JP2005512345A - パワーモジュールおよびパワーモジュールアセンブリ - Google Patents
パワーモジュールおよびパワーモジュールアセンブリ Download PDFInfo
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- JP2005512345A JP2005512345A JP2003552035A JP2003552035A JP2005512345A JP 2005512345 A JP2005512345 A JP 2005512345A JP 2003552035 A JP2003552035 A JP 2003552035A JP 2003552035 A JP2003552035 A JP 2003552035A JP 2005512345 A JP2005512345 A JP 2005512345A
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- power module
- metal pattern
- cut
- power
- out metal
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H01L2924/143—Digital devices
- H01L2924/1433—Application-specific integrated circuit [ASIC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
・切り抜き金属パターンは、間に隙間が残るトラックを含んでおり、冷却面が、切り抜き金属パターンのトラックと、隙間を満たす電気絶縁補完部分とを含むこと、
・補完部分(parties complementaires)は、切り抜き金属パターンのトラックの周囲に一体成形されること、
・電気絶縁材がハウジングを構成し、その底が冷却面の少なくとも一部を構成すること、
・ハウジングが、側壁により画定されてパワー電子部品を含む内部スペースと、切り抜き金属パターンへの接続手段とを有し、充填材が、側壁間でパワー電子部品および接続手段の周囲のフリースペースを充填すること、
・充填材が、シリコーンジェルおよびエポキシ樹脂またはポリウレタン樹脂の中から選択されること、
・電気絶縁材が、切り抜き金属パターンおよびパワー電子部品の周囲に一体成形されるブロックを形成すること、
・切り抜き金属パターンをパワーモジュールの外部素子に接続する電気接続支持端子を含むこと、
・パワーモジュールの外部素子が、その制御手段を含むこと、
・パワー電子部品が、ダイオード、MOS型トランジスタ、IGBT型トランジスタ、およびASIC型IC(集積回路)の中の素子の一つであること、
・電気絶縁材が、エポキシ樹脂またはポリウレタン樹脂であること、を備えることができる。
Claims (13)
- 少なくとも一つの切り抜き金属パターン(14)と、切り抜き金属パターンに電気的に接続される少なくとも一つのパワー電子部品(16)と、パワーモジュールの結合を行う電気絶縁材(30;56)とを含んでおり、このモジュールの外部冷却手段と直接接するように構成された冷却面(28)を有する一体型のパワーモジュール(12)であって、前記冷却面の少なくとも一部が、前記切り抜き金属パターンを含むことを特徴とするパワーモジュール。
- 切り抜き金属パターン(14)は、間に隙間(15)が残るトラックを含んでおり、冷却面が、切り抜き金属パターン(14)のトラックと、隙間(15)を満たす電気絶縁補完部分(30;56)とを含むことを特徴とする、請求項1に記載のパワーモジュール。
- 補完部分(30;56)が、切り抜き金属パターン(14)のトラックの周囲に一体成形されることを特徴とする、請求項1または2に記載のパワーモジュール。
- 電気絶縁材(30)がハウジング(26)を構成し、その底(28)が冷却面の少なくとも一部を構成することを特徴とする、請求項1から3のいずれか一項に記載のパワーモジュール。
- 前記ハウジング(26)が、側壁(32)により画定されてパワー電子部品(16)を含む内部スペースと、切り抜き金属パターン(14)への接続手段とを有し、充填材(36)が、側壁(32)の間でパワー電子部品および接続手段の周囲のフリースペースを充填することを特徴とする、請求項4に記載のパワーモジュール。
- 充填材(36)が、シリコーンジェルおよびエポキシ樹脂またはポリウレタン樹脂の中から選択されることを特徴とする、請求項5に記載のパワーモジュール。
- 電気絶縁材(56)が、切り抜き金属パターン(14)およびパワー電子部品(16)の周囲に一体成形されるブロックを形成することを特徴とする、請求項1から3のいずれか一項に記載のパワーモジュール。
- 切り抜き金属パターン(14)をパワーモジュールの外部素子に接続する電気接続支持端子(40)を含むことを特徴とする、請求項1から7のいずれか一項に記載のパワーモジュール。
- パワーモジュールの外部素子がその制御手段を含むことを特徴とする、請求項8に記載のパワーモジュール。
- パワー電子部品(16)が、ダイオード、MOS型トランジスタ、IGBT型トランジスタ、およびASIC型ICの中の素子の一つであることを特徴とする、請求項1から9のいずれか一項に記載のパワーモジュール。
- 電気絶縁材(30;56)が、エポキシ樹脂またはポリウレタン樹脂であることを特徴とする、請求項1から10のいずれか一項に記載のパワーモジュール。
- 各パワーモジュール(12)の冷却面(28)を含む面(44)を備えることを特徴とする請求項1から11のいずれか一項に記載の少なくとも一つのパワーモジュール(12)を含む、パワーモジュールアセンブリ(10)。
- アセンブリケース(42)を含んでおり、その底(44)が、各パワーモジュール(12)の冷却面(28)を含む面の少なくとも一部を構成することを特徴とする、請求項12に記載のパワーモジュールアセンブリ(10)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0116153A FR2833802B1 (fr) | 2001-12-13 | 2001-12-13 | Module de puissance et ensemble de modules de puissance |
PCT/FR2002/004323 WO2003051095A1 (fr) | 2001-12-13 | 2002-12-12 | Module de puissance et ensemble de modules de puissance |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005512345A true JP2005512345A (ja) | 2005-04-28 |
JP4634714B2 JP4634714B2 (ja) | 2011-02-16 |
Family
ID=8870465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003552035A Expired - Lifetime JP4634714B2 (ja) | 2001-12-13 | 2002-12-12 | パワーモジュールおよびパワーモジュールアセンブリ |
Country Status (8)
Country | Link |
---|---|
US (1) | US20050161778A1 (ja) |
EP (1) | EP1454516B1 (ja) |
JP (1) | JP4634714B2 (ja) |
AU (1) | AU2002364647A1 (ja) |
DE (1) | DE60228321D1 (ja) |
ES (1) | ES2311648T3 (ja) |
FR (1) | FR2833802B1 (ja) |
WO (1) | WO2003051095A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015142066A (ja) * | 2014-01-30 | 2015-08-03 | ローム株式会社 | パワーモジュールおよびその製造方法 |
JP2016518030A (ja) * | 2013-04-29 | 2016-06-20 | アーベーベー・テクノロジー・アーゲー | パワー半導体装置のモジュール配列 |
JP2017028222A (ja) * | 2015-07-28 | 2017-02-02 | トヨタ自動車株式会社 | リアクトル |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2976763B1 (fr) * | 2011-06-16 | 2014-03-28 | Valeo Sys Controle Moteur Sas | Assemblage d'un module electronique de puissance et d'une carte pcb a capteur integre |
FR2979177B1 (fr) * | 2011-08-19 | 2014-05-23 | Valeo Sys Controle Moteur Sas | Bloc de puissance pour onduleur de vehicule electrique |
US8847384B2 (en) | 2012-10-15 | 2014-09-30 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power modules and power module arrays having a modular design |
US20150001700A1 (en) * | 2013-06-28 | 2015-01-01 | Infineon Technologies Ag | Power Modules with Parylene Coating |
DE102015204025A1 (de) * | 2015-03-06 | 2016-09-08 | Continental Automotive Gmbh | Elektrische Maschine mit einem Kühlkörper |
FR3050863B1 (fr) | 2016-04-28 | 2018-10-12 | Valeo Systemes De Controle Moteur | Module electronique de puissance, ensemble electrique et compresseur de suralimentation electrique comprenant un tel module electronique de puissance |
US10177057B2 (en) | 2016-12-15 | 2019-01-08 | Infineon Technologies Ag | Power semiconductor modules with protective coating |
JP7045975B2 (ja) | 2018-11-20 | 2022-04-01 | 三菱電機株式会社 | 半導体装置およびその製造方法、ならびに電力変換装置 |
JP7131436B2 (ja) * | 2019-03-06 | 2022-09-06 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
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JPH08227952A (ja) * | 1995-02-20 | 1996-09-03 | Fujitsu General Ltd | パワーモジュール |
JPH0945851A (ja) * | 1995-08-02 | 1997-02-14 | Matsushita Electron Corp | 樹脂封止型半導体装置およびその製造方法 |
JPH11251508A (ja) * | 1998-03-02 | 1999-09-17 | Sanken Electric Co Ltd | 絶縁物封止型電子装置及びその製造方法 |
JP2001110985A (ja) * | 1999-10-08 | 2001-04-20 | Nissan Motor Co Ltd | 半導体装置 |
JP2001237369A (ja) * | 2000-01-12 | 2001-08-31 | Internatl Rectifier Corp | 基板を持たない低コストパワー半導体モジュール |
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US5808357A (en) * | 1992-06-02 | 1998-09-15 | Fujitsu Limited | Semiconductor device having resin encapsulated package structure |
US5285352A (en) * | 1992-07-15 | 1994-02-08 | Motorola, Inc. | Pad array semiconductor device with thermal conductor and process for making the same |
US5812375A (en) * | 1996-05-06 | 1998-09-22 | Cummins Engine Company, Inc. | Electronic assembly for selective heat sinking and two-sided component attachment |
US5894108A (en) * | 1997-02-11 | 1999-04-13 | National Semiconductor Corporation | Plastic package with exposed die |
EP0895287A3 (en) * | 1997-07-31 | 2006-04-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and lead frame for the same |
JP3677403B2 (ja) * | 1998-12-07 | 2005-08-03 | パイオニア株式会社 | 発熱素子の放熱構造 |
FR2802714B1 (fr) * | 1999-12-21 | 2002-03-08 | Sagem | Module electrique de puissance et procede pour sa fabrication |
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2001
- 2001-12-13 FR FR0116153A patent/FR2833802B1/fr not_active Expired - Lifetime
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2002
- 2002-12-12 EP EP02804613A patent/EP1454516B1/fr not_active Expired - Lifetime
- 2002-12-12 US US10/498,855 patent/US20050161778A1/en not_active Abandoned
- 2002-12-12 AU AU2002364647A patent/AU2002364647A1/en not_active Abandoned
- 2002-12-12 DE DE60228321T patent/DE60228321D1/de not_active Expired - Lifetime
- 2002-12-12 WO PCT/FR2002/004323 patent/WO2003051095A1/fr active IP Right Grant
- 2002-12-12 JP JP2003552035A patent/JP4634714B2/ja not_active Expired - Lifetime
- 2002-12-12 ES ES02804613T patent/ES2311648T3/es not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08227952A (ja) * | 1995-02-20 | 1996-09-03 | Fujitsu General Ltd | パワーモジュール |
JPH0945851A (ja) * | 1995-08-02 | 1997-02-14 | Matsushita Electron Corp | 樹脂封止型半導体装置およびその製造方法 |
JPH11251508A (ja) * | 1998-03-02 | 1999-09-17 | Sanken Electric Co Ltd | 絶縁物封止型電子装置及びその製造方法 |
JP2001110985A (ja) * | 1999-10-08 | 2001-04-20 | Nissan Motor Co Ltd | 半導体装置 |
JP2001237369A (ja) * | 2000-01-12 | 2001-08-31 | Internatl Rectifier Corp | 基板を持たない低コストパワー半導体モジュール |
Cited By (3)
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JP2016518030A (ja) * | 2013-04-29 | 2016-06-20 | アーベーベー・テクノロジー・アーゲー | パワー半導体装置のモジュール配列 |
JP2015142066A (ja) * | 2014-01-30 | 2015-08-03 | ローム株式会社 | パワーモジュールおよびその製造方法 |
JP2017028222A (ja) * | 2015-07-28 | 2017-02-02 | トヨタ自動車株式会社 | リアクトル |
Also Published As
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ES2311648T3 (es) | 2009-02-16 |
FR2833802A1 (fr) | 2003-06-20 |
DE60228321D1 (de) | 2008-09-25 |
EP1454516A1 (fr) | 2004-09-08 |
US20050161778A1 (en) | 2005-07-28 |
FR2833802B1 (fr) | 2004-03-12 |
JP4634714B2 (ja) | 2011-02-16 |
EP1454516B1 (fr) | 2008-08-13 |
AU2002364647A1 (en) | 2003-06-23 |
WO2003051095A1 (fr) | 2003-06-19 |
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