JP2006114884A - 基板洗浄処理装置及び基板処理ユニット - Google Patents
基板洗浄処理装置及び基板処理ユニット Download PDFInfo
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- JP2006114884A JP2006114884A JP2005247070A JP2005247070A JP2006114884A JP 2006114884 A JP2006114884 A JP 2006114884A JP 2005247070 A JP2005247070 A JP 2005247070A JP 2005247070 A JP2005247070 A JP 2005247070A JP 2006114884 A JP2006114884 A JP 2006114884A
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005247070A JP2006114884A (ja) | 2004-09-17 | 2005-08-29 | 基板洗浄処理装置及び基板処理ユニット |
| US11/663,071 US20070277930A1 (en) | 2004-09-17 | 2005-09-14 | Substrate Cleaning Apparatus and Substrate Processing Unit |
| PCT/JP2005/017318 WO2006030953A1 (ja) | 2004-09-17 | 2005-09-14 | 基板洗浄処理装置及び基板処理ユニット |
| TW094131782A TWI373799B (en) | 2004-09-17 | 2005-09-15 | Processing apparatus for cleaning substrate and substrate processing unit |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004271875 | 2004-09-17 | ||
| JP2005247070A JP2006114884A (ja) | 2004-09-17 | 2005-08-29 | 基板洗浄処理装置及び基板処理ユニット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006114884A true JP2006114884A (ja) | 2006-04-27 |
| JP2006114884A5 JP2006114884A5 (enExample) | 2008-10-23 |
Family
ID=36060194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005247070A Pending JP2006114884A (ja) | 2004-09-17 | 2005-08-29 | 基板洗浄処理装置及び基板処理ユニット |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20070277930A1 (enExample) |
| JP (1) | JP2006114884A (enExample) |
| TW (1) | TWI373799B (enExample) |
| WO (1) | WO2006030953A1 (enExample) |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008060578A (ja) * | 2006-08-30 | 2008-03-13 | Semes Co Ltd | 基板処理装置および基板処理方法 |
| JP2009125643A (ja) * | 2007-11-21 | 2009-06-11 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP2009252855A (ja) * | 2008-04-03 | 2009-10-29 | Tokyo Electron Ltd | 基板洗浄方法、基板洗浄装置及び記憶媒体 |
| JP2010123658A (ja) * | 2008-11-18 | 2010-06-03 | Shibaura Mechatronics Corp | 基板処理装置および基板処理方法 |
| CN102553851A (zh) * | 2010-12-28 | 2012-07-11 | 东京毅力科创株式会社 | 液处理装置及液处理方法 |
| JP2012165000A (ja) * | 2012-04-09 | 2012-08-30 | Tokyo Electron Ltd | 基板洗浄方法、基板洗浄装置及び記憶媒体 |
| WO2012127715A1 (ja) * | 2011-03-22 | 2012-09-27 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| JP2013193060A (ja) * | 2012-03-22 | 2013-09-30 | Sharp Corp | 除塵装置および除塵方法 |
| CN103707179A (zh) * | 2012-10-03 | 2014-04-09 | 株式会社荏原制作所 | 基板清洗装置及研磨装置 |
| JP2014232872A (ja) * | 2013-05-02 | 2014-12-11 | 富士フイルム株式会社 | エッチング液およびエッチング液のキット、これを用いたエッチング方法および半導体基板製品の製造方法 |
| JP2014232873A (ja) * | 2013-05-02 | 2014-12-11 | 富士フイルム株式会社 | エッチング方法、これに用いるエッチング液、ならびに半導体基板製品の製造方法 |
| JP2014232874A (ja) * | 2013-05-02 | 2014-12-11 | 富士フイルム株式会社 | エッチング方法、これに用いるエッチング液およびエッチング液のキット、ならびに半導体基板製品の製造方法 |
| JP2015002261A (ja) * | 2013-06-14 | 2015-01-05 | 東京エレクトロン株式会社 | 基板洗浄装置、基板洗浄システムおよび基板洗浄方法 |
| JP2015070015A (ja) * | 2013-09-27 | 2015-04-13 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| US9028621B2 (en) | 2010-07-07 | 2015-05-12 | Screen Semiconductor Solutions Co., Ltd. | Substrate cleaning method and substrate cleaning device |
| JP2015144230A (ja) * | 2013-06-04 | 2015-08-06 | 富士フイルム株式会社 | エッチング液およびそのキット、これらを用いたエッチング方法、半導体基板製品の製造方法および半導体素子の製造方法 |
| JP2016096337A (ja) * | 2014-11-11 | 2016-05-26 | 株式会社荏原製作所 | 基板洗浄装置 |
| JP2018037650A (ja) * | 2016-08-29 | 2018-03-08 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
| KR101843786B1 (ko) | 2014-03-11 | 2018-03-30 | 가부시키가이샤 씽크. 라보라토리 | 모듈식 처리 유닛 및 이를 이용한 그라비아 실린더의 전자동 제조 시스템 |
| US10199231B2 (en) | 2013-09-27 | 2019-02-05 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method |
| JP2021130149A (ja) * | 2020-02-18 | 2021-09-09 | 株式会社ディスコ | 加工装置 |
| WO2022034712A1 (ja) * | 2020-08-12 | 2022-02-17 | 栗田工業株式会社 | pH・酸化還元電位調整水製造装置 |
| JP7162787B1 (ja) * | 2022-06-17 | 2022-10-28 | 株式会社荏原製作所 | めっき装置 |
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| KR101231841B1 (ko) * | 2005-12-29 | 2013-02-08 | 엘지디스플레이 주식회사 | 반송계 |
| KR101549562B1 (ko) * | 2007-12-20 | 2015-09-02 | 램 리써치 코포레이션 | 웨이퍼에 대하여 균일한 유체 흐름을 제공하는 근접 헤드를 구성하는 방법 |
| US9111729B2 (en) | 2009-12-03 | 2015-08-18 | Lam Research Corporation | Small plasma chamber systems and methods |
| US9190289B2 (en) | 2010-02-26 | 2015-11-17 | Lam Research Corporation | System, method and apparatus for plasma etch having independent control of ion generation and dissociation of process gas |
| US9449793B2 (en) | 2010-08-06 | 2016-09-20 | Lam Research Corporation | Systems, methods and apparatus for choked flow element extraction |
| US8999104B2 (en) | 2010-08-06 | 2015-04-07 | Lam Research Corporation | Systems, methods and apparatus for separate plasma source control |
| US9967965B2 (en) | 2010-08-06 | 2018-05-08 | Lam Research Corporation | Distributed, concentric multi-zone plasma source systems, methods and apparatus |
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| JP5762925B2 (ja) * | 2010-12-28 | 2015-08-12 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
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| JPH1126346A (ja) * | 1997-06-30 | 1999-01-29 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP2001223196A (ja) * | 1999-12-01 | 2001-08-17 | Ses Co Ltd | 基板洗浄システム |
| WO2002095809A2 (en) * | 2001-05-18 | 2002-11-28 | Lam Research Corporation | Apparatus and method for substrate preparation implementing a surface tension reducing process |
| JP2002359220A (ja) * | 2001-05-31 | 2002-12-13 | Tokyo Electron Ltd | 基板の処理装置 |
| JP2003007662A (ja) * | 2001-06-21 | 2003-01-10 | Ebara Corp | 基板洗浄装置 |
| WO2003007348A2 (en) * | 2001-07-13 | 2003-01-23 | Lam Research Corporation | Apparatus and method for controlling galvanic corrosion effects on a single-wafer cleaning system |
| JP2003077879A (ja) * | 2001-09-05 | 2003-03-14 | Ebara Corp | 基板処理装置及び基板処理方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2006030953A1 (ja) | 2006-03-23 |
| US20070277930A1 (en) | 2007-12-06 |
| TWI373799B (en) | 2012-10-01 |
| TW200616068A (en) | 2006-05-16 |
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