JPWO2008142759A1 - アーク放電装置 - Google Patents
アーク放電装置 Download PDFInfo
- Publication number
- JPWO2008142759A1 JPWO2008142759A1 JP2009515028A JP2009515028A JPWO2008142759A1 JP WO2008142759 A1 JPWO2008142759 A1 JP WO2008142759A1 JP 2009515028 A JP2009515028 A JP 2009515028A JP 2009515028 A JP2009515028 A JP 2009515028A JP WO2008142759 A1 JPWO2008142759 A1 JP WO2008142759A1
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- module
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- semiconductor module
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- semiconductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Arc Welding Control (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
2 モジュール筐体
20 モジュール本体
200,201 ナット収容部
21 モジュール蓋
210 ガイド孔
22 上面開口部
23 下面開口部
24 取付孔
25,26 補強梁
27,28 ユニット当接部
3 共通ユニット
30 外部端子
31,32 共通端子
33,34 制御端子
35 パッケージ
300〜302 締結孔
311,312 ナット収容部
4 金属板
41,42 外部共通端子
400,401,402 締結孔
50 セラミック基板
51,52 金属層
53 半田層
54 半導体チップ
9 放熱器
91 伝熱面
510 放熱パターン
511 外周パターン
512 緩衝パターン
100 アーク溶接機
101 電源装置
102 制御回路
103 変圧器
104 トーチ
105 インバータ
W 被溶接物
Claims (1)
- アーク放電のために供給される交流電源の周波数を可変変換する電源装置を備えたアーク放電装置であって、
上記電源装置が、電力用半導体モジュール及び上記電力用半導体モジュールに取り付けられる放熱器を備え、
上記電力用半導体モジュールは、モジュール筐体と、上記モジュール筐体によって保持される2以上の共通ユニットとを備え、上記共通ユニットが、半導体素子が配設された回路面及び上記回路面に対向する放熱面を有するセラミック基板と、上記放熱面を露出させるとともに上記回路面を耐熱性樹脂により封止して形成されるパッケージとを有し、
上記放電器は、上記モジュール筐体に取り付けられることにより、上記2以上の共通ユニットの全ての上記放熱面に当接することを特徴とするアーク放電装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/060251 WO2008142759A1 (ja) | 2007-05-18 | 2007-05-18 | アーク放電装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008142759A1 true JPWO2008142759A1 (ja) | 2010-08-05 |
JP5240863B2 JP5240863B2 (ja) | 2013-07-17 |
Family
ID=40031486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009515028A Expired - Fee Related JP5240863B2 (ja) | 2007-05-18 | 2007-05-18 | 電力用半導体モジュール及びアーク放電装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8223496B2 (ja) |
EP (1) | EP2149902B1 (ja) |
JP (1) | JP5240863B2 (ja) |
KR (2) | KR101081724B1 (ja) |
CN (1) | CN101681905B (ja) |
SI (1) | SI2149902T1 (ja) |
WO (1) | WO2008142759A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009111615A2 (en) | 2008-03-05 | 2009-09-11 | Thrombovision, Inc. | Systems for measuring properties of a physiological fluid suspension |
JP5113815B2 (ja) * | 2009-09-18 | 2013-01-09 | 株式会社東芝 | パワーモジュール |
CN104170085B (zh) | 2012-03-28 | 2017-05-10 | 富士电机株式会社 | 半导体装置 |
JP5954410B2 (ja) | 2012-03-28 | 2016-07-20 | 富士電機株式会社 | 半導体装置 |
WO2013145619A1 (ja) * | 2012-03-28 | 2013-10-03 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
JP5859906B2 (ja) | 2012-04-20 | 2016-02-16 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
US9433075B2 (en) * | 2012-08-27 | 2016-08-30 | Mitsubishi Electric Corporation | Electric power semiconductor device |
JP6004094B2 (ja) * | 2013-04-24 | 2016-10-05 | 富士電機株式会社 | パワー半導体モジュールおよびその製造方法、電力変換器 |
EP2992551B1 (en) * | 2013-04-29 | 2017-03-29 | ABB Schweiz AG | Module arrangement for power semiconductor devices |
JP6171586B2 (ja) | 2013-06-04 | 2017-08-02 | 富士電機株式会社 | 半導体装置 |
CN105742252B (zh) * | 2014-12-09 | 2019-05-07 | 台达电子工业股份有限公司 | 一种功率模块及其制造方法 |
US9663096B2 (en) | 2015-02-20 | 2017-05-30 | Ford Global Technologies, Llc | Methods and systems for mitigating fuel injector leak |
US20210134510A1 (en) * | 2019-10-31 | 2021-05-06 | Analog Devices International Unlimited Company | Electronic device |
WO2022066250A1 (en) * | 2020-09-24 | 2022-03-31 | Hrl Laboratories, Llc | Wafer-level integrated micro-structured heat spreaders |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4112022A1 (de) * | 1991-04-12 | 1992-10-15 | Telefunken Electronic Gmbh | Gehaeuse fuer den einbau in kraftfahrzeuge zur aufnahme von elektronikbauteilen |
JP3186109B2 (ja) * | 1991-08-23 | 2001-07-11 | 株式会社ダイヘン | 交流アーク溶接用電源装置 |
TW283274B (ja) * | 1994-11-08 | 1996-08-11 | Sansha Denki Seisakusho Co Ltd | |
JP3225457B2 (ja) * | 1995-02-28 | 2001-11-05 | 株式会社日立製作所 | 半導体装置 |
JP3168901B2 (ja) * | 1996-02-22 | 2001-05-21 | 株式会社日立製作所 | パワー半導体モジュール |
JPH09237869A (ja) | 1996-02-29 | 1997-09-09 | Hitachi Ltd | 樹脂封止型パワーモジュール装置及びその製造方法 |
JP3155476B2 (ja) * | 1996-11-05 | 2001-04-09 | 株式会社三社電機製作所 | 直流アークスタート補助回路 |
CN1146988C (zh) * | 1997-12-08 | 2004-04-21 | 东芝株式会社 | 半导体功率器件的封装及其组装方法 |
JP2001036005A (ja) * | 1999-07-23 | 2001-02-09 | Fuji Electric Co Ltd | 半導体装置 |
JP3919398B2 (ja) * | 1999-10-27 | 2007-05-23 | 三菱電機株式会社 | 半導体モジュール |
US6549409B1 (en) * | 2000-08-21 | 2003-04-15 | Vlt Corporation | Power converter assembly |
JP4151209B2 (ja) * | 2000-08-29 | 2008-09-17 | 三菱電機株式会社 | 電力用半導体装置 |
US6307749B1 (en) * | 2000-10-23 | 2001-10-23 | Delphi Technologies, Inc. | Overmolded electronic module with underfilled surface-mount components |
JP2002203942A (ja) * | 2000-12-28 | 2002-07-19 | Fuji Electric Co Ltd | パワー半導体モジュール |
US6727585B2 (en) * | 2001-05-04 | 2004-04-27 | Ixys Corporation | Power device with a plastic molded package and direct bonded substrate |
DE10213648B4 (de) * | 2002-03-27 | 2011-12-15 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
JP4114497B2 (ja) * | 2003-02-14 | 2008-07-09 | 住友電装株式会社 | 回路構成体用ケース及び回路構成体の製造方法 |
DE10341512A1 (de) * | 2003-09-05 | 2005-04-14 | Bombardier Transportation Gmbh | Stromrichteranordnung |
US7149088B2 (en) * | 2004-06-18 | 2006-12-12 | International Rectifier Corporation | Half-bridge power module with insert molded heatsinks |
JP2006332291A (ja) * | 2005-05-25 | 2006-12-07 | Keihin Corp | パワードライブユニット |
JP4760585B2 (ja) * | 2006-07-18 | 2011-08-31 | 三菱電機株式会社 | 電力用半導体装置 |
-
2007
- 2007-05-18 US US12/451,155 patent/US8223496B2/en active Active
- 2007-05-18 JP JP2009515028A patent/JP5240863B2/ja not_active Expired - Fee Related
- 2007-05-18 KR KR1020117019494A patent/KR101081724B1/ko active IP Right Grant
- 2007-05-18 KR KR1020097014564A patent/KR101081622B1/ko active IP Right Grant
- 2007-05-18 SI SI200732088T patent/SI2149902T1/sl unknown
- 2007-05-18 CN CN2007800511876A patent/CN101681905B/zh active Active
- 2007-05-18 EP EP07743686.3A patent/EP2149902B1/en active Active
- 2007-05-18 WO PCT/JP2007/060251 patent/WO2008142759A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN101681905B (zh) | 2012-06-13 |
KR20110098866A (ko) | 2011-09-01 |
KR20090092318A (ko) | 2009-08-31 |
WO2008142759A1 (ja) | 2008-11-27 |
EP2149902B1 (en) | 2018-11-28 |
US20100128441A1 (en) | 2010-05-27 |
US8223496B2 (en) | 2012-07-17 |
JP5240863B2 (ja) | 2013-07-17 |
KR101081622B1 (ko) | 2011-11-10 |
EP2149902A4 (en) | 2011-11-09 |
KR101081724B1 (ko) | 2011-11-08 |
EP2149902A1 (en) | 2010-02-03 |
CN101681905A (zh) | 2010-03-24 |
SI2149902T1 (sl) | 2019-03-29 |
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