JP2006049657A - Ledランプ - Google Patents
Ledランプ Download PDFInfo
- Publication number
- JP2006049657A JP2006049657A JP2004230104A JP2004230104A JP2006049657A JP 2006049657 A JP2006049657 A JP 2006049657A JP 2004230104 A JP2004230104 A JP 2004230104A JP 2004230104 A JP2004230104 A JP 2004230104A JP 2006049657 A JP2006049657 A JP 2006049657A
- Authority
- JP
- Japan
- Prior art keywords
- led lamp
- light
- translucent
- lamp according
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
【解決手段】 電極パターンが形成されている回路基板22と、該回路基板22上に載置され凹部32を有する反射枠体31と、凹部32に実装される発光体27と、反射枠体31の上面に設けるレンズ部8が形成されている透光性封止板3とを備えたLEDランプ30において、透光性封止板3の光出射側表面にレンズ部8を保護するための保護部材11を備え、該保護部材11は、厚さ方向に貫通する開口部11aを有し、該開口部11aの内径がレンズ部8のレンズ有効径8aの外周部またはレンズ有効径8aの外側に位置するように配置されていることを特徴とする。
【選択図】 図6
Description
本発明の目的は上記従来技術における課題を解決して透光性封止板のレンズ部が傷等の破損を受けることを防止すると共にレンズ部から出射される光の光学特性を向上させ、優れた輝度特性と長期信頼性を有するLEDランプを提供することにある。
示している。
尚、本実施例においては、保護部材の開口部の内周面が略円錐台形状である例で説明したが、これに限定されるものではなく、角錐台形形状、または球面の一部、放物面の一部、非球面等の曲面状に形成しても良い。
さらに、実施例3における透光性保護板15を保護部材11、12または13の上面に設けることにより塵埃が透光性封止板3のレンズ部8に付着するのを防止し、レンズ部8の光学特性の劣化を防止することができる。
また、透光性封止板3のレンズ部8を発光体27と対向する側に設けた場合においても同様の効果が得られる。
2 MID基板
3 透光性封止板
4 凹部
5 導電パターン
6 透光性封止板
7
バンプ
8 レンズ部
8a レンズ有効径
10
発光ダイオード素子
11、12 保護部材
11a、12a 保護部材の開口部
13 保護部材
13a 保護部材の開口部
13b 開口部の透光性封止板側の開口径
13c 開口部の透光性封止板側と対向する側の開口径
14 光反射層
15 透光性保護板
20 LEDランプ
21 LEDランプ本体部
22 回路基板
27 発光体
28a、28b、28c LED素子
29 樹脂材
30 LEDランプ
31 反射枠体
32 凹部
33 反射面
40 空気層
45 空気孔
Claims (13)
- 電極パターンが形成されている回路基板と、該回路基板上に載置され凹部を有する反射枠体と、前記凹部に実装される発光体と、前記反射枠体の上面に設けるレンズ部が形成されている封止板とを備えたLEDランプにおいて、前記透光性封止板の光出射側表面に前記レンズ部を保護するための保護部材を備え、該保護部材は、厚さ方向に貫通する開口部を有し、該開口部の内径が前記レンズ部のレンズ有効径の外周部またはレンズ有効径の外側に位置するように配置されていることを特徴とするLEDランプ。
- 前記保護部材の開口部の内径は前記透光性封止板側から対向する側に向かって次第に大きくなるように形成され、前記開口部の内周面に光反射層が形成されていることを特徴とする請求項1記載のLEDランプ。
- 前記保護部材の開口部の内周面が略円錐台形状に形成されていることを特徴とする請求項2記載のLEDランプ。
- 前記保護部材の開口部の内周面が曲面状に形成されていることを特徴とする請求項2記載のLEDランプ。
- 前記保護部材の開口部の内周面に設ける光反射層は、メッキ又は蒸着等によって光反射効率を高めるための表面処理がなされていることを特徴とする請求項2から請求項4のいずれか1項に記載のLEDランプ。
- 前記保護部材の上面に透光性保護板を有することを特徴とする請求項1から請求項5のいずれか1項に記載のLEDランプ。
- 前記透光性保護板は透光性樹脂材料又はガラス材料からなりシート状又は平板状であることを特徴とする請求項6記載のLEDランプ。
- 前記透光性保護板に紫外線カット材が添加されていることを特徴とする請求項7記載のLEDランプ。
- 前記回路基板および反射枠体は、立体形状の樹脂成型品に回路及び電極を形成する射出成形プリント回路部品(MID)によって形成されていることを特徴とする請求項1記載のLEDランプ。
- 前記レンズ部が形成されている透光性封止板と前記保護部材とが一体に形成されていることを特徴とする請求項1記載のLEDランプ。
- 前記発光体は、一又は二以上の発光ダイオード素子と、該発光ダイオード素子を封止する透明又は透光性の樹脂体とを備える請求項1記載のLEDランプ。
- 前記発光体は、青色発光ダイオード素子と、該青色発光ダイオード素子を封止する樹脂体と、該樹脂体に混入されるイットリウム・アルミニウム・ガーネット(YAG)蛍光体とを備えることで、白色発光を得る請求項1記載のLEDランプ。
- 前記発光体は、赤色、緑色及び青色からなる3種の発光ダイオード素子と、これら発光ダイオード素子を封止する樹脂体とで構成される請求項1記載のLEDランプ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004230104A JP2006049657A (ja) | 2004-08-06 | 2004-08-06 | Ledランプ |
TW094126358A TW200625682A (en) | 2004-08-06 | 2005-08-03 | Light-emitting diode lamp |
KR1020050071039A KR20060049072A (ko) | 2004-08-06 | 2005-08-03 | 발광 다이오드 램프 |
DE102005036742A DE102005036742A1 (de) | 2004-08-06 | 2005-08-04 | Led-Lampe |
CNA2005100894166A CN1731593A (zh) | 2004-08-06 | 2005-08-05 | 发光二极管灯 |
US11/198,389 US20060027828A1 (en) | 2004-08-06 | 2005-08-08 | Light-emitting diode lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004230104A JP2006049657A (ja) | 2004-08-06 | 2004-08-06 | Ledランプ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006049657A true JP2006049657A (ja) | 2006-02-16 |
Family
ID=35756572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004230104A Pending JP2006049657A (ja) | 2004-08-06 | 2004-08-06 | Ledランプ |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060027828A1 (ja) |
JP (1) | JP2006049657A (ja) |
KR (1) | KR20060049072A (ja) |
CN (1) | CN1731593A (ja) |
DE (1) | DE102005036742A1 (ja) |
TW (1) | TW200625682A (ja) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007311423A (ja) * | 2006-05-16 | 2007-11-29 | Alps Electric Co Ltd | 発光体及びその製造方法 |
KR100813066B1 (ko) | 2006-06-30 | 2008-03-14 | 엘지전자 주식회사 | 렌즈 기판과 이를 이용한 발광 소자 패키지 및 백라이트유닛 |
US7839072B2 (en) | 2006-05-24 | 2010-11-23 | Citizen Electronics Co., Ltd. | Translucent laminate sheet and light-emitting device using the translucent laminate sheet |
KR101045034B1 (ko) | 2010-02-25 | 2011-06-30 | 인하대학교 산학협력단 | 복층 구조 마이크로 렌즈를 구비한 백색 엘이디 |
KR101082404B1 (ko) | 2010-05-10 | 2011-11-10 | 신화에코필 주식회사 | 광학렌즈 및 이를 구비하는 광학 패키지 |
US8451402B2 (en) | 2009-03-23 | 2013-05-28 | Sony Corporation | Color conversion sheet, illumination device, and display device |
US8514350B2 (en) | 2008-04-25 | 2013-08-20 | Sony Corporation | Light emitting device, display device, and color conversion sheet |
KR101421963B1 (ko) * | 2010-01-25 | 2014-07-24 | 삼성전자주식회사 | 카메라의 led 플래쉬 모듈 및 카메라 장치 |
US9001288B2 (en) | 2009-01-26 | 2015-04-07 | Dexerials Corporation | Color converting member, method of manufacturing the same, light emitting device, and display device |
WO2015185549A1 (de) * | 2014-06-05 | 2015-12-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement |
JP2016066798A (ja) * | 2014-09-25 | 2016-04-28 | 山村フォトニクス株式会社 | 光デバイス装置および光デバイスを覆うための保護カバー |
JP2018060989A (ja) * | 2016-10-04 | 2018-04-12 | 日本特殊陶業株式会社 | 枠体部材、発光装置、およびこれらの製造方法 |
JP2020077678A (ja) * | 2018-11-06 | 2020-05-21 | ローム株式会社 | 半導体発光装置 |
US10982065B2 (en) | 2015-03-30 | 2021-04-20 | Toppan Printing Co., Ltd. | Optical film, method for manufacturing the same, optical barrier film and color conversion film |
US11243335B2 (en) | 2014-11-14 | 2022-02-08 | Toppan Printing Co., Ltd. | Optical film, and optical barrier film, color conversion film and backlight unit each using the same |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7365026B2 (en) * | 2005-02-01 | 2008-04-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | CxHy sacrificial layer for cu/low-k interconnects |
DE602005024315D1 (de) | 2005-03-31 | 2010-12-02 | Neobulb Technologies Inc | Hochleistungs-led-beleuchtungseinrichtung mit hohem thermischen diffusionsvermögen |
JP2007300069A (ja) * | 2006-04-04 | 2007-11-15 | Toyoda Gosei Co Ltd | 発光素子、この発光素子を用いた発光装置及びこの発光素子の製造方法 |
JP4628302B2 (ja) * | 2006-04-24 | 2011-02-09 | 株式会社エンプラス | 照明装置及び照明装置のレンズ |
US7888868B2 (en) * | 2006-04-28 | 2011-02-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | LED light source with light-directing structures |
TWI313943B (en) * | 2006-10-24 | 2009-08-21 | Chipmos Technologies Inc | Light emitting chip package and manufacturing thereof |
US7737636B2 (en) * | 2006-11-09 | 2010-06-15 | Intematix Corporation | LED assembly with an LED and adjacent lens and method of making same |
EP1925874B8 (en) | 2006-11-24 | 2014-09-10 | OSRAM GmbH | LED color-mixing lighting system |
US9944031B2 (en) * | 2007-02-13 | 2018-04-17 | 3M Innovative Properties Company | Molded optical articles and methods of making same |
EP2111651A4 (en) * | 2007-02-13 | 2011-08-17 | 3M Innovative Properties Co | LED DEVICES HAVING ASSOCIATED LENSES AND METHODS OF MANUFACTURE |
JP2008305642A (ja) * | 2007-06-06 | 2008-12-18 | Sony Corp | 発光装置、面光源装置及び画像表示装置 |
US20100148194A1 (en) * | 2007-06-25 | 2010-06-17 | Jen-Shyan Chen | Light-emitting diode illuminating apparatus |
WO2009000106A1 (fr) * | 2007-06-25 | 2008-12-31 | Jenshyan Chen | Dispositif électroluminescent |
DE102007057671A1 (de) * | 2007-11-30 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Beleuchtungsvorrichtung |
TWI384651B (zh) * | 2008-08-20 | 2013-02-01 | Au Optronics Corp | 發光二極體結構及其製造方法 |
DE112009002689T5 (de) * | 2008-11-10 | 2013-02-21 | Sharp K.K. | Lichtemmisionsvorrichtung, Oberflächenleuchtkörper, und Anzeigevorrichtung |
US20100123386A1 (en) * | 2008-11-13 | 2010-05-20 | Maven Optronics Corp. | Phosphor-Coated Light Extraction Structures for Phosphor-Converted Light Emitting Devices |
JP5428358B2 (ja) * | 2009-01-30 | 2014-02-26 | ソニー株式会社 | 光学素子パッケージの製造方法 |
JP2010251686A (ja) * | 2009-03-26 | 2010-11-04 | Harison Toshiba Lighting Corp | 発光装置及びその製造方法 |
US8033691B2 (en) | 2009-05-12 | 2011-10-11 | Koninklijke Philips Electronics N.V. | LED lamp producing sparkle |
CN102192417A (zh) * | 2010-03-01 | 2011-09-21 | 亿光电子工业股份有限公司 | 光源模组与灯具 |
CN102980072A (zh) * | 2010-03-01 | 2013-03-20 | 亿光电子工业股份有限公司 | 光源模块与灯具 |
US20110255276A1 (en) * | 2010-04-19 | 2011-10-20 | Coward Mark T | Lighting assembly |
KR101208174B1 (ko) | 2010-07-28 | 2012-12-04 | 엘지이노텍 주식회사 | 광학시트 및 이를 포함하는 발광소자패키지 |
EP2458268B1 (en) * | 2010-11-26 | 2016-04-20 | LG Innotek Co., Ltd. | Phosphor plate and lighting device |
CN102593308A (zh) * | 2011-01-11 | 2012-07-18 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
KR101146097B1 (ko) * | 2011-02-21 | 2012-05-16 | 주식회사 루멘스 | 발광소자 패키지 및 이를 구비하는 백라이트 모듈 |
TWI517452B (zh) * | 2011-03-02 | 2016-01-11 | 建準電機工業股份有限公司 | 發光晶體之多晶封裝結構 |
WO2013007206A1 (zh) * | 2011-07-12 | 2013-01-17 | 东莞巨扬电器有限公司 | 应用于led照明装置的聚光镜片 |
KR101849126B1 (ko) | 2011-08-29 | 2018-04-16 | 엘지이노텍 주식회사 | 발광소자 패키지 |
KR101959035B1 (ko) | 2011-10-31 | 2019-03-18 | 서울바이오시스 주식회사 | 발광 다이오드 패키지 및 그것을 제조하는 방법 |
WO2013091829A1 (en) * | 2011-12-22 | 2013-06-27 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules, in particular flash modules, and method for manufacturing the same |
CN103311418B (zh) * | 2012-03-06 | 2017-05-24 | 展晶科技(深圳)有限公司 | 发光二极管模组 |
EP2913856A4 (en) * | 2012-10-25 | 2016-01-06 | Panasonic Ip Man Co Ltd | LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, AND BODY HAVING A LIGHT EMITTING DEVICE MOUNTED THEREON |
WO2014098768A1 (en) * | 2012-12-20 | 2014-06-26 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic modules with masking feature for reducing the visibility of interior components |
CN103579458A (zh) * | 2013-10-23 | 2014-02-12 | 西安重装渭南光电科技有限公司 | 一种led封装结构及其方法 |
CN103579457A (zh) * | 2013-10-23 | 2014-02-12 | 西安重装渭南光电科技有限公司 | 一种led集成封装结构及其方法 |
KR102161273B1 (ko) * | 2014-03-25 | 2020-09-29 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
CN106796977B (zh) * | 2014-07-23 | 2019-06-28 | 晶体公司 | 紫外发光器件的光子提取 |
KR20160038094A (ko) * | 2014-09-26 | 2016-04-07 | 코닝정밀소재 주식회사 | 발광 다이오드의 색변환용 기판 및 그 제조방법 |
KR102185235B1 (ko) | 2014-10-10 | 2020-12-02 | 삼성디스플레이 주식회사 | 표시 장치 |
DE102015104220A1 (de) * | 2015-03-20 | 2016-09-22 | Osram Opto Semiconductors Gmbh | Optoelektronische Leuchtvorrichtung |
CN106200088A (zh) * | 2015-05-07 | 2016-12-07 | 怡来汽车零部件系统株式会社 | 显示装置的显示罩单元 |
KR102094402B1 (ko) * | 2018-08-24 | 2020-03-27 | 주식회사 케이티앤지 | 발광 소자 및 이를 포함하는 에어로졸 생성 장치 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5991764U (ja) * | 1982-12-10 | 1984-06-21 | ロ−ム株式会社 | 発光ダイオ−ドランプ |
JPS6338270A (ja) * | 1986-08-04 | 1988-02-18 | Omron Tateisi Electronics Co | 投受光装置 |
JPH04109556U (ja) * | 1991-03-08 | 1992-09-22 | シヤープ株式会社 | 反射ケース型ledランプ |
JPH06104480A (ja) * | 1992-09-21 | 1994-04-15 | Nec Corp | 半導体光素子の製造方法 |
JPH06202242A (ja) * | 1992-12-29 | 1994-07-22 | Kyocera Corp | 画像形成装置 |
JPH10320802A (ja) * | 1997-05-19 | 1998-12-04 | Sankyo Seiki Mfg Co Ltd | 対物レンズ駆動装置 |
JPH10319877A (ja) * | 1997-05-16 | 1998-12-04 | Toshiba Corp | 画像表示装置及び発光装置 |
JPH1140859A (ja) * | 1997-07-17 | 1999-02-12 | Citizen Electron Co Ltd | 赤外線データ通信モジュール |
JPH11163412A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Works Ltd | Led照明装置 |
JP2001267632A (ja) * | 2000-03-14 | 2001-09-28 | Asahi Rubber:Kk | 発光ダイオード |
JP2001351997A (ja) * | 2000-06-09 | 2001-12-21 | Canon Inc | 受光センサーの実装構造体およびその使用方法 |
JP2003158301A (ja) * | 2001-11-22 | 2003-05-30 | Citizen Electronics Co Ltd | 発光ダイオード |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3911430A (en) * | 1974-04-17 | 1975-10-07 | Fairchild Camera Instr Co | Alpha-numeric display package |
US5836676A (en) * | 1996-05-07 | 1998-11-17 | Koha Co., Ltd. | Light emitting display apparatus |
WO1998044475A1 (fr) * | 1997-03-31 | 1998-10-08 | Idec Izumi Corporation | Dispositif d'affichage et d'eclairage |
WO2001091090A1 (en) * | 2000-05-26 | 2001-11-29 | Showers International Pty Ltd | Illumination of signs and system for providing signs |
US6616299B2 (en) * | 2001-02-02 | 2003-09-09 | Gelcore Llc | Single optical element LED signal |
JP4050482B2 (ja) * | 2001-04-23 | 2008-02-20 | 豊田合成株式会社 | 半導体発光装置 |
US6924514B2 (en) * | 2002-02-19 | 2005-08-02 | Nichia Corporation | Light-emitting device and process for producing thereof |
US6729744B2 (en) * | 2002-03-29 | 2004-05-04 | Pat Y. Mah | Faraday flashlight |
DE10245580B4 (de) * | 2002-09-27 | 2006-06-01 | Siemens Ag | Einrichtung zur Erzeugung eines Bildes |
JP4504662B2 (ja) * | 2003-04-09 | 2010-07-14 | シチズン電子株式会社 | Ledランプ |
US6903380B2 (en) * | 2003-04-11 | 2005-06-07 | Weldon Technologies, Inc. | High power light emitting diode |
DE10318932A1 (de) * | 2003-04-26 | 2004-11-25 | Aqua Signal Aktiengesellschaft Spezialleuchtenfabrik | Laterne, vorzugsweise für die Verwendung an Bord von Schiffen, insbesondere auf Sportbooten |
US6828590B2 (en) * | 2003-05-07 | 2004-12-07 | Bear Hsiung | Light emitting diode module device |
CA2473063C (en) * | 2003-07-07 | 2008-09-16 | Brasscorp Limited | Led lamps and led driver circuits for the same |
US7183587B2 (en) * | 2003-09-09 | 2007-02-27 | Cree, Inc. | Solid metal block mounting substrates for semiconductor light emitting devices |
-
2004
- 2004-08-06 JP JP2004230104A patent/JP2006049657A/ja active Pending
-
2005
- 2005-08-03 KR KR1020050071039A patent/KR20060049072A/ko not_active Application Discontinuation
- 2005-08-03 TW TW094126358A patent/TW200625682A/zh unknown
- 2005-08-04 DE DE102005036742A patent/DE102005036742A1/de not_active Withdrawn
- 2005-08-05 CN CNA2005100894166A patent/CN1731593A/zh active Pending
- 2005-08-08 US US11/198,389 patent/US20060027828A1/en not_active Abandoned
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5991764U (ja) * | 1982-12-10 | 1984-06-21 | ロ−ム株式会社 | 発光ダイオ−ドランプ |
JPS6338270A (ja) * | 1986-08-04 | 1988-02-18 | Omron Tateisi Electronics Co | 投受光装置 |
JPH04109556U (ja) * | 1991-03-08 | 1992-09-22 | シヤープ株式会社 | 反射ケース型ledランプ |
JPH06104480A (ja) * | 1992-09-21 | 1994-04-15 | Nec Corp | 半導体光素子の製造方法 |
JPH06202242A (ja) * | 1992-12-29 | 1994-07-22 | Kyocera Corp | 画像形成装置 |
JPH10319877A (ja) * | 1997-05-16 | 1998-12-04 | Toshiba Corp | 画像表示装置及び発光装置 |
JPH10320802A (ja) * | 1997-05-19 | 1998-12-04 | Sankyo Seiki Mfg Co Ltd | 対物レンズ駆動装置 |
JPH1140859A (ja) * | 1997-07-17 | 1999-02-12 | Citizen Electron Co Ltd | 赤外線データ通信モジュール |
JPH11163412A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Works Ltd | Led照明装置 |
JP2001267632A (ja) * | 2000-03-14 | 2001-09-28 | Asahi Rubber:Kk | 発光ダイオード |
JP2001351997A (ja) * | 2000-06-09 | 2001-12-21 | Canon Inc | 受光センサーの実装構造体およびその使用方法 |
JP2003158301A (ja) * | 2001-11-22 | 2003-05-30 | Citizen Electronics Co Ltd | 発光ダイオード |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007311423A (ja) * | 2006-05-16 | 2007-11-29 | Alps Electric Co Ltd | 発光体及びその製造方法 |
US7839072B2 (en) | 2006-05-24 | 2010-11-23 | Citizen Electronics Co., Ltd. | Translucent laminate sheet and light-emitting device using the translucent laminate sheet |
KR100813066B1 (ko) | 2006-06-30 | 2008-03-14 | 엘지전자 주식회사 | 렌즈 기판과 이를 이용한 발광 소자 패키지 및 백라이트유닛 |
US8514350B2 (en) | 2008-04-25 | 2013-08-20 | Sony Corporation | Light emitting device, display device, and color conversion sheet |
US9302432B2 (en) | 2009-01-26 | 2016-04-05 | Dexerials Corporation | Method of manufacturing color converting member |
US9001288B2 (en) | 2009-01-26 | 2015-04-07 | Dexerials Corporation | Color converting member, method of manufacturing the same, light emitting device, and display device |
US8451402B2 (en) | 2009-03-23 | 2013-05-28 | Sony Corporation | Color conversion sheet, illumination device, and display device |
KR101421963B1 (ko) * | 2010-01-25 | 2014-07-24 | 삼성전자주식회사 | 카메라의 led 플래쉬 모듈 및 카메라 장치 |
KR101045034B1 (ko) | 2010-02-25 | 2011-06-30 | 인하대학교 산학협력단 | 복층 구조 마이크로 렌즈를 구비한 백색 엘이디 |
KR101082404B1 (ko) | 2010-05-10 | 2011-11-10 | 신화에코필 주식회사 | 광학렌즈 및 이를 구비하는 광학 패키지 |
WO2015185549A1 (de) * | 2014-06-05 | 2015-12-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement |
US10483439B2 (en) | 2014-06-05 | 2019-11-19 | Osram Opto Semiconductors Gmbh | Optoelectronic device with silicon slice cover arranged downstream of a conversion element |
JP2016066798A (ja) * | 2014-09-25 | 2016-04-28 | 山村フォトニクス株式会社 | 光デバイス装置および光デバイスを覆うための保護カバー |
US11243335B2 (en) | 2014-11-14 | 2022-02-08 | Toppan Printing Co., Ltd. | Optical film, and optical barrier film, color conversion film and backlight unit each using the same |
US10982065B2 (en) | 2015-03-30 | 2021-04-20 | Toppan Printing Co., Ltd. | Optical film, method for manufacturing the same, optical barrier film and color conversion film |
JP2018060989A (ja) * | 2016-10-04 | 2018-04-12 | 日本特殊陶業株式会社 | 枠体部材、発光装置、およびこれらの製造方法 |
JP2020077678A (ja) * | 2018-11-06 | 2020-05-21 | ローム株式会社 | 半導体発光装置 |
JP7184599B2 (ja) | 2018-11-06 | 2022-12-06 | ローム株式会社 | 半導体発光装置 |
US11799266B2 (en) | 2018-11-06 | 2023-10-24 | Rohm Co., Ltd. | Semiconductor light-emitting device |
Also Published As
Publication number | Publication date |
---|---|
CN1731593A (zh) | 2006-02-08 |
KR20060049072A (ko) | 2006-05-18 |
US20060027828A1 (en) | 2006-02-09 |
TW200625682A (en) | 2006-07-16 |
DE102005036742A1 (de) | 2006-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2006049657A (ja) | Ledランプ | |
JP4504662B2 (ja) | Ledランプ | |
JP6325051B2 (ja) | 発光素子パッケージ | |
US7833811B2 (en) | Side-emitting LED package and method of manufacturing the same | |
US8368097B2 (en) | Light emitting diode package and method of manufacturing the same | |
JP6448188B2 (ja) | ランプユニット及びそれを用いた車両ランプ装置 | |
US7622751B2 (en) | Light-emitting diode | |
JP5896758B2 (ja) | Led発光装置 | |
US20150115793A1 (en) | Lighting device and method of manufacturing the same | |
US20060208267A1 (en) | Side-emitting solid-state semiconductor light emitting device | |
JP2011129916A (ja) | 発光素子及びそれを用いたライトユニット | |
CN101527344A (zh) | 半导体发光装置 | |
JP7460936B2 (ja) | 光源装置 | |
KR101867284B1 (ko) | 카메라 플래시 모듈 | |
WO2007032619A1 (en) | Reflective surface attached light emitting device | |
JP5797945B2 (ja) | Ledランプ | |
KR100912442B1 (ko) | 표면실장형 발광다이오드 소자 | |
KR100713582B1 (ko) | 키패드용 고효율 발광 다이오드 | |
KR101007116B1 (ko) | 발광 장치 | |
CN112420905B (zh) | 发光二极管封装结构 | |
US11908982B2 (en) | Light-emitting diode package and electronic device including the same | |
JP2004158830A (ja) | 発光ダイオード | |
JP7012510B2 (ja) | 光学部材および発光装置 | |
KR102487682B1 (ko) | 조명 장치 | |
KR200373699Y1 (ko) | 양면 발광방식을 이용한 방사각이 큰 고휘도 발광다이오드 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070615 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100312 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100921 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101105 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110118 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110307 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110517 |