JP2007505493A5 - - Google Patents
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- JP2007505493A5 JP2007505493A5 JP2006526060A JP2006526060A JP2007505493A5 JP 2007505493 A5 JP2007505493 A5 JP 2007505493A5 JP 2006526060 A JP2006526060 A JP 2006526060A JP 2006526060 A JP2006526060 A JP 2006526060A JP 2007505493 A5 JP2007505493 A5 JP 2007505493A5
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/659,108 US7183587B2 (en) | 2003-09-09 | 2003-09-09 | Solid metal block mounting substrates for semiconductor light emitting devices |
PCT/US2004/017326 WO2005027233A2 (en) | 2003-09-09 | 2004-06-01 | Solid metal block mounting substrates for semiconductor light emitting devices, and oxidizing methods for fabricating same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007505493A JP2007505493A (ja) | 2007-03-08 |
JP2007505493A5 true JP2007505493A5 (ja) | 2007-07-19 |
Family
ID=34226914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006526060A Pending JP2007505493A (ja) | 2003-09-09 | 2004-06-01 | 半導体発光装置用の固体金属ブロック実装基板およびその製造のための酸化方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7183587B2 (ja) |
EP (1) | EP1665395B1 (ja) |
JP (1) | JP2007505493A (ja) |
KR (1) | KR20060079214A (ja) |
CN (2) | CN1849712A (ja) |
CA (1) | CA2537972A1 (ja) |
TW (1) | TW200516788A (ja) |
WO (1) | WO2005027233A2 (ja) |
Families Citing this family (105)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7521667B2 (en) * | 2003-06-23 | 2009-04-21 | Advanced Optical Technologies, Llc | Intelligent solid state lighting |
US7145125B2 (en) | 2003-06-23 | 2006-12-05 | Advanced Optical Technologies, Llc | Integrating chamber cone light using LED sources |
US7915085B2 (en) * | 2003-09-18 | 2011-03-29 | Cree, Inc. | Molded chip fabrication method |
TWI227570B (en) * | 2003-12-11 | 2005-02-01 | South Epitaxy Corp | Light-emitting diode packaging structure |
US7355284B2 (en) | 2004-03-29 | 2008-04-08 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element |
WO2006005062A2 (en) * | 2004-06-30 | 2006-01-12 | Cree, Inc. | Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices |
JP2006049657A (ja) * | 2004-08-06 | 2006-02-16 | Citizen Electronics Co Ltd | Ledランプ |
US7217583B2 (en) * | 2004-09-21 | 2007-05-15 | Cree, Inc. | Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension |
US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
KR101187746B1 (ko) * | 2004-11-18 | 2012-10-05 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 조명기 및 이를 제조하는 방법 |
KR100580753B1 (ko) * | 2004-12-17 | 2006-05-15 | 엘지이노텍 주식회사 | 발광소자 패키지 |
US7322732B2 (en) | 2004-12-23 | 2008-01-29 | Cree, Inc. | Light emitting diode arrays for direct backlighting of liquid crystal displays |
EP1878062A2 (en) * | 2005-04-28 | 2008-01-16 | Koninklijke Philips Electronics N.V. | Light source comprising led arranged in recess |
US7425083B2 (en) | 2005-05-02 | 2008-09-16 | Samsung Electro-Mechanics Co., Ltd. | Light emitting device package |
TWI422044B (zh) * | 2005-06-30 | 2014-01-01 | Cree Inc | 封裝發光裝置之晶片尺度方法及經晶片尺度封裝之發光裝置 |
KR100631993B1 (ko) * | 2005-07-20 | 2006-10-09 | 삼성전기주식회사 | Led 패키지 및 그 제조방법 |
US20070019129A1 (en) * | 2005-07-20 | 2007-01-25 | Cree, Inc. | Independent control of light emitting diodes for backlighting of color displays |
JP5209177B2 (ja) * | 2005-11-14 | 2013-06-12 | 新光電気工業株式会社 | 半導体装置および半導体装置の製造方法 |
JP2009516913A (ja) * | 2005-11-22 | 2009-04-23 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 発光モジュール及びその製造方法 |
CN103925521A (zh) * | 2005-12-21 | 2014-07-16 | 科锐公司 | 照明装置 |
US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
KR100746783B1 (ko) * | 2006-02-28 | 2007-08-06 | 엘지전자 주식회사 | 발광소자 패키지 및 그 제조방법 |
US8969908B2 (en) * | 2006-04-04 | 2015-03-03 | Cree, Inc. | Uniform emission LED package |
KR100764432B1 (ko) * | 2006-04-05 | 2007-10-05 | 삼성전기주식회사 | 아노다이징 절연 층을 갖는 엘이디 패키지 및 그 제조방법 |
KR100735310B1 (ko) * | 2006-04-21 | 2007-07-04 | 삼성전기주식회사 | 다층 반사 면 구조를 갖는 엘이디 패키지 및 그 제조방법 |
US7625103B2 (en) * | 2006-04-21 | 2009-12-01 | Cree, Inc. | Multiple thermal path packaging for solid state light emitting apparatus and associated assembling methods |
TWI296037B (en) * | 2006-04-28 | 2008-04-21 | Delta Electronics Inc | Light emitting apparatus |
TWI314366B (en) * | 2006-04-28 | 2009-09-01 | Delta Electronics Inc | Light emitting apparatus |
TWI296036B (en) * | 2006-04-28 | 2008-04-21 | Delta Electronics Inc | Light emitting apparatus |
WO2007130536A2 (en) | 2006-05-05 | 2007-11-15 | Cree Led Lighting Solutions, Inc. | Lighting device |
WO2007139781A2 (en) * | 2006-05-23 | 2007-12-06 | Cree Led Lighting Solutions, Inc. | Lighting device |
JP2009538531A (ja) * | 2006-05-23 | 2009-11-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | 照明装置、および、製造方法 |
US7677765B2 (en) * | 2006-06-15 | 2010-03-16 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Light emitting device having a metal can package for improved heat dissipation |
KR100854328B1 (ko) * | 2006-07-07 | 2008-08-28 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
US7943952B2 (en) * | 2006-07-31 | 2011-05-17 | Cree, Inc. | Method of uniform phosphor chip coating and LED package fabricated using method |
US20080035942A1 (en) * | 2006-08-08 | 2008-02-14 | Lg Electronics Inc. | Light emitting device package and method for manufacturing the same |
JP2008053685A (ja) * | 2006-08-23 | 2008-03-06 | Samsung Electro Mech Co Ltd | 垂直構造窒化ガリウム系発光ダイオード素子及びその製造方法 |
CN101675298B (zh) * | 2006-09-18 | 2013-12-25 | 科锐公司 | 照明装置、照明装置组合、灯具及其使用方法 |
US8827507B2 (en) * | 2006-09-21 | 2014-09-09 | Cree, Inc. | Lighting assemblies, methods of installing same, and methods of replacing lights |
US8497560B2 (en) * | 2006-10-06 | 2013-07-30 | Industrial Technology Research Institute | LED package and method of assembling the same |
US10295147B2 (en) * | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
WO2008061082A1 (en) * | 2006-11-14 | 2008-05-22 | Cree Led Lighting Solutions, Inc. | Light engine assemblies |
WO2008061084A1 (en) * | 2006-11-14 | 2008-05-22 | Cree Led Lighting Solutions, Inc. | Lighting assemblies and components for lighting assemblies |
US20080121911A1 (en) * | 2006-11-28 | 2008-05-29 | Cree, Inc. | Optical preforms for solid state light emitting dice, and methods and systems for fabricating and assembling same |
KR100851183B1 (ko) * | 2006-12-27 | 2008-08-08 | 엘지이노텍 주식회사 | 반도체 발광소자 패키지 |
US9024349B2 (en) * | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US9159888B2 (en) * | 2007-01-22 | 2015-10-13 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US8232564B2 (en) * | 2007-01-22 | 2012-07-31 | Cree, Inc. | Wafer level phosphor coating technique for warm light emitting diodes |
US8258682B2 (en) | 2007-02-12 | 2012-09-04 | Cree, Inc. | High thermal conductivity packaging for solid state light emitting apparatus and associated assembling methods |
KR100862454B1 (ko) * | 2007-02-27 | 2008-10-08 | 삼성전기주식회사 | Led를 구비한 백라이트 유닛 및 그 제조방법 |
TW200843130A (en) * | 2007-04-17 | 2008-11-01 | Wen Lin | Package structure of a surface-mount high-power light emitting diode chip and method of making the same |
US7967480B2 (en) * | 2007-05-03 | 2011-06-28 | Cree, Inc. | Lighting fixture |
CN103471013A (zh) * | 2007-05-07 | 2013-12-25 | 科锐公司 | 照明装置 |
US20080283864A1 (en) * | 2007-05-16 | 2008-11-20 | Letoquin Ronan P | Single Crystal Phosphor Light Conversion Structures for Light Emitting Devices |
KR100888228B1 (ko) * | 2007-06-22 | 2009-03-12 | (주)웨이브닉스이에스피 | 금속베이스 광소자 패키지 모듈 및 그 제조방법 |
US10505083B2 (en) * | 2007-07-11 | 2019-12-10 | Cree, Inc. | Coating method utilizing phosphor containment structure and devices fabricated using same |
WO2009012287A1 (en) * | 2007-07-17 | 2009-01-22 | Cree Led Lighting Solutions, Inc. | Optical elements with internal optical features and methods of fabricating same |
JP5039474B2 (ja) * | 2007-07-31 | 2012-10-03 | 三洋電機株式会社 | 発光モジュールおよびその製造方法 |
TW200909986A (en) * | 2007-08-31 | 2009-03-01 | Coretronic Corp | Lamp holder and fabrications thereof |
KR100877881B1 (ko) | 2007-09-06 | 2009-01-08 | 엘지이노텍 주식회사 | 발광다이오드 패키지 및 그 제조방법 |
TWI353657B (en) * | 2007-09-28 | 2011-12-01 | Ind Tech Res Inst | An island submount |
USD615504S1 (en) * | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
KR100907823B1 (ko) * | 2007-12-12 | 2009-07-14 | 한국전자통신연구원 | 테라헤르츠파 소자의 패키징 장치 |
US8167674B2 (en) * | 2007-12-14 | 2012-05-01 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
US9041285B2 (en) | 2007-12-14 | 2015-05-26 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
CN101471399A (zh) * | 2007-12-27 | 2009-07-01 | 富准精密工业(深圳)有限公司 | 发光二极管 |
JP4989614B2 (ja) * | 2007-12-28 | 2012-08-01 | サムソン エルイーディー カンパニーリミテッド. | 高出力ledパッケージの製造方法 |
US7732829B2 (en) * | 2008-02-05 | 2010-06-08 | Hymite A/S | Optoelectronic device submount |
US8637883B2 (en) | 2008-03-19 | 2014-01-28 | Cree, Inc. | Low index spacer layer in LED devices |
KR100992778B1 (ko) | 2008-05-23 | 2010-11-05 | 엘지이노텍 주식회사 | 발광소자 패키지 및 그 제조방법 |
JP5289835B2 (ja) * | 2008-06-25 | 2013-09-11 | シャープ株式会社 | 発光装置およびその製造方法 |
US8240875B2 (en) | 2008-06-25 | 2012-08-14 | Cree, Inc. | Solid state linear array modules for general illumination |
US20100001305A1 (en) * | 2008-07-07 | 2010-01-07 | Visera Technologies Company Limited | Semiconductor devices and fabrication methods thereof |
US9052416B2 (en) | 2008-11-18 | 2015-06-09 | Cree, Inc. | Ultra-high efficacy semiconductor light emitting devices |
US8853712B2 (en) | 2008-11-18 | 2014-10-07 | Cree, Inc. | High efficacy semiconductor light emitting devices employing remote phosphor configurations |
US8004172B2 (en) | 2008-11-18 | 2011-08-23 | Cree, Inc. | Semiconductor light emitting apparatus including elongated hollow wavelength conversion tubes and methods of assembling same |
TW201020643A (en) * | 2008-11-25 | 2010-06-01 | Chi Mei Lighting Tech Corp | Side view type light-emitting diode package structure, and manufacturing method and application thereof |
KR101077264B1 (ko) * | 2009-02-17 | 2011-10-27 | (주)포인트엔지니어링 | 광소자용 기판, 이를 갖는 광소자 패키지 및 이의 제조 방법 |
US20100301359A1 (en) * | 2009-05-26 | 2010-12-02 | Ming-Hsiung Liu | Light Emitting Diode Package Structure |
US8530990B2 (en) | 2009-07-20 | 2013-09-10 | Sunpower Corporation | Optoelectronic device with heat spreader unit |
DE102009039982A1 (de) * | 2009-09-03 | 2011-03-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements |
KR20110068689A (ko) * | 2009-12-16 | 2011-06-22 | 삼성전기주식회사 | 광학소자용 패키지 기판 및 그 제조방법 |
KR101039881B1 (ko) * | 2009-12-21 | 2011-06-09 | 엘지이노텍 주식회사 | 발광소자 및 그를 이용한 라이트 유닛 |
KR101093719B1 (ko) * | 2010-01-04 | 2011-12-19 | (주)웨이브닉스이에스피 | 금속기판을 이용한 고출력 소자의 패키지 모듈 구조 및 그 제조방법 |
US9991427B2 (en) * | 2010-03-08 | 2018-06-05 | Cree, Inc. | Photonic crystal phosphor light conversion structures for light emitting devices |
US10546846B2 (en) | 2010-07-23 | 2020-01-28 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
US8563849B2 (en) | 2010-08-03 | 2013-10-22 | Sunpower Corporation | Diode and heat spreader for solar module |
JP5416674B2 (ja) * | 2010-09-30 | 2014-02-12 | 富士フイルム株式会社 | 絶縁基板およびその製造方法ならびにそれを用いた光源モジュールおよび液晶表示装置 |
US9166126B2 (en) | 2011-01-31 | 2015-10-20 | Cree, Inc. | Conformally coated light emitting devices and methods for providing the same |
EP2693500A1 (en) * | 2011-03-28 | 2014-02-05 | FUJI-FILM Corporation | Reflective substrate for light-emitting element and method for producing same |
CN102185083B (zh) * | 2011-04-20 | 2013-10-02 | 莱芜市凤凰新能源科技集团有限公司 | 照明级led的制造方法 |
US20150001570A1 (en) * | 2011-09-02 | 2015-01-01 | King Dragon International Inc. | LED Package and Method of the Same |
US9117941B2 (en) * | 2011-09-02 | 2015-08-25 | King Dragon International Inc. | LED package and method of the same |
US10043960B2 (en) * | 2011-11-15 | 2018-08-07 | Cree, Inc. | Light emitting diode (LED) packages and related methods |
US8933473B1 (en) * | 2012-06-01 | 2015-01-13 | Valery Dubin | Method, apparatus and system for providing light source structures on a flexible substrate |
US8636198B1 (en) | 2012-09-28 | 2014-01-28 | Sunpower Corporation | Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells |
KR101415928B1 (ko) * | 2012-11-28 | 2014-07-04 | 주식회사 루멘스 | 발광장치 및 이를 구비하는 백라이트 유닛 |
KR101517949B1 (ko) * | 2013-11-27 | 2015-05-07 | 주식회사 루멘스 | 발광 소자 패키지 및 이의 제작 방법 |
WO2014084645A1 (ko) * | 2012-11-28 | 2014-06-05 | 주식회사 루멘스 | 발광소자 패키지 및 이의 제작 방법 |
JP6004094B2 (ja) * | 2013-04-24 | 2016-10-05 | 富士電機株式会社 | パワー半導体モジュールおよびその製造方法、電力変換器 |
JP2016518030A (ja) * | 2013-04-29 | 2016-06-20 | アーベーベー・テクノロジー・アーゲー | パワー半導体装置のモジュール配列 |
TWI563620B (en) * | 2015-05-12 | 2016-12-21 | Taiwan Green Point Entpr Co | Electronic device and method for making the same |
US10715140B2 (en) | 2017-11-30 | 2020-07-14 | Dura Operating, Llc | Laminated light guide and electrical component carrier |
EP3893274A1 (en) * | 2020-04-07 | 2021-10-13 | ABB Schweiz AG | Cooling element and method of manufacturing a cooling element |
DE102020212424A1 (de) | 2020-10-01 | 2022-04-07 | Robert Bosch Gesellschaft mit beschränkter Haftung | Laser-Bauelement und Verfahren zur Herstellung eines Laser-Bauelements |
Family Cites Families (113)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4042552A (en) * | 1972-09-19 | 1977-08-16 | Warner-Lambert Company | Composition for hydrophilic lens blank and method of casting |
US4107238A (en) * | 1976-01-22 | 1978-08-15 | Exxon Research & Engineering Co. | Graft copolymerization process |
US4141941A (en) * | 1977-09-21 | 1979-02-27 | American Optical Corporation | Contact lens casting method |
US4562018A (en) * | 1985-01-28 | 1985-12-31 | Neefe Charles W | Method of casting optical surfaces on lens blanks |
US4650922A (en) * | 1985-03-11 | 1987-03-17 | Texas Instruments Incorporated | Thermally matched mounting substrate |
US4826424A (en) * | 1985-09-25 | 1989-05-02 | Canon Kabushiki Kaisha | Lens barrel made by injection molding |
US5753730A (en) * | 1986-12-15 | 1998-05-19 | Mitsui Toatsu Chemicals, Inc. | Plastic lenses having a high-refractive index, process for the preparation thereof and casting polymerization process for preparing sulfur-containing urethane resin lens and lens prepared thereby |
US4794048A (en) * | 1987-05-04 | 1988-12-27 | Allied-Signal Inc. | Ceramic coated metal substrates for electronic applications |
JP2593703B2 (ja) * | 1987-12-24 | 1997-03-26 | 三菱電線工業株式会社 | 発光ダイオード照明具 |
US4935665A (en) * | 1987-12-24 | 1990-06-19 | Mitsubishi Cable Industries Ltd. | Light emitting diode lamp |
EP0333162B1 (en) * | 1988-03-16 | 1994-06-15 | Mitsubishi Rayon Co., Ltd. | Phosphor paste compositions and phosphor coatings obtained therefrom |
CN1046741A (zh) * | 1988-04-30 | 1990-11-07 | 三井东圧化学株式会社 | 以多硫化物为基础的树脂,含有该树脂的塑料透镜以及制造该种透镜的方法 |
ATE147323T1 (de) * | 1988-11-02 | 1997-01-15 | British Tech Group | Giessen und verpacken von kontaktlinsen |
US5027168A (en) * | 1988-12-14 | 1991-06-25 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
US4918497A (en) * | 1988-12-14 | 1990-04-17 | Cree Research, Inc. | Blue light emitting diode formed in silicon carbide |
US5024966A (en) * | 1988-12-21 | 1991-06-18 | At&T Bell Laboratories | Method of forming a silicon-based semiconductor optical device mount |
US5087949A (en) * | 1989-06-27 | 1992-02-11 | Hewlett-Packard Company | Light-emitting diode with diagonal faces |
US4966862A (en) * | 1989-08-28 | 1990-10-30 | Cree Research, Inc. | Method of production of light emitting diodes |
JP2668140B2 (ja) * | 1989-09-30 | 1997-10-27 | 三菱電線工業株式会社 | 発光モジュール |
NL9000161A (nl) * | 1990-01-23 | 1991-08-16 | Koninkl Philips Electronics Nv | Halfgeleiderinrichting bevattende een drager en werkwijze voor het vervaardigen van de drager. |
US5210051A (en) * | 1990-03-27 | 1993-05-11 | Cree Research, Inc. | High efficiency light emitting diodes from bipolar gallium nitride |
US5110278A (en) * | 1990-11-30 | 1992-05-05 | Pilkington Visioncare, Inc. | Injection molding apparatus for producing a toric lens casting mold arbor |
JPH0555636A (ja) * | 1991-08-22 | 1993-03-05 | Sanken Electric Co Ltd | 半導体発光装置の製造方法 |
JPH05152609A (ja) | 1991-11-25 | 1993-06-18 | Nichia Chem Ind Ltd | 発光ダイオード |
DE4242842C2 (de) * | 1992-02-14 | 1999-11-04 | Sharp Kk | Lichtemittierendes Bauelement zur Oberflächenmontage und Verfahren zu dessen Herstellung |
JP2822819B2 (ja) | 1992-11-09 | 1998-11-11 | 日亜化学工業株式会社 | 多色発光素子 |
JPH06177429A (ja) | 1992-12-08 | 1994-06-24 | Nichia Chem Ind Ltd | 青色led素子 |
JP2964822B2 (ja) | 1993-02-19 | 1999-10-18 | 日亜化学工業株式会社 | 発光ダイオードの製造方法 |
US5416342A (en) * | 1993-06-23 | 1995-05-16 | Cree Research, Inc. | Blue light-emitting diode with high external quantum efficiency |
US5338944A (en) * | 1993-09-22 | 1994-08-16 | Cree Research, Inc. | Blue light-emitting diode with degenerate junction structure |
US5393993A (en) * | 1993-12-13 | 1995-02-28 | Cree Research, Inc. | Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices |
US5604135A (en) * | 1994-08-12 | 1997-02-18 | Cree Research, Inc. | Method of forming green light emitting diode in silicon carbide |
US5523589A (en) * | 1994-09-20 | 1996-06-04 | Cree Research, Inc. | Vertical geometry light emitting diode with group III nitride active layer and extended lifetime |
US5631190A (en) * | 1994-10-07 | 1997-05-20 | Cree Research, Inc. | Method for producing high efficiency light-emitting diodes and resulting diode structures |
JPH08116095A (ja) | 1994-10-14 | 1996-05-07 | Hamamatsu Photonics Kk | 発光装置 |
JPH08162676A (ja) | 1994-12-02 | 1996-06-21 | Nichia Chem Ind Ltd | 発光ダイオード |
US5739554A (en) * | 1995-05-08 | 1998-04-14 | Cree Research, Inc. | Double heterojunction light emitting diode with gallium nitride active layer |
JP3832877B2 (ja) * | 1995-07-26 | 2006-10-11 | 日亜化学工業株式会社 | セラミックスledパッケージおよびその製造方法 |
JPH0983018A (ja) | 1995-09-11 | 1997-03-28 | Nippon Denyo Kk | 発光ダイオードユニット |
CN1112663C (zh) | 1995-12-29 | 2003-06-25 | 克里公司 | 发光二极管点矩阵的真彩色平板显示器及激励方法和设备 |
JP3264615B2 (ja) * | 1996-02-29 | 2002-03-11 | ホーヤ株式会社 | プラスチックレンズの射出成形方法 |
JP2947156B2 (ja) * | 1996-02-29 | 1999-09-13 | 双葉電子工業株式会社 | 蛍光体の製造方法 |
JPH09246603A (ja) | 1996-03-08 | 1997-09-19 | Nichia Chem Ind Ltd | 発光ダイオード及びそれを用いた表示装置 |
JPH1012927A (ja) * | 1996-06-25 | 1998-01-16 | Mitsubishi Cable Ind Ltd | 電圧制御リード付led発光体 |
DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
JP2927279B2 (ja) | 1996-07-29 | 1999-07-28 | 日亜化学工業株式会社 | 発光ダイオード |
JPH1098215A (ja) | 1996-09-24 | 1998-04-14 | Toyoda Gosei Co Ltd | 発光ダイオード装置 |
US5851063A (en) * | 1996-10-28 | 1998-12-22 | General Electric Company | Light-emitting diode white light source |
US5813753A (en) * | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
US5882553A (en) * | 1997-06-09 | 1999-03-16 | Guide Corporation | Multi-color lens assembly injection molding process and apparatus |
US5968422A (en) * | 1997-06-30 | 1999-10-19 | Bausch & Lomb Incorporated | Injection molding process for rotationally asymmetric contact lens surfaces |
JP3065286B2 (ja) * | 1997-09-24 | 2000-07-17 | 日本電気株式会社 | 固体電解コンデンサおよびその製造方法 |
US6201262B1 (en) * | 1997-10-07 | 2001-03-13 | Cree, Inc. | Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure |
JPH11163419A (ja) * | 1997-11-26 | 1999-06-18 | Rohm Co Ltd | 発光装置 |
US6105177A (en) * | 1997-12-26 | 2000-08-22 | Paulson Manufacturing Corp. | Protective goggles |
JP3241338B2 (ja) | 1998-01-26 | 2001-12-25 | 日亜化学工業株式会社 | 半導体発光装置 |
US6184544B1 (en) * | 1998-01-29 | 2001-02-06 | Rohm Co., Ltd. | Semiconductor light emitting device with light reflective current diffusion layer |
US6252254B1 (en) * | 1998-02-06 | 2001-06-26 | General Electric Company | Light emitting device with phosphor composition |
JP3541709B2 (ja) | 1998-02-17 | 2004-07-14 | 日亜化学工業株式会社 | 発光ダイオードの形成方法 |
JP3618221B2 (ja) | 1998-04-13 | 2005-02-09 | 日亜化学工業株式会社 | 発光装置 |
US5959316A (en) * | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
JP3490906B2 (ja) | 1998-09-22 | 2004-01-26 | 日亜化学工業株式会社 | 半導体装置及びその製造方法 |
US6404125B1 (en) * | 1998-10-21 | 2002-06-11 | Sarnoff Corporation | Method and apparatus for performing wavelength-conversion using phosphors with light emitting diodes |
US6391231B1 (en) * | 1998-11-23 | 2002-05-21 | Younger Mfg. Co. | Method for side-fill lens casting |
US6177688B1 (en) * | 1998-11-24 | 2001-01-23 | North Carolina State University | Pendeoepitaxial gallium nitride semiconductor layers on silcon carbide substrates |
JP3667125B2 (ja) | 1998-12-07 | 2005-07-06 | 日亜化学工業株式会社 | 光半導体装置とその製造方法 |
JP3613041B2 (ja) | 1998-12-16 | 2005-01-26 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
US6373188B1 (en) * | 1998-12-22 | 2002-04-16 | Honeywell International Inc. | Efficient solid-state light emitting device with excited phosphors for producing a visible light output |
JP3366586B2 (ja) | 1998-12-28 | 2003-01-14 | 日亜化学工業株式会社 | 発光ダイオード |
JP2000236116A (ja) * | 1999-02-15 | 2000-08-29 | Matsushita Electric Works Ltd | 光源装置 |
US6329676B1 (en) * | 1999-03-01 | 2001-12-11 | Toru Takayama | Flat panel solid state light source |
JP2001015815A (ja) * | 1999-04-28 | 2001-01-19 | Sanken Electric Co Ltd | 半導体発光装置 |
JP3690968B2 (ja) | 1999-06-30 | 2005-08-31 | 日亜化学工業株式会社 | 発光装置及びその形成方法 |
JP3833019B2 (ja) | 1999-08-31 | 2006-10-11 | 日亜化学工業株式会社 | 発光ダイオード |
US6824294B2 (en) * | 1999-09-24 | 2004-11-30 | Cao Group, Inc. | Light for use in activating light-activated materials, the light having a plurality of chips mounted in a gross well of a heat sink, and a dome covering the chips |
US6783362B2 (en) * | 1999-09-24 | 2004-08-31 | Cao Group, Inc. | Dental curing light using primary and secondary heat sink combination |
JP2001144334A (ja) | 1999-11-17 | 2001-05-25 | Nichia Chem Ind Ltd | 光半導体装置及び形成方法 |
JP3685057B2 (ja) | 1999-12-08 | 2005-08-17 | 日亜化学工業株式会社 | Ledランプ及びその製造方法 |
DE10006738C2 (de) | 2000-02-15 | 2002-01-17 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung |
JP3589187B2 (ja) | 2000-07-31 | 2004-11-17 | 日亜化学工業株式会社 | 発光装置の形成方法 |
TW521409B (en) * | 2000-10-06 | 2003-02-21 | Shing Chen | Package of LED |
MY145695A (en) | 2001-01-24 | 2012-03-30 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
JP3636079B2 (ja) | 2001-01-26 | 2005-04-06 | 日亜化学工業株式会社 | パッケージ成形体と発光装置 |
US6791119B2 (en) | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
JP4066608B2 (ja) | 2001-03-16 | 2008-03-26 | 日亜化学工業株式会社 | パッケージ成形体及びその製造方法 |
US6958497B2 (en) | 2001-05-30 | 2005-10-25 | Cree, Inc. | Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures |
US20030032212A1 (en) * | 2001-08-07 | 2003-02-13 | Bily Wang | LED focusing cup in a stacked substrate |
JP3645207B2 (ja) | 2001-09-03 | 2005-05-11 | 日亜化学工業株式会社 | 発光ダイオード |
JP4122784B2 (ja) * | 2001-09-19 | 2008-07-23 | 松下電工株式会社 | 発光装置 |
JP4122743B2 (ja) * | 2001-09-19 | 2008-07-23 | 松下電工株式会社 | 発光装置 |
JP3948650B2 (ja) * | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
US6531328B1 (en) * | 2001-10-11 | 2003-03-11 | Solidlite Corporation | Packaging of light-emitting diode |
JP4108318B2 (ja) * | 2001-11-13 | 2008-06-25 | シチズン電子株式会社 | 発光装置 |
JP2003163378A (ja) * | 2001-11-26 | 2003-06-06 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード及びその製造方法 |
KR100439402B1 (ko) * | 2001-12-24 | 2004-07-09 | 삼성전기주식회사 | 발광다이오드 패키지 |
US6480389B1 (en) * | 2002-01-04 | 2002-11-12 | Opto Tech Corporation | Heat dissipation structure for solid-state light emitting device package |
US20030153861A1 (en) * | 2002-02-11 | 2003-08-14 | Royer George R. | Wound treatment bandage |
JP4269709B2 (ja) | 2002-02-19 | 2009-05-27 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
US6639356B2 (en) * | 2002-03-28 | 2003-10-28 | Unity Opto Technology Co., Ltd. | Heat dissipating light emitting diode |
JP2003017755A (ja) | 2002-06-13 | 2003-01-17 | Nichia Chem Ind Ltd | 発光装置 |
US6599768B1 (en) * | 2002-08-20 | 2003-07-29 | United Epitaxy Co., Ltd. | Surface mounting method for high power light emitting diode |
US7264378B2 (en) * | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
US7244965B2 (en) * | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
US20040041757A1 (en) * | 2002-09-04 | 2004-03-04 | Ming-Hsiang Yang | Light emitting diode display module with high heat-dispersion and the substrate thereof |
ATE543221T1 (de) * | 2002-09-19 | 2012-02-15 | Cree Inc | Leuchtstoffbeschichtete leuchtdioden mit verjüngten seitenwänden und herstellungsverfahren dafür |
US6744077B2 (en) * | 2002-09-27 | 2004-06-01 | Lumileds Lighting U.S., Llc | Selective filtering of wavelength-converted semiconductor light emitting devices |
US6686609B1 (en) * | 2002-10-01 | 2004-02-03 | Ultrastar Limited | Package structure of surface mounting led and method of manufacturing the same |
TW563264B (en) * | 2002-10-11 | 2003-11-21 | Highlink Technology Corp | Base of optoelectronic device |
US20040095738A1 (en) * | 2002-11-15 | 2004-05-20 | Der-Ming Juang | Base plate for a light emitting diode chip |
KR20040092512A (ko) * | 2003-04-24 | 2004-11-04 | (주)그래픽테크노재팬 | 방열 기능을 갖는 반사판이 구비된 반도체 발광장치 |
US7095053B2 (en) * | 2003-05-05 | 2006-08-22 | Lamina Ceramics, Inc. | Light emitting diodes packaged for high temperature operation |
-
2003
- 2003-09-09 US US10/659,108 patent/US7183587B2/en not_active Expired - Lifetime
-
2004
- 2004-06-01 EP EP04754031.5A patent/EP1665395B1/en active Active
- 2004-06-01 CN CN200480025701.5A patent/CN1849712A/zh active Pending
- 2004-06-01 KR KR1020067004796A patent/KR20060079214A/ko not_active Application Discontinuation
- 2004-06-01 JP JP2006526060A patent/JP2007505493A/ja active Pending
- 2004-06-01 CA CA002537972A patent/CA2537972A1/en not_active Abandoned
- 2004-06-01 WO PCT/US2004/017326 patent/WO2005027233A2/en active Search and Examination
- 2004-06-01 CN CN200910151806.XA patent/CN101630715B/zh active Active
- 2004-09-08 TW TW093127203A patent/TW200516788A/zh unknown
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