JP2006501360A - 無電界メッキシステム - Google Patents
無電界メッキシステム Download PDFInfo
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- JP2006501360A JP2006501360A JP2003558233A JP2003558233A JP2006501360A JP 2006501360 A JP2006501360 A JP 2006501360A JP 2003558233 A JP2003558233 A JP 2003558233A JP 2003558233 A JP2003558233 A JP 2003558233A JP 2006501360 A JP2006501360 A JP 2006501360A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
- C23C18/1692—Heat-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
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- Condensed Matter Physics & Semiconductors (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
[0001]本発明は、一般に、無電界メッキ装置に関する。
Claims (18)
- フェースアップ構成で基板を支持するように構成された回転可能な基板支持部材と、
前記回転可能な基板支持部材と略等しい径と、実質的に平坦な下面とを有する蒸発用シールドであって、前記回転可能な基板支持部材の上方に選択的に位置決めされ、それを介してその下面に処理溶液を流すために、該シールド内に形成された少なくとも1つの穴部を有する蒸発用シールドと、
処理流体を、前記少なくとも1つの穴部を介して基板上に投与するように構成された流体供給アセンブリと、
を備える、半導体処理装置。 - 前記蒸発用シールドの下面が、処理位置における前記基板支持部材から約1mm〜約5mmのところに位置決めされている、請求項1に記載の半導体処理装置。
- 前記蒸発用シールドが、基板処理位置と基板ローディング位置との間を選択的に移動可能である、請求項1に記載の半導体処理装置。
- 前記蒸発用シールドが、前記基板の表面と、前記蒸発用シールドの下面とで画定された処理領域内に、前記処理流体を外側シール部材を用いて保持するように構成されている、請求項1に記載の半導体処理装置。
- 前記蒸発用シールドが、前記処理流体をメニスカス力によって前記処理領域内に保持するように構成されている、請求項4に記載の半導体処理装置。
- 前記蒸発用シールドが、選択的に回転可能である、請求項1に記載の半導体処理装置。
- 中央移送エンクロージャと、
基板移送エンクロージャの第1の領域に位置決めされた第1の基板移送ロボットと、
前記基板移送エンクロージャの第2の領域に位置決めされた第2の基板移送ロボットと、
前記基板移送エンクロージャの第1の領域と連通する第1の基板ポッドローダと、
前記基板移送エンクロージャの第2の領域と連通する第2の基板ポッドローダと、
前記基板移送エンクロージャの第1の領域と連通する活性化エンクロージャと、
前記基板移送エンクロージャの第1の領域と連通する基板メッキエンクロージャと、
前記基板移送エンクロージャの第2の領域と連通する基板スピン・リンス・ドライ・エンクロージャと、
前記基板移送エンクロージャの第2の領域と連通する基板アニール・エンクロージャと、
前記基板移送エンクロージャ内に位置決めされ、かつ前記第1の領域及び第2の領域と連通する基板ハンドオフと、
を備える、半導体メッキ装置。 - 前記活性化エンクロージャが、
フェースアップ位置で基板を支持するように構成された、回転可能に取り付けられた基板支持部材と、
前記基板支持部材の上に位置決めされ、かつ少なくとも1つの選択的に作動する流量制御弁を介して、活性化流体ソース及びリンス流体ソースのうちの少なくとも一方と流体的に連通する活性化流体供給アセンブリと、
を備える、請求項7に記載の半導体メッキ装置。 - 前記メッキエンクロージャが、
フェースアップ位置で基板を支持するように構成された回転可能な基板支持部材と、
実質的に平坦な下面と、中に形成されたメッキ流体供給流路とを有する、回転可能に取り付けられた蒸発用シールドと、
前記蒸発用シールドのメッキ流体供給流路に、メッキ流体を投与するように構成されたメッキ流体投与アセンブリと、
を備える、請求項7に記載の半導体メッキ装置。 - 前記蒸発用シールドが、基板処理位置と基板ローディング位置との間で移動されるように構成され、該処理位置が、前記実質的に平坦な下面を、前記基板支持部材の上面近傍に位置決めすることを含む、請求項9に記載の半導体メッキ装置。
- 前記蒸発用シールドが、前記処理位置における前記基板支持部材から、約1mm〜約10mmのところに位置決めされるように構成されている、請求項9に記載の半導体メッキ装置。
- 金属を基板上にメッキする方法であって、
基板移送エンクロージャ内に位置決めされた第1の基板移送ロボットを用いて、第1のポッドローダ位置から基板を持ってくることと、
前記第1の基板移送ロボットを用いて前記基板を、活性化プロセスのために、前記基板移送エンクロージャと連通する活性化チャンバへ移送することと、
前記第1の基板移送ロボットを用いて、前記活性化チャンバから前記基板を移動させて、該基板を、メッキプロセスのために、前記基板移送エンクロージャと連通するメッキエンクロージャへ移送することと、
前記第1の基板移送ロボットを用いて、前記基板を前記メッキエンクロージャから移動させて、該基板を、前記基板移送エンクロージャ内のハンドオフ位置に位置決めすることと、
前記基板移送エンクロージャ内に位置決めされた第2の基板移送ロボットを用いて、前記基板を前記ハンドオフ位置から持ってきて、該基板を、リンス及びドライプロセスのために、前記基板移送エンクロージャと連通するスピン・リンス・ドライエンクロージャへ移送することと、
前記第2のロボットを用いて、前記スピン・リンス・ドライエンクロージャから前記基板を移動させて、該基板を、アニールプロセスのために、前記基板移送エンクロージャと連通するアニールチャンバへ移送することと、
前記基板移送ロボットを用いて、前記基板を、前記基板移送エンクロージャと連通する第2のポッドローダへ移送することとを含む、方法。 - 前記活性化プロセスが、回転可能に取り付けられた基板支持部材上で、前記基板を回転させると共に、活性化流体を該基板表面に投与することを含む、請求項12に記載の方法。
- 前記メッキプロセスが、回転可能に取り付けられた基板支持部材上で、前記基板を回転させると共に、メッキ溶液を該基板表面に投与することを含む、請求項12に記載の方法。
- 前記メッキプロセスが、
蒸発用シールドをローディング位置に位置決めすることと、
前記基板を基板支持部材上に位置決めすることと、
前記蒸発用シールドを処理位置に位置決めすることであって、該処理位置が、前記蒸発用シールドの下方平坦面を、前記基板から約1mm〜約10mmのところに位置決めするように構成されていることと、
前記基板と前記蒸発用シールドとによって画定された処理領域にメッキ溶液を投与することと、
前記蒸発用シールド及び前記基板支持部材のうちの少なくとも一方を回転させることにより、前記処理領域内のメッキ溶液を揺動することと、
前記蒸発用シールドを前記ローディング位置に位置決めすることによって、前記基板を前記メッキエンクロージャから移動させて、前記第1の基板移送ロボットによって該基板を回収することとを含む、請求項12に記載の方法。 - 前記リンス及びドライプロセスが、前記基板を第1の回転速度で、回転可能な基板支持部材上で回転させると共に、該基板上にリンス溶液を投与することと、該リンス流体の投与を終了することと、該基板を第2の回転速度で回転させて、該基板を回転乾燥させることとを含み、前記第1の回転速度が、前記第2の回転速度よりも小さい、請求項12に記載の方法。
- 前記第1の基板移送ロボットが、前記基板移送チャンバの第1の領域に位置決めされ、かつ前記第1のポッドローダ、前記活性化エンクロージャ、前記メッキエンクロージャ、及び前記ハンドオフ位置に接近できるように構成されている、請求項12に記載の方法。
- 前記第2の基板移送ロボットが、前記基板移送チャンバの第2の領域に位置決めされ、かつ前記第2のポッドローダ、前記アニール・エンクロージャ、スピン・リンス・ドライ・エンクロージャ、及び前記ハンドオフ位置に接近できるように構成されている、請求項12に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/036,321 US6824612B2 (en) | 2001-12-26 | 2001-12-26 | Electroless plating system |
PCT/US2002/040631 WO2003057943A2 (en) | 2001-12-26 | 2002-12-20 | Electroless plating system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006501360A true JP2006501360A (ja) | 2006-01-12 |
JP2006501360A5 JP2006501360A5 (ja) | 2006-11-24 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003558233A Pending JP2006501360A (ja) | 2001-12-26 | 2002-12-20 | 無電界メッキシステム |
Country Status (5)
Country | Link |
---|---|
US (1) | US6824612B2 (ja) |
JP (1) | JP2006501360A (ja) |
CN (1) | CN1636081A (ja) |
TW (1) | TWI258190B (ja) |
WO (1) | WO2003057943A2 (ja) |
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Also Published As
Publication number | Publication date |
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TW200301527A (en) | 2003-07-01 |
WO2003057943A2 (en) | 2003-07-17 |
TWI258190B (en) | 2006-07-11 |
WO2003057943A3 (en) | 2005-07-07 |
CN1636081A (zh) | 2005-07-06 |
US20030118732A1 (en) | 2003-06-26 |
US6824612B2 (en) | 2004-11-30 |
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