージ。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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KR10-2006-0059815 | 2006-06-29 | ||
KR20060059815 | 2006-06-29 | ||
KR1020060132019A KR100842910B1 (ko) | 2006-06-29 | 2006-12-21 | 스택 패키지 |
KR10-2006-0132019 | 2006-12-21 |
Publications (2)
Publication Number | Publication Date |
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JP2008010825A JP2008010825A (ja) | 2008-01-17 |
JP5042668B2 true JP5042668B2 (ja) | 2012-10-03 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007061029A Expired - Fee Related JP5042668B2 (ja) | 2006-06-29 | 2007-03-09 | 積層パッケージ |
Country Status (2)
Country | Link |
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US (1) | US7429792B2 (ja) |
JP (1) | JP5042668B2 (ja) |
Families Citing this family (51)
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KR100809701B1 (ko) * | 2006-09-05 | 2008-03-06 | 삼성전자주식회사 | 칩간 열전달 차단 스페이서를 포함하는 멀티칩 패키지 |
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JP5219908B2 (ja) * | 2009-04-14 | 2013-06-26 | 株式会社ジャパンディスプレイイースト | タッチパネル装置 |
JP5826029B2 (ja) * | 2009-04-14 | 2015-12-02 | 株式会社フジクラ | 電子デバイス実装方法 |
KR101078740B1 (ko) * | 2009-12-31 | 2011-11-02 | 주식회사 하이닉스반도체 | 스택 패키지 및 그의 제조방법 |
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KR101212061B1 (ko) * | 2010-06-09 | 2012-12-13 | 에스케이하이닉스 주식회사 | 반도체 칩 및 그 반도체 패키지와 이를 이용한 스택 패키지 |
JP2013529850A (ja) * | 2010-07-05 | 2013-07-22 | モサイド・テクノロジーズ・インコーポレーテッド | 熱フレームを有するマルチチップパッケージおよび組立て方法 |
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US8659896B2 (en) | 2010-09-13 | 2014-02-25 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules |
US8427832B2 (en) | 2011-01-05 | 2013-04-23 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cold plate assemblies and power electronics modules |
US8391008B2 (en) | 2011-02-17 | 2013-03-05 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics modules and power electronics module assemblies |
US8482919B2 (en) | 2011-04-11 | 2013-07-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics card assemblies, power electronics modules, and power electronics devices |
US9257359B2 (en) | 2011-07-22 | 2016-02-09 | International Business Machines Corporation | System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks |
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JP4086068B2 (ja) * | 2004-12-27 | 2008-05-14 | 日本電気株式会社 | 半導体装置 |
US7369410B2 (en) * | 2006-05-03 | 2008-05-06 | International Business Machines Corporation | Apparatuses for dissipating heat from semiconductor devices |
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