JP2016518030A - パワー半導体装置のモジュール配列 - Google Patents
パワー半導体装置のモジュール配列 Download PDFInfo
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- JP2016518030A JP2016518030A JP2016510966A JP2016510966A JP2016518030A JP 2016518030 A JP2016518030 A JP 2016518030A JP 2016510966 A JP2016510966 A JP 2016510966A JP 2016510966 A JP2016510966 A JP 2016510966A JP 2016518030 A JP2016518030 A JP 2016518030A
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Abstract
Description
図1に、先行技術に従うパワー半導体モジュール10の配列が概略的に示される。上記パワーモジュール10の内部構造を詳細に説明する。パワーモジュール10は、少なくとも1つのパワー半導体装置14が中に配置されるハウジング12を含む。半導体装置14は、代表的に、絶縁ゲートバイポーラトランジスタ(IGBT)、ダイオード、金属酸化物半導体電界効果トランジスタ(MOSFET)等であってもよい。図1に従うと、ダイオードおよびIGBTが設けられている。半導体装置14または複数の半導体装置14は、端子16を介しておよびゲート接続18を介して接続可能であり、半導体装置14は好ましくはアルミニウムのボンドワイヤ20によってボンディングされている。
10 パワー半導体モジュール
12 ハウジング
14 パワー半導体装置
16 端子
18 ゲート接続
20 ボンドワイヤ
22 エポキシ
24 基板
26 メタライゼーション
28 はんだ
30 メタライゼーション
31 はんだ
32 絶縁性ゲル
34 ベースプレート
36 モジュール配列
38 パワー半導体モジュール
40 基板
42 第1面
44 第2面
46 端子
48 ゲート接続
50 はんだ
52 ベースプレート
53 メタライゼーション
54 はんだ
56 内側の容積
58 モジュール囲い
59 封止部
60 配列囲い
62 容積
64 ダイオード
66 IGBT
68 はんだ
70 ボンドワイヤ
72 導電層
74 絶縁層
76 接続領域
78 ビアホール
80 壁部
82 蓋
84 封止部
85 封止部
86 ベースプレート
88 メタライゼーション
90 はんだ
92 電気導体
94 封止部
96 フィードスルー
Claims (10)
- パワー半導体装置のモジュール配列であって、1つ以上のパワー半導体モジュール(38)を含み、前記1つ以上のパワー半導体モジュール(38)は、第1面(42)と第1面(42)の反対側に位置する第2面(44)とを有する基板(40)を含み、前記基板(40)は少なくとも部分的に絶縁性であり、前記基板(40)の第1面(42)に導電構造が配置され、少なくとも1つのパワー半導体装置が前記導電構造上に配置されかつ前記導電構造に電気的に接続され、前記1つ以上のモジュール(38)は前記少なくとも1つのパワー半導体装置を収容するための内側の容積(56)を含み、前記内側の容積はモジュール囲い(58)によって周囲から気密封止され、前記モジュール配列(36)は前記1つ以上のモジュール(38)を収容するための容積(62)を少なくとも部分的に定める配列囲い(60)を含み、前記配列囲い(60)は前記容積(62)を覆う、モジュール配列。
- 前記1つ以上のモジュール(38)の各内側の容積(56)はモジュール囲い(58)によって周囲から気密封止される、請求項1に記載のモジュール配列。
- 少なくとも1つのモジュール(38)の基板(40)は、絶縁領域と導電領域とを含み、前記絶縁領域および前記導電領域は、前記基板(40)を通してモジュール(38)に含まれる少なくとも1つの半導体装置が外部から接触されるように、配置される、請求項1および2のいずれか一項に記載のモジュール配列。
- 前記導電領域は、少なくとも1つのパワー半導体装置を、ビアホール(78)によって前記モジュール囲い(58)の外部に位置する接続領域(76)に接続する、請求項3に記載のモジュール配列。
- 前記1つ以上のモジュール(38)の内部に接触するための電気導体(92)が、気密封止部(94)により前記モジュール囲い(58)を通して導かれる、請求項1〜4のいずれか一項に記載のモジュール配列。
- 前記モジュール囲い(58)および/または前記配列囲い(60)は、AlSiCおよび金属からなる群より選択された少なくとも1つの材料を含む、請求項1〜5のいずれか一項に記載のモジュール配列。
- 前記1つ以上のモジュール(38)の内側の容積(56)は、シリコンゲルおよび不活性ガスからなる群より選択された化合物で満たされる、請求項1〜6のいずれか一項に記載のモジュール配列。
- 前記配列囲い(60)は前記配列囲いが定める容積(62)を気密封止する、請求項1〜7のいずれか一項に記載のモジュール配列。
- 前記配列囲い(60)によって少なくとも部分的に定められる前記容積(62)は、シリコンゲルおよび不活性ガスからなる群より選択された化合物で満たされる、請求項1〜8のいずれか一項に記載のモジュール配列。
- 請求項1〜9のいずれか一項に記載のモジュール配列(36)を含む電気装置。
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EP13165785 | 2013-04-29 | ||
EP13165785.0 | 2013-04-29 | ||
PCT/EP2014/051815 WO2014177289A1 (en) | 2013-04-29 | 2014-01-30 | Module arrangement for power semiconductor devices |
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JP2016518030A true JP2016518030A (ja) | 2016-06-20 |
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JP2016510966A Pending JP2016518030A (ja) | 2013-04-29 | 2014-01-30 | パワー半導体装置のモジュール配列 |
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US (1) | US9601399B2 (ja) |
EP (1) | EP2992551B1 (ja) |
JP (1) | JP2016518030A (ja) |
KR (1) | KR20160002834A (ja) |
CN (1) | CN105144371A (ja) |
WO (1) | WO2014177289A1 (ja) |
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US10959342B2 (en) * | 2019-04-08 | 2021-03-23 | Kevin R. Williams | Condensation resistant power semiconductor module |
US10104759B2 (en) * | 2016-11-29 | 2018-10-16 | Nxp Usa, Inc. | Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof |
DE102016123917A1 (de) * | 2016-12-09 | 2018-06-14 | Endress+Hauser SE+Co. KG | Elektronik-Baugruppe |
US20220148992A1 (en) * | 2020-11-12 | 2022-05-12 | Taiwan Semiconductor Manufacturing Company Ltd. | Package structure and method of forming the package structure |
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Publication number | Publication date |
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EP2992551B1 (en) | 2017-03-29 |
US9601399B2 (en) | 2017-03-21 |
CN105144371A (zh) | 2015-12-09 |
US20160049342A1 (en) | 2016-02-18 |
EP2992551A1 (en) | 2016-03-09 |
KR20160002834A (ko) | 2016-01-08 |
WO2014177289A1 (en) | 2014-11-06 |
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