JP2006229180A - 半導体モジュールおよび半導体装置 - Google Patents

半導体モジュールおよび半導体装置 Download PDF

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Publication number
JP2006229180A
JP2006229180A JP2005189526A JP2005189526A JP2006229180A JP 2006229180 A JP2006229180 A JP 2006229180A JP 2005189526 A JP2005189526 A JP 2005189526A JP 2005189526 A JP2005189526 A JP 2005189526A JP 2006229180 A JP2006229180 A JP 2006229180A
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JP
Japan
Prior art keywords
semiconductor element
facing
cooling
semiconductor
portion facing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005189526A
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English (en)
Japanese (ja)
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JP2006229180A5 (https=
Inventor
Noribumi Furuta
紀文 古田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Priority to JP2005189526A priority Critical patent/JP2006229180A/ja
Priority to CN2006800030852A priority patent/CN101120446B/zh
Priority to US11/795,132 priority patent/US7687901B2/en
Priority to PCT/JP2006/301271 priority patent/WO2006078070A2/en
Publication of JP2006229180A publication Critical patent/JP2006229180A/ja
Publication of JP2006229180A5 publication Critical patent/JP2006229180A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2005189526A 2005-01-24 2005-06-29 半導体モジュールおよび半導体装置 Pending JP2006229180A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005189526A JP2006229180A (ja) 2005-01-24 2005-06-29 半導体モジュールおよび半導体装置
CN2006800030852A CN101120446B (zh) 2005-01-24 2006-01-20 半导体模组及半导体装置
US11/795,132 US7687901B2 (en) 2005-01-24 2006-01-20 Heat dissipating fins opposite semiconductor elements
PCT/JP2006/301271 WO2006078070A2 (en) 2005-01-24 2006-01-20 Semiconductor module and semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005015744 2005-01-24
JP2005189526A JP2006229180A (ja) 2005-01-24 2005-06-29 半導体モジュールおよび半導体装置

Publications (2)

Publication Number Publication Date
JP2006229180A true JP2006229180A (ja) 2006-08-31
JP2006229180A5 JP2006229180A5 (https=) 2008-05-01

Family

ID=36597602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005189526A Pending JP2006229180A (ja) 2005-01-24 2005-06-29 半導体モジュールおよび半導体装置

Country Status (4)

Country Link
US (1) US7687901B2 (https=)
JP (1) JP2006229180A (https=)
CN (1) CN101120446B (https=)
WO (1) WO2006078070A2 (https=)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010062490A (ja) * 2008-09-08 2010-03-18 Denso Corp 半導体装置
JP2010287600A (ja) * 2009-06-09 2010-12-24 Mitsubishi Electric Corp ヒートシンク
JP2011520281A (ja) * 2008-05-07 2011-07-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 発光材料を含む自己支持型格子を有するｌｅｄを備えた照明装置及び自己支持型格子を作製する方法
JP2012227367A (ja) * 2011-04-20 2012-11-15 Nippon Soken Inc 冷却フィン構造
JP2013062282A (ja) * 2011-09-12 2013-04-04 Toyota Motor Corp 半導体装置
JP2013187334A (ja) * 2012-03-07 2013-09-19 Toyota Motor Corp パワーモジュール装置
CN103737160A (zh) * 2014-01-29 2014-04-23 蚌埠金威滤清器有限公司 氩弧焊环型焊缝定位冷却器
JP2014127538A (ja) * 2012-12-26 2014-07-07 Meidensha Corp 半導体モジュール
JP2020534699A (ja) * 2017-09-20 2020-11-26 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ ヒートシンクセグメント、ヒートシンクならびにコンポーネントを冷却する方法
JP2021034508A (ja) * 2019-08-22 2021-03-01 信越ポリマー株式会社 放熱構造体およびそれを備えるバッテリー
WO2022202248A1 (ja) * 2021-03-25 2022-09-29 株式会社日立製作所 電力変換装置

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008120358A1 (ja) * 2007-03-29 2010-07-15 富士通株式会社 ヒートシンク
US7763939B2 (en) * 2007-05-23 2010-07-27 Fairchild Semiconductor Corporation Low on resistance CMOS transistor for integrated circuit applications
US8064198B2 (en) * 2009-06-29 2011-11-22 Honda Motor Co., Ltd. Cooling device for semiconductor element module and magnetic part
EP2328172B1 (en) * 2009-10-02 2019-06-26 Abb Research Ltd. A power-electronic arrangement
KR101387515B1 (ko) * 2010-01-18 2014-04-21 미쓰비시덴키 가부시키가이샤 파워 반도체 모듈, 전력 변환 장치, 및 철도 차량
EP2485256A3 (en) * 2011-02-08 2018-01-03 ABB Research Ltd. A semiconductor device
US8804340B2 (en) * 2011-06-08 2014-08-12 International Rectifier Corporation Power semiconductor package with double-sided cooling
JP5655873B2 (ja) * 2012-05-09 2015-01-21 株式会社安川電機 インバータ装置
CN103426840B (zh) * 2012-05-18 2016-12-14 上海拜骋电器有限公司 具有续流二极管的开关装置
US9786584B2 (en) * 2012-09-04 2017-10-10 Infineon Technologies Ag Lateral element isolation device
JP6094592B2 (ja) * 2012-10-01 2017-03-15 富士電機株式会社 半導体装置とその製造方法
JP5726215B2 (ja) * 2013-01-11 2015-05-27 株式会社豊田中央研究所 冷却型スイッチング素子モジュール
US10378835B2 (en) * 2016-03-25 2019-08-13 Unison Industries, Llc Heat exchanger with non-orthogonal perforations
US20190157179A1 (en) 2016-04-07 2019-05-23 Hitachi Automotive Systems, Ltd. Case, Semiconductor Apparatus, Method for Manufacturing Case
US10615100B2 (en) * 2016-12-08 2020-04-07 Toyota Motor Engineering & Manufacturing North America, Inc. Electronics assemblies and cooling structures having metalized exterior surface
TW202024553A (zh) * 2018-12-27 2020-07-01 圓剛科技股份有限公司 散熱裝置
DE102019209082B3 (de) 2019-06-24 2020-06-04 Siemens Aktiengesellschaft Befestigung von Leistungshalbleiterbauelementen auf gekrümmten Oberflächen
US11690195B2 (en) 2020-09-11 2023-06-27 Abb Schweiz Ag Power semiconductor cooling system

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259323A (ja) * 1992-03-16 1993-10-08 Mitsubishi Electric Corp 放熱用ヒートシンク
JPH08153835A (ja) * 1994-11-28 1996-06-11 Fujitsu Ltd 冷却構造
JPH08321569A (ja) * 1995-05-25 1996-12-03 Sumitomo Metal Ind Ltd ヒートシンク装置
JPH10322062A (ja) * 1997-05-21 1998-12-04 Matsushita Electric Works Ltd 放熱器
JP2001024125A (ja) * 1999-07-09 2001-01-26 Fuji Electric Co Ltd 平形半導体素子
JP2003008264A (ja) * 2001-06-26 2003-01-10 Nissan Motor Co Ltd 電子部品の冷却装置
JP2003282799A (ja) * 2002-03-22 2003-10-03 Mitsubishi Electric Corp 半導体モジュール用ケース
JP2003324173A (ja) * 2002-05-02 2003-11-14 Nissan Motor Co Ltd 半導体素子の冷却装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2222721B (en) * 1988-08-23 1993-07-28 Nobuo Mikoshiba Cooling semiconductor devices
JP2804640B2 (ja) 1991-06-21 1998-09-30 富士通株式会社 半導体装置の冷却装置及び冷却方法
JP3855941B2 (ja) 1993-07-08 2006-12-13 セイコーエプソン株式会社 凸型ヒートシンク付き半導体装置の製造方法
JP3236137B2 (ja) * 1993-07-30 2001-12-10 富士通株式会社 半導体素子冷却装置
DE9319259U1 (de) * 1993-12-15 1994-03-24 Siemens AG, 80333 München Kühlkörper
JPH07189684A (ja) 1993-12-28 1995-07-28 Hitachi Constr Mach Co Ltd 熱交換装置
JPH07318296A (ja) 1994-05-20 1995-12-08 Mitsubishi Plastics Ind Ltd 冷却塔用充填材の気液接触板
DE19635468A1 (de) * 1996-08-31 1998-03-05 Gerd Ruediger Dehmel Kühlkörper zum Kühlen von Elementen
US6401807B1 (en) * 1997-04-03 2002-06-11 Silent Systems, Inc. Folded fin heat sink and fan attachment
JP3196762B2 (ja) 1999-04-20 2001-08-06 日本電気株式会社 半導体チップ冷却構造
JP2001196775A (ja) 2000-01-07 2001-07-19 Furukawa Electric Co Ltd:The ヒートシンクへの発熱部品の取り付け方法および発熱部品の冷却装置
EP2244289B1 (en) * 2000-04-19 2014-03-26 Denso Corporation Coolant cooled type semiconductor device
JP2002026251A (ja) 2000-07-11 2002-01-25 Toshiba Corp 半導体装置
JP3690658B2 (ja) 2001-07-13 2005-08-31 インターナショナル・ビジネス・マシーンズ・コーポレーション ヒートシンク、冷却部材、半導体基板冷却装置、コンピュータ、および放熱方法
US6505680B1 (en) * 2001-07-27 2003-01-14 Hewlett-Packard Company High performance cooling device
US20040118501A1 (en) * 2002-12-19 2004-06-24 Intel Corporation Heat transfer composite with anisotropic heat flow structure

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259323A (ja) * 1992-03-16 1993-10-08 Mitsubishi Electric Corp 放熱用ヒートシンク
JPH08153835A (ja) * 1994-11-28 1996-06-11 Fujitsu Ltd 冷却構造
JPH08321569A (ja) * 1995-05-25 1996-12-03 Sumitomo Metal Ind Ltd ヒートシンク装置
JPH10322062A (ja) * 1997-05-21 1998-12-04 Matsushita Electric Works Ltd 放熱器
JP2001024125A (ja) * 1999-07-09 2001-01-26 Fuji Electric Co Ltd 平形半導体素子
JP2003008264A (ja) * 2001-06-26 2003-01-10 Nissan Motor Co Ltd 電子部品の冷却装置
JP2003282799A (ja) * 2002-03-22 2003-10-03 Mitsubishi Electric Corp 半導体モジュール用ケース
JP2003324173A (ja) * 2002-05-02 2003-11-14 Nissan Motor Co Ltd 半導体素子の冷却装置

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011520281A (ja) * 2008-05-07 2011-07-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 発光材料を含む自己支持型格子を有するｌｅｄを備えた照明装置及び自己支持型格子を作製する方法
JP2010062490A (ja) * 2008-09-08 2010-03-18 Denso Corp 半導体装置
JP2010287600A (ja) * 2009-06-09 2010-12-24 Mitsubishi Electric Corp ヒートシンク
US9523541B2 (en) 2011-04-20 2016-12-20 Toyota Jidosha Kabushiki Kaisha Cooling fin structure
JP2012227367A (ja) * 2011-04-20 2012-11-15 Nippon Soken Inc 冷却フィン構造
JP2013062282A (ja) * 2011-09-12 2013-04-04 Toyota Motor Corp 半導体装置
JP2013187334A (ja) * 2012-03-07 2013-09-19 Toyota Motor Corp パワーモジュール装置
JP2014127538A (ja) * 2012-12-26 2014-07-07 Meidensha Corp 半導体モジュール
CN103737160A (zh) * 2014-01-29 2014-04-23 蚌埠金威滤清器有限公司 氩弧焊环型焊缝定位冷却器
JP2020534699A (ja) * 2017-09-20 2020-11-26 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ ヒートシンクセグメント、ヒートシンクならびにコンポーネントを冷却する方法
JP2021034508A (ja) * 2019-08-22 2021-03-01 信越ポリマー株式会社 放熱構造体およびそれを備えるバッテリー
JP7254661B2 (ja) 2019-08-22 2023-04-10 信越ポリマー株式会社 放熱構造体およびそれを備えるバッテリー
WO2022202248A1 (ja) * 2021-03-25 2022-09-29 株式会社日立製作所 電力変換装置
JP2022149879A (ja) * 2021-03-25 2022-10-07 株式会社日立製作所 電力変換装置
JP7558866B2 (ja) 2021-03-25 2024-10-01 株式会社日立製作所 電力変換装置

Also Published As

Publication number Publication date
CN101120446A (zh) 2008-02-06
WO2006078070A3 (en) 2006-10-19
US20080093730A1 (en) 2008-04-24
WO2006078070A2 (en) 2006-07-27
US7687901B2 (en) 2010-03-30
CN101120446B (zh) 2010-05-19

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