JP2005505943A - 加工に適する半導体ウェーハの固定用アッセンブリーシステムおよび半導体ウェーハの製造法 - Google Patents

加工に適する半導体ウェーハの固定用アッセンブリーシステムおよび半導体ウェーハの製造法 Download PDF

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Publication number
JP2005505943A
JP2005505943A JP2003535983A JP2003535983A JP2005505943A JP 2005505943 A JP2005505943 A JP 2005505943A JP 2003535983 A JP2003535983 A JP 2003535983A JP 2003535983 A JP2003535983 A JP 2003535983A JP 2005505943 A JP2005505943 A JP 2005505943A
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JP
Japan
Prior art keywords
semiconductor wafer
support block
assembly system
meth
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003535983A
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English (en)
Japanese (ja)
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JP2005505943A5 (https=
Inventor
ワナト・スタンレイ・エフ
プラス・ロバート
Original Assignee
クラリアント・インターナシヨナル・リミテッド
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Filing date
Publication date
Application filed by クラリアント・インターナシヨナル・リミテッド filed Critical クラリアント・インターナシヨナル・リミテッド
Publication of JP2005505943A publication Critical patent/JP2005505943A/ja
Publication of JP2005505943A5 publication Critical patent/JP2005505943A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Bipolar Transistors (AREA)
JP2003535983A 2001-10-11 2002-10-02 加工に適する半導体ウェーハの固定用アッセンブリーシステムおよび半導体ウェーハの製造法 Pending JP2005505943A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/975,437 US20030092246A1 (en) 2001-10-11 2001-10-11 Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer
PCT/EP2002/011043 WO2003033208A1 (en) 2001-10-11 2002-10-02 Assembly system for stationing semiconductor wafer and process f or manufacturing semiconductor wafer

Publications (2)

Publication Number Publication Date
JP2005505943A true JP2005505943A (ja) 2005-02-24
JP2005505943A5 JP2005505943A5 (https=) 2009-03-05

Family

ID=25523031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003535983A Pending JP2005505943A (ja) 2001-10-11 2002-10-02 加工に適する半導体ウェーハの固定用アッセンブリーシステムおよび半導体ウェーハの製造法

Country Status (10)

Country Link
US (2) US20030092246A1 (https=)
EP (1) EP1448340B1 (https=)
JP (1) JP2005505943A (https=)
KR (1) KR20040041666A (https=)
CN (1) CN100420546C (https=)
AT (1) ATE332211T1 (https=)
DE (1) DE60212992T2 (https=)
MY (1) MY132030A (https=)
TW (1) TW593613B (https=)
WO (1) WO2003033208A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007049566A1 (ja) * 2005-10-28 2007-05-03 Tokyo Ohka Kogyo Co., Ltd. 接着剤組成物および接着フィルム
JP2009147327A (ja) * 2007-12-11 2009-07-02 Asml Netherlands Bv リソグラフィ方法およびキャリア基板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6643507B1 (en) 1998-12-31 2003-11-04 At&T Corp. Wireless centrex automatic callback
US20050282961A1 (en) * 2004-06-18 2005-12-22 Hsienkun Tsai Pressure-sensitive label laminates with improved convertability and broad temperature adhesion performance
EP1966410B1 (en) 2005-09-26 2018-12-26 Planar Solutions LLC Ultrapure colloidal silica for use in chemical mechanical polishing applications
CN101885613B (zh) * 2010-07-29 2012-07-04 西安理工大学 电子陶瓷成型用粘合剂及其制备方法
FR3005895B1 (fr) * 2013-05-27 2015-06-26 Commissariat Energie Atomique Procede d'assemblage de deux substrats de nature differente via une couche intermediaire ductile
US10556317B2 (en) 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
CN106041739B (zh) * 2016-05-27 2018-02-23 华侨大学 一种超硬磨料磨具的微生物修整方法

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US4251400A (en) * 1971-11-03 1981-02-17 Borden, Inc. Hot and cold water redispersible polyvinyl acetate adhesives
US3905928A (en) * 1974-02-15 1975-09-16 Burlington Industries Inc Hot melt size and yarn sized therewith
US4073756A (en) * 1976-04-26 1978-02-14 Konishi Co., Ltd. Solid adhesive compositions
JPS608426Y2 (ja) * 1976-12-08 1985-03-25 シャープ株式会社 半導体ウエハ−の保持基板
US5714029A (en) * 1984-03-12 1998-02-03 Nitto Electric Industrial Co., Ltd. Process for working a semiconductor wafer
US4853286A (en) * 1984-05-29 1989-08-01 Mitsui Toatsu Chemicals, Incorporated Wafer processing film
JP2807322B2 (ja) * 1989-10-09 1998-10-08 三井化学株式会社 帯電防止性に優れた樹脂組成物
JPH0641504A (ja) * 1991-07-12 1994-02-15 Saiden Kagaku Kk アルカリ可溶型粘着剤組成物
KR930006846A (ko) * 1991-09-02 1993-04-22 사와무라 하루오 반도체 웨이퍼의 이면 연삭방법 및 그 방법에 이용하는 점착 테이프
US5196443A (en) * 1991-09-25 1993-03-23 Buckman Laboratories International, Inc. Synergistic combinations of 2-(thiocyanomethylthio) benzothiazole with a mixture of 4,4-dimethyloxazolidine and 3,4,4-trimethyloxazolidine in controlling fungal and bacterial growth in aqueous fluids
US5534053A (en) * 1993-01-12 1996-07-09 Rodel, Inc. Composition for reducing or eliminating static charge in adhesive film
JP3410202B2 (ja) * 1993-04-28 2003-05-26 日本テキサス・インスツルメンツ株式会社 ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法
IL113583A (en) * 1994-05-26 1999-12-22 Rohm & Haas Acrylic pressure sensitive adhesive
TW311927B (https=) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg
IT1279051B1 (it) * 1995-10-27 1997-12-04 3V Sigma Spa Composizioni addensanti in forma solida costituite da polimeri o copolimeri e poliglicoli
JP2741362B2 (ja) * 1995-12-05 1998-04-15 日化精工株式会社 ウエハ−の仮着用接着剤
JPH09260471A (ja) * 1996-03-18 1997-10-03 Kazuo Inoue 焼結炭化硅素基体上に化学蒸着炭化硅素膜をコーティングした半導体ウエハ用真空チャック
JP3620554B2 (ja) * 1996-03-25 2005-02-16 信越半導体株式会社 半導体ウェーハ製造方法
US5700581A (en) * 1996-06-26 1997-12-23 International Business Machines Corporation Solvent-free epoxy based adhesives for semiconductor chip attachment and process
DE19756614A1 (de) * 1997-12-18 1999-07-01 Wacker Siltronic Halbleitermat Verfahren zur Montage und Demontage einer Halbleiterscheibe, und Stoffmischung, die zur Durchführung des Verfahrens geeignet ist
JP2000015573A (ja) 1998-06-30 2000-01-18 Ibiden Co Ltd ウェハ研磨装置用ウェハ保持プレート及び半導体ウェハの研磨方法
JP4275221B2 (ja) * 1998-07-06 2009-06-10 リンテック株式会社 粘接着剤組成物および粘接着シート
JP2001226650A (ja) * 2000-02-16 2001-08-21 Nitto Denko Corp 放射線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
US6952025B2 (en) * 2000-06-08 2005-10-04 Showa Denko K.K. Semiconductor light-emitting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007049566A1 (ja) * 2005-10-28 2007-05-03 Tokyo Ohka Kogyo Co., Ltd. 接着剤組成物および接着フィルム
JP2007119646A (ja) * 2005-10-28 2007-05-17 Tokyo Ohka Kogyo Co Ltd 接着剤組成物および接着フィルム
US8163836B2 (en) 2005-10-28 2012-04-24 Tokyo Ohka Kogyo Co., Ltd. Adhesive composition and adhesive film
JP2009147327A (ja) * 2007-12-11 2009-07-02 Asml Netherlands Bv リソグラフィ方法およびキャリア基板

Also Published As

Publication number Publication date
DE60212992D1 (de) 2006-08-17
DE60212992T2 (de) 2007-02-22
TW593613B (en) 2004-06-21
EP1448340B1 (en) 2006-07-05
ATE332211T1 (de) 2006-07-15
CN1568244A (zh) 2005-01-19
US20030190446A1 (en) 2003-10-09
EP1448340A1 (en) 2004-08-25
US6924016B2 (en) 2005-08-02
KR20040041666A (ko) 2004-05-17
WO2003033208A1 (en) 2003-04-24
MY132030A (en) 2007-09-28
US20030092246A1 (en) 2003-05-15
CN100420546C (zh) 2008-09-24

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