JP2006501360A5 - - Google Patents

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Publication number
JP2006501360A5
JP2006501360A5 JP2003558233A JP2003558233A JP2006501360A5 JP 2006501360 A5 JP2006501360 A5 JP 2006501360A5 JP 2003558233 A JP2003558233 A JP 2003558233A JP 2003558233 A JP2003558233 A JP 2003558233A JP 2006501360 A5 JP2006501360 A5 JP 2006501360A5
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JP
Japan
Prior art keywords
substrate
plating
chamber
transfer
enclosure
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Pending
Application number
JP2003558233A
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English (en)
Japanese (ja)
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JP2006501360A (ja
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Priority claimed from US10/036,321 external-priority patent/US6824612B2/en
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Publication of JP2006501360A publication Critical patent/JP2006501360A/ja
Publication of JP2006501360A5 publication Critical patent/JP2006501360A5/ja
Pending legal-status Critical Current

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JP2003558233A 2001-12-26 2002-12-20 無電界メッキシステム Pending JP2006501360A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/036,321 US6824612B2 (en) 2001-12-26 2001-12-26 Electroless plating system
PCT/US2002/040631 WO2003057943A2 (en) 2001-12-26 2002-12-20 Electroless plating system

Publications (2)

Publication Number Publication Date
JP2006501360A JP2006501360A (ja) 2006-01-12
JP2006501360A5 true JP2006501360A5 (enExample) 2006-11-24

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ID=21887935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003558233A Pending JP2006501360A (ja) 2001-12-26 2002-12-20 無電界メッキシステム

Country Status (5)

Country Link
US (1) US6824612B2 (enExample)
JP (1) JP2006501360A (enExample)
CN (1) CN1636081A (enExample)
TW (1) TWI258190B (enExample)
WO (1) WO2003057943A2 (enExample)

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