PL2208225T3 - Moduł półprzewodnikowy mocy - Google Patents

Moduł półprzewodnikowy mocy

Info

Publication number
PL2208225T3
PL2208225T3 PL07819865T PL07819865T PL2208225T3 PL 2208225 T3 PL2208225 T3 PL 2208225T3 PL 07819865 T PL07819865 T PL 07819865T PL 07819865 T PL07819865 T PL 07819865T PL 2208225 T3 PL2208225 T3 PL 2208225T3
Authority
PL
Poland
Prior art keywords
power semiconductor
semiconductor module
module
power
semiconductor
Prior art date
Application number
PL07819865T
Other languages
English (en)
Inventor
Jörg DORN
Thomas KÜBEL
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of PL2208225T3 publication Critical patent/PL2208225T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14325—Housings specially adapted for power drive units or power converters for cabinets or racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14339—Housings specially adapted for power drive units or power converters specially adapted for high voltage operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
PL07819865T 2007-11-13 2007-11-13 Moduł półprzewodnikowy mocy PL2208225T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07819865.2A EP2208225B1 (de) 2007-11-13 2007-11-13 Leistungshalbleitermodul
PCT/EP2007/009995 WO2009062534A1 (de) 2007-11-13 2007-11-13 Leistungshalbleitermodul

Publications (1)

Publication Number Publication Date
PL2208225T3 true PL2208225T3 (pl) 2019-03-29

Family

ID=39619082

Family Applications (1)

Application Number Title Priority Date Filing Date
PL07819865T PL2208225T3 (pl) 2007-11-13 2007-11-13 Moduł półprzewodnikowy mocy

Country Status (7)

Country Link
US (1) US9064737B2 (pl)
EP (1) EP2208225B1 (pl)
JP (1) JP5127929B2 (pl)
CN (1) CN101855723B (pl)
ES (1) ES2705170T3 (pl)
PL (1) PL2208225T3 (pl)
WO (1) WO2009062534A1 (pl)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006136123A1 (de) * 2005-06-23 2006-12-28 Siemens Aktiengesellschaft Elektronikmodul
WO2010102654A1 (de) * 2009-03-13 2010-09-16 Siemens Aktiengesellschaft Leistungshalbleitermodul mit schichtweise aufgebauten isolierenden seitenwänden
CN101651135B (zh) * 2009-08-12 2010-12-29 荣信电力电子股份有限公司 66kV光控水冷晶闸管阀组
US9247655B2 (en) 2010-06-11 2016-01-26 Honeywell International Inc. Sheet metal explosion-proof, and flame-proof enclosures
WO2012088676A1 (zh) * 2010-12-29 2012-07-05 荣信电力电子股份有限公司 66kv光控水冷晶闸管阀组
US20140055888A1 (en) * 2011-05-10 2014-02-27 Abb Research Ltd Power module and method of operating a power module
JP5743811B2 (ja) * 2011-08-29 2015-07-01 株式会社東芝 電力変換装置
DE102013223430A1 (de) * 2013-11-18 2015-05-21 BSH Hausgeräte GmbH Vorrichtung mit einem Leistungselektronikmodul zum Versorgen eines elektrischen Verbrauchers eines Haushaltsgeräts mit elektrischer Versorgungsspannung, Haushaltsgerät und Verfahren zum Herstellen einer derartigen Vorrichtung
EP3007220A1 (en) * 2014-10-10 2016-04-13 ABB Technology AG Power semiconductor device having protection against explosion or rupture
JP6925279B2 (ja) * 2015-04-13 2021-08-25 アーベーベー・シュバイツ・アーゲーＡＢＢ Ｓｃｈｗｅｉｚ ＡＧ パワーエレクトロニクスモジュール
JP5926835B2 (ja) * 2015-04-23 2016-05-25 株式会社東芝 電力変換装置
WO2017108104A1 (de) * 2015-12-22 2017-06-29 Siemens Aktiengesellschaft Elektrisches modul mit elektrischer komponente
DE102016202600A1 (de) * 2016-02-19 2017-08-24 Siemens Aktiengesellschaft Elektrisches Modul mit elektrischer Komponente
DE102016202734A1 (de) * 2016-02-23 2017-08-24 Siemens Aktiengesellschaft Elektrische Einrichtung mit elektrischen Modulen
WO2017162264A1 (de) 2016-03-21 2017-09-28 Siemens Aktiengesellschaft Elektrische einrichtung und elektrische anlage mit kühlvorrichtung
US10541625B2 (en) 2016-12-22 2020-01-21 Mitsubishi Electric Corporation Power conversion device
WO2019117119A1 (ja) * 2017-12-14 2019-06-20 日本電産株式会社 インバータ、ケース入りインバータ、インバータ内蔵電動機及びインバータ内蔵複合装置
FR3076175B1 (fr) * 2017-12-22 2020-01-10 Valeo Siemens Eautomotive France Sas Equipement electrique a paroi deportee
DE102018204625A1 (de) * 2018-03-27 2019-10-02 Siemens Aktiengesellschaft Gehäuse für einen Umrichter, Endstufe eines Umrichters mit einem derartigen Gehäuse, Umrichter sowie Luftfahrzeug mit einem Umrichter
CN112237055A (zh) * 2018-05-25 2021-01-15 米巴能源控股有限公司 具有支承的冷却体的功率结构组件
AT521041B1 (de) * 2018-05-25 2019-10-15 Miba Energy Holding Gmbh Leistungsbaugruppe mit Schottwand
EP3799704B1 (de) 2018-07-17 2023-11-01 Siemens Energy Global GmbH & Co. KG Leistungshalbleitermodul
DE102019113193A1 (de) * 2019-05-17 2020-11-19 R. Stahl Schaltgeräte GmbH Baukastensystem zum Herstellen eines Gehäuses
US20220385164A1 (en) 2019-12-13 2022-12-01 Mitsubishi Electric Corporation Power conversion device

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635443A (en) 1979-08-31 1981-04-08 Toshiba Corp Semiconductor device
EP0033399B1 (de) 1980-02-01 1985-04-17 BBC Aktiengesellschaft Brown, Boveri & Cie. Explosionsgeschützte Halbleiterbauelement-Anordnung
DE3521572A1 (de) * 1985-06-15 1986-12-18 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit keramiksubstrat
US4878106A (en) 1986-12-02 1989-10-31 Anton Piller Gmbh & Co. Kg Semiconductor circuit packages for use in high power applications and method of making the same
US4963976A (en) * 1988-09-12 1990-10-16 Sundstrand Corporation Integrated electrical conducting, cooling and clamping assembly for power semiconductors
DE69018846T2 (de) * 1989-02-10 1995-08-24 Fujitsu Ltd Keramische Packung vom Halbleiteranordnungstyp und Verfahren zum Zusammensetzen derselben.
DE4418426B4 (de) * 1993-09-08 2007-08-02 Mitsubishi Denki K.K. Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls
DE4407810C2 (de) 1994-03-09 1998-02-26 Semikron Elektronik Gmbh Schaltungsanordnung (Modul)
JP3357220B2 (ja) * 1995-07-07 2002-12-16 三菱電機株式会社 半導体装置
JPH09140159A (ja) 1995-11-10 1997-05-27 Teikoku Denki Seisakusho:Kk 防爆インバータ盤
JP3879150B2 (ja) * 1996-08-12 2007-02-07 株式会社デンソー 半導体装置
DE19649798A1 (de) 1996-12-02 1998-06-04 Abb Research Ltd Leistungshalbleitermodul
JPH10335579A (ja) * 1997-05-27 1998-12-18 Toshiba Corp 大電力半導体モジュール装置
TW408453B (en) * 1997-12-08 2000-10-11 Toshiba Kk Package for semiconductor power device and method for assembling the same
JP3864282B2 (ja) 1998-09-22 2006-12-27 三菱マテリアル株式会社 パワーモジュール用基板及びその製造方法並びにこの基板を用いた半導体装置
WO2000055917A1 (de) 1999-03-17 2000-09-21 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Leistungshalbleitermodul
JP4044265B2 (ja) * 2000-05-16 2008-02-06 三菱電機株式会社 パワーモジュール
JP2002026251A (ja) * 2000-07-11 2002-01-25 Toshiba Corp 半導体装置
DE10039770A1 (de) 2000-08-16 2002-02-28 Bosch Gmbh Robert Kühlvorrichtung
JP2002203942A (ja) * 2000-12-28 2002-07-19 Fuji Electric Co Ltd パワー半導体モジュール
EP1263045A1 (en) * 2001-06-01 2002-12-04 ABB Schweiz AG High power semiconductor module
JP3627738B2 (ja) * 2001-12-27 2005-03-09 株式会社デンソー 半導体装置
RU25250U1 (ru) 2002-04-01 2002-09-20 Открытое акционерное общество "Всероссийский научно-исследовательский проектно-конструкторский и технологический институт релестроения с опытным производством" Силовой высоковольтный блок
US6724631B2 (en) * 2002-04-22 2004-04-20 Delta Electronics Inc. Power converter package with enhanced thermal management
US6989592B2 (en) * 2002-05-01 2006-01-24 The Boeing Company Integrated power module with reduced thermal impedance
DE102004018477B4 (de) * 2004-04-16 2008-08-21 Infineon Technologies Ag Halbleitermodul
JP2006190972A (ja) * 2004-12-08 2006-07-20 Mitsubishi Electric Corp 電力用半導体装置
US7598603B2 (en) * 2006-03-15 2009-10-06 Infineon Technologies Ag Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
JP4816214B2 (ja) 2006-04-13 2011-11-16 株式会社デンソー 半導体装置及びその製造方法
CN200956368Y (zh) 2006-06-16 2007-10-03 无锡天和电子有限公司 半导体功率器件的贴装式封装外壳
JP4878520B2 (ja) * 2006-08-09 2012-02-15 本田技研工業株式会社 半導体装置
US7701054B2 (en) 2007-02-12 2010-04-20 Infineon Technologies Ag Power semiconductor module and method for its manufacture
WO2010102654A1 (de) * 2009-03-13 2010-09-16 Siemens Aktiengesellschaft Leistungshalbleitermodul mit schichtweise aufgebauten isolierenden seitenwänden

Also Published As

Publication number Publication date
JP5127929B2 (ja) 2013-01-23
JP2011503852A (ja) 2011-01-27
US20100265744A1 (en) 2010-10-21
EP2208225B1 (de) 2018-10-10
CN101855723B (zh) 2012-04-25
US9064737B2 (en) 2015-06-23
EP2208225A1 (de) 2010-07-21
CN101855723A (zh) 2010-10-06
WO2009062534A1 (de) 2009-05-22
ES2705170T3 (es) 2019-03-22

Similar Documents

Publication Publication Date Title
PL2208225T3 (pl) Moduł półprzewodnikowy mocy
EP2224484A4 (en) SEMICONDUCTOR MODULE
EP2139046A4 (de) Fotovoltaisches modul
TWI347167B (en) Circuit module
EP2003691A4 (en) BASIS FOR A POWER MODULE
EP2217457A4 (en) CONTROL MODULE AND WHEELS
EP2426715A4 (en) POWER MODULE
EP2320544A4 (en) ATTACK CIRCUIT FOR POWER SEMICONDUCTOR ELEMENT
IL197886A0 (en) Formed photovoltaic module busbars
PT2541622E (pt) Módulos fotovoltaicos
EP2149474A4 (en) POWER UNIT
EP2159854A4 (en) THERMOELECTRIC CONVERSION MODULE
EP2361005A4 (en) CIRCUIT MODULE
HUE044101T2 (hu) Akkumulátor modul
EP2525404A4 (en) SEMICONDUCTOR POWER MODULE
EP2149903A4 (en) SEMICONDUCTOR MODULE FOR ELECTRIC CURRENT
GB0710662D0 (en) Power conversion circuit
TWI340470B (en) Semiconductor structure
HK1128993A1 (en) Panel-shaped semiconductor module
AU316226S (en) External power device
SI2340560T1 (sl) Močnostni stikalni modul
EP2169718A4 (en) POWER MODULE
GB0617727D0 (en) Photovoltaic devices
EP2040312A4 (en) SEMICONDUCTOR MODULE IN PANEL SHAPE
GB0520909D0 (en) Power semiconductor devices