SI2149902T1 - Močnostni polprevodniški moduli in naprava za električni oblok, ki le-tega uporablja - Google Patents

Močnostni polprevodniški moduli in naprava za električni oblok, ki le-tega uporablja

Info

Publication number
SI2149902T1
SI2149902T1 SI200732088T SI200732088T SI2149902T1 SI 2149902 T1 SI2149902 T1 SI 2149902T1 SI 200732088 T SI200732088 T SI 200732088T SI 200732088 T SI200732088 T SI 200732088T SI 2149902 T1 SI2149902 T1 SI 2149902T1
Authority
SI
Slovenia
Prior art keywords
same
discharge device
power semiconductor
semiconductor module
arc discharge
Prior art date
Application number
SI200732088T
Other languages
English (en)
Inventor
Osamu Soda
Yuji Ohnishi
Kazunori Inami
Toshio Uchida
Original Assignee
Sansha Electric Manufacturing Company, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sansha Electric Manufacturing Company, Limited filed Critical Sansha Electric Manufacturing Company, Limited
Publication of SI2149902T1 publication Critical patent/SI2149902T1/sl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arc Welding Control (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SI200732088T 2007-05-18 2007-05-18 Močnostni polprevodniški moduli in naprava za električni oblok, ki le-tega uporablja SI2149902T1 (sl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/060251 WO2008142759A1 (ja) 2007-05-18 2007-05-18 アーク放電装置
EP07743686.3A EP2149902B1 (en) 2007-05-18 2007-05-18 Power semiconductor module and arc discharge device using the same

Publications (1)

Publication Number Publication Date
SI2149902T1 true SI2149902T1 (sl) 2019-03-29

Family

ID=40031486

Family Applications (1)

Application Number Title Priority Date Filing Date
SI200732088T SI2149902T1 (sl) 2007-05-18 2007-05-18 Močnostni polprevodniški moduli in naprava za električni oblok, ki le-tega uporablja

Country Status (7)

Country Link
US (1) US8223496B2 (sl)
EP (1) EP2149902B1 (sl)
JP (1) JP5240863B2 (sl)
KR (2) KR101081724B1 (sl)
CN (1) CN101681905B (sl)
SI (1) SI2149902T1 (sl)
WO (1) WO2008142759A1 (sl)

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WO2009111615A2 (en) 2008-03-05 2009-09-11 Thrombovision, Inc. Systems for measuring properties of a physiological fluid suspension
JP5113815B2 (ja) * 2009-09-18 2013-01-09 株式会社東芝 パワーモジュール
JP5835466B2 (ja) * 2012-03-28 2015-12-24 富士電機株式会社 半導体装置
JP5954410B2 (ja) 2012-03-28 2016-07-20 富士電機株式会社 半導体装置
WO2013145619A1 (ja) * 2012-03-28 2013-10-03 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP5859906B2 (ja) 2012-04-20 2016-02-16 三菱電機株式会社 半導体装置および半導体装置の製造方法
CN104603934B (zh) * 2012-08-27 2018-01-16 三菱电机株式会社 电力用半导体装置
WO2014175062A1 (ja) * 2013-04-24 2014-10-30 富士電機株式会社 パワー半導体モジュールおよびその製造方法、電力変換器
WO2014177289A1 (en) * 2013-04-29 2014-11-06 Abb Technology Ag Module arrangement for power semiconductor devices
JP6171586B2 (ja) 2013-06-04 2017-08-02 富士電機株式会社 半導体装置
CN105742252B (zh) * 2014-12-09 2019-05-07 台达电子工业股份有限公司 一种功率模块及其制造方法
US9663096B2 (en) 2015-02-20 2017-05-30 Ford Global Technologies, Llc Methods and systems for mitigating fuel injector leak
WO2022066250A1 (en) * 2020-09-24 2022-03-31 Hrl Laboratories, Llc Wafer-level integrated micro-structured heat spreaders

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DE4112022A1 (de) * 1991-04-12 1992-10-15 Telefunken Electronic Gmbh Gehaeuse fuer den einbau in kraftfahrzeuge zur aufnahme von elektronikbauteilen
JP3186109B2 (ja) 1991-08-23 2001-07-11 株式会社ダイヘン 交流アーク溶接用電源装置
TW283274B (sl) * 1994-11-08 1996-08-11 Sansha Denki Seisakusho Co Ltd
JP3225457B2 (ja) * 1995-02-28 2001-11-05 株式会社日立製作所 半導体装置
JP3168901B2 (ja) * 1996-02-22 2001-05-21 株式会社日立製作所 パワー半導体モジュール
JPH09237869A (ja) 1996-02-29 1997-09-09 Hitachi Ltd 樹脂封止型パワーモジュール装置及びその製造方法
JP3155476B2 (ja) 1996-11-05 2001-04-09 株式会社三社電機製作所 直流アークスタート補助回路
CN1146988C (zh) * 1997-12-08 2004-04-21 东芝株式会社 半导体功率器件的封装及其组装方法
JP2001036005A (ja) 1999-07-23 2001-02-09 Fuji Electric Co Ltd 半導体装置
JP3919398B2 (ja) * 1999-10-27 2007-05-23 三菱電機株式会社 半導体モジュール
US6549409B1 (en) * 2000-08-21 2003-04-15 Vlt Corporation Power converter assembly
JP4151209B2 (ja) 2000-08-29 2008-09-17 三菱電機株式会社 電力用半導体装置
US6307749B1 (en) * 2000-10-23 2001-10-23 Delphi Technologies, Inc. Overmolded electronic module with underfilled surface-mount components
JP2002203942A (ja) * 2000-12-28 2002-07-19 Fuji Electric Co Ltd パワー半導体モジュール
US6727585B2 (en) * 2001-05-04 2004-04-27 Ixys Corporation Power device with a plastic molded package and direct bonded substrate
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Also Published As

Publication number Publication date
JP5240863B2 (ja) 2013-07-17
CN101681905B (zh) 2012-06-13
KR101081724B1 (ko) 2011-11-08
KR20110098866A (ko) 2011-09-01
CN101681905A (zh) 2010-03-24
KR101081622B1 (ko) 2011-11-10
KR20090092318A (ko) 2009-08-31
EP2149902B1 (en) 2018-11-28
JPWO2008142759A1 (ja) 2010-08-05
WO2008142759A1 (ja) 2008-11-27
US20100128441A1 (en) 2010-05-27
US8223496B2 (en) 2012-07-17
EP2149902A1 (en) 2010-02-03
EP2149902A4 (en) 2011-11-09

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