JP2006505952A5 - - Google Patents

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Publication number
JP2006505952A5
JP2006505952A5 JP2004551690A JP2004551690A JP2006505952A5 JP 2006505952 A5 JP2006505952 A5 JP 2006505952A5 JP 2004551690 A JP2004551690 A JP 2004551690A JP 2004551690 A JP2004551690 A JP 2004551690A JP 2006505952 A5 JP2006505952 A5 JP 2006505952A5
Authority
JP
Japan
Prior art keywords
wafer
platen
actuator mechanism
processing chamber
lift pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004551690A
Other languages
English (en)
Japanese (ja)
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JP2006505952A (ja
Filing date
Publication date
Priority claimed from US10/289,830 external-priority patent/US6722642B1/en
Application filed filed Critical
Publication of JP2006505952A publication Critical patent/JP2006505952A/ja
Publication of JP2006505952A5 publication Critical patent/JP2006505952A5/ja
Pending legal-status Critical Current

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JP2004551690A 2002-11-06 2003-11-03 半導体ウェーハ用の高圧力に適合可能なリフト機構を含んでいる真空チャック Pending JP2006505952A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/289,830 US6722642B1 (en) 2002-11-06 2002-11-06 High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism
PCT/US2003/035017 WO2004044953A2 (en) 2002-11-06 2003-11-03 High pressure compatible vacuum check for semiconductor wafer including lift mechanism

Publications (2)

Publication Number Publication Date
JP2006505952A JP2006505952A (ja) 2006-02-16
JP2006505952A5 true JP2006505952A5 (enExample) 2006-07-27

Family

ID=32069426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004551690A Pending JP2006505952A (ja) 2002-11-06 2003-11-03 半導体ウェーハ用の高圧力に適合可能なリフト機構を含んでいる真空チャック

Country Status (7)

Country Link
US (1) US6722642B1 (enExample)
EP (1) EP1560680A2 (enExample)
JP (1) JP2006505952A (enExample)
CN (1) CN100396440C (enExample)
AU (1) AU2003291698A1 (enExample)
TW (1) TWI317675B (enExample)
WO (1) WO2004044953A2 (enExample)

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CN103325722B (zh) * 2013-05-24 2016-04-20 沈阳拓荆科技有限公司 晶圆输送机构及使用方法
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CN118380375A (zh) 2017-11-21 2024-07-23 朗姆研究公司 底部边缘环和中部边缘环
CN110823922A (zh) * 2018-08-10 2020-02-21 鸿富锦精密电子(天津)有限公司 外观检测装置
JP7308688B2 (ja) * 2019-08-05 2023-07-14 東京エレクトロン株式会社 基板処理装置および基板乾燥方法
JP7378481B2 (ja) * 2019-12-26 2023-11-13 ナンジン リアン セミコンダクター リミテッド 半導体産業におけるウェハ幾何学形状測定のためのツールアーキテクチャ
JP7466686B2 (ja) 2020-03-23 2024-04-12 ラム リサーチ コーポレーション 基板処理システムにおける中間リング腐食補償
KR102767910B1 (ko) * 2021-08-14 2025-02-12 램 리써치 코포레이션 반도체 제조 툴들에서 사용하기 위한 클록 가능한 (clockable) 기판 프로세싱 페데스탈
CN115527913A (zh) * 2022-08-15 2022-12-27 恩纳基智能科技无锡有限公司 晶片吸附装置和晶片传送设备

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