Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
  • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B37/00—Lapping machines or devices; Accessories
  • B24B37/27—Work carriers
  • B24B37/30—Work carriers for single side lapping of plane surfaces
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
  • H10P52/40—Chemomechanical polishing [CMP]
  • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/14—Layer or component removable to expose adhesive

Definitions

• the present invention provides an assembly system for stationing a semiconductor wafer suitable for the processing of said wafer and also provides a process for manufacturing a semiconductor wafer.
• substrate wafers are cut by diamond-sawing single crystal silicon rods.
• it is first necessary to remove the toughened portion of the crystal surface which was produced during the sawing procedure.
• the first operation for obtaining a blemish-free surface is called “lapping”.
• the lapping operation employs a coarse abrasive such as coarse alumina or silicon carbide abrasive particles.
• Lapping removes coarse surface imperfections from the sawing operation.
• Lapping also provides flatness and parallelism to the surface.
• a series of polishing steps are employed to eliminate the remaining surface imperfections.
• a number of silicon wafers are typically mounted or “fixtured” onto a nonceramic (such as metal) or ceramic carrier or polishing head by a template assembly or by an adhesive material, in order to eliminate the need for manually polishing each individual wafer.
• the template assembly consists of impregnated polyurethane and plastic retaining rings to hold the silicon wafers in place.
• Adhesive materials may be a wax or a resin dissolved in a suitable solvent.
• U.S. Pat. No. 5,942,445 discloses a method of manufacturing a semiconductor wafer comprising the steps of flattening a thin disc-shaped wafer obtained right after slicing by surface grinding, and polishing the flattened wafer on both sides simultaneously.
• This patent discloses the presence of a wax or like adhesive between wafer and a base plate.
• U.S. Pat. No. 5,534,053 discloses a method for reducing or eliminating static charges on fixturing adhesive films and silicon wafers so treated by adding an antistatic agent to the fixturing adhesive.
• the present invention provides an assembly system for stationing a semiconductor wafer suitable for processing said wafer, said system comprising:
• an aqueous adhesive composition interposed between said ceramic block and said semiconductor wafer comprising water; at least one release agent selected from the group consisting of polyethylene glycols, fluorine-free ethoxylated surfactants, fluorosurfactants, and silicone polymers; and at least one resin selected from the group consisting of (meth)acrylic acid or (meth)acrylate based polymers, vinyl acetate polymers, rosin-modified maleic resins, novolak resins, and polymers represented by the formula
• each R 1 , R 2 , and R 3 independently is hydrogen or methyl; R is a hydrocarbyl group of 1 to 4 carbon atoms; each R 4 and R 5 independently is hydrogen or a hydrocarbyl group of 1 to 4 carbon atoms; R 6 is hydrocarbyl group of 1 to 20 carbon atoms; w, x, y, and z independently are a number from 1 to 100; wherein said adhesive composition adheres more strongly to said holding block than to said semiconductor wafer.
• the present invention also provides a process for manufacturing a semiconductor wafer, comprising the steps of:
• aqueous adhesive composition comprising water; at least one release agent selected from the group consisting of polyethylene glycols, fluorine-free ethoxylated surfactants, fluorosurfacants, and silicone polymers; and at least one resin selected from the group consisting of (meth)acrylic acid or (meth)acrylate based polymers, vinyl acetate polymers, rosin-modified maleic resins, novolak resins, and polymers represented by the formula
• each R 1 , R 2 , and R 3 independently is hydrogen or methyl;
• R is a hydrocarbyl group of 1 to 4 carbon atoms;
• each R 4 and R 5 independently is hydrogen or a hydrocarbyl group of 1 to 4 carbon atoms;
• R 6 is hydrocarbyl group of 1 to 12 carbon atoms;
• w, x, y, and z independently are a number from 1 to 100;
• the present invention provides an assembly system for stationing a semiconductor wafer suitable for processing said wafer, said system comprising: (a) a holding block; (b) a semiconductor wafer and (c) an adhesive composition interposed between the holding block and the semiconductor wafer, wherein the adhesive composition adheres more strongly to the holding block than to the semiconductor wafer.
• the holding block of the present assembly system should preferably be flat, should not warp under temperature change of 0° C. and 100° C. and should be amenable to rapid heating.
• the holding block is made of a ceramic material, such as silicon carbide, zinc oxide, aluminum oxide, or titanium dioxide material.
• nonceramic materials that can be used for the holding block include metal and various polymer derived materials such as high temperature thermoset resins, Bakelite, high temperature polyimides, and highly crosslinked polyurethanes.
• the adhesive composition of the present invention comprises water; at least one release agent selected from the group consisting of polyethylene glycols, fluorine-free ethoxylated surfactants, fluorosurfactants, and silicone polymers; and at least one resin selected from the group consisting of (meth)acrylic acid or (meth)acrylate based polymers, vinyl acetate polymers, rosin-modified maleic resins, novolak resins, and polymers represented by the formula
• each R 1 , R 2 , and R 3 independently is hydrogen or methyl;
• R is a hydrocarbyl group of 1 to 4 carbon atoms;
• each R 4 and R 5 independently is hydrogen or a hydrocarbyl group of 1 to 4 carbon atoms;
• R 6 is hydrocarbyl group of 1 to 20 carbon atoms, and in one embodiment 5 to 15 carbon atoms;
• w, x, y, and z independently are a number from 1 to 100, and in one embodiment, from 1 to 50 carbon atoms; wherein said adhesive composition adheres more strongly to said holding block than to said semiconductor wafer.
• release agent denotes an additive that migrates to the interface between the semiconductor wafer and adhesive composition to facilitate removal of the wafer with a minimum of adhesive transfer to the wafer.
• hydrocarbyl substituent or “hydrocarbyl group” is used in its ordinary sense, which is well known to those skilled in the art. Specifically, it refers to a group having a carbon atom directly attached to the remainder of the molecule and having predominantly hydrocarbon character.
• hydrocarbyl groups include:
• hydrocarbon substituents that is, aliphatic (e.g., alkyl or alkenyl), alicyclic (e.g., cycloalkyl, cycloalkenyl) substituents, and aromatic-, aliphatic-, and alicyclic-substituted aromatic substituents, as well as cyclic substituents wherein the ring is completed through another portion of the molecule (e.g., two substituents together form an alicyclic radical);
• aliphatic e.g., alkyl or alkenyl
• alicyclic e.g., cycloalkyl, cycloalkenyl
• aromatic-, aliphatic-, and alicyclic-substituted aromatic substituents as well as cyclic substituents wherein the ring is completed through another portion of the molecule (e.g., two substituents together form an alicyclic radical);
• substituted hydrocarbon substituents that is, substituents containing non-hydrocarbon groups which, in the context of this invention, do not alter the predominantly hydrocarbon substituent (e.g., halo (especially chloro and fluoro), hydroxy, alkoxy, mercapto, alkylmercapto, nitro, nitroso, and sulfoxy);
• hetero substituents that is, substituents which, while having a predominantly hydrocarbon character, in the context of this invention, contain other than carbon in a ring or chain otherwise composed of carbon atoms.
• Heteroatoms include sulfur, oxygen, nitrogen, and encompass substituents as pyridyl, furyl, thienyl and imidazolyl.
• no more than two, preferably no more than one, non-hydrocarbon substituent will be present for every ten carbon atoms in the hydrocarbyl group; typically, there will be no non-hydrocarbon substituents in the hydrocarbyl group.
• the release agent in the present aqueous adhesive composition is present at a level of from 0.05% to 20%, and in one embodiment, from 0.1 to 15%, and in one embodiment, from 0.5% to 10% by weight of the adhesive composition.
• the water present in the present aqueous adhesive composition is present at a level of 5% to 95%, and in one embodiment, from 30% to 90%, and in one embodiment, from 60% to 80% by weight of the adhesive composition.
• the resin is present at a level of 5 to 40%, and in one embodiment 10% to 30%, and in one embodiment at 15% to 25% by weight of the adhesive composition.
• the polyethylene glycol of the present invention preferably has a weight average molecular weight (M w ) ranging from 100 to 50,000, in one embodiment from 100 to 5000, in one embodiment from 5,000 to 30,000, and in one embodiment from 100 to 500. They are available commercially, for example under the name “CRISANOLTM Polyethylene glycol” from Clariant Corporation. In one embodiment, the polyethylene glycol is present at a level of 1-15%, and in one embodiment 4-10% by weight of the adhesive composition.
• M w weight average molecular weight
• the fluorine-free ethoxylated surfactant is not particularly limited. Some common examples include those commercially available under the name “NEODOLTM” and “TERGITOLTM”.
• the fluorosurfactant includes both ionic and nonionic surfactants, and include compounds having perfluoroalkyl groups.
• the compound having the prefluoroalkyl group is represented is represented by the formula C n F 2n+1 X wherein X is SO 2 or (CH 2 ) 2 OH and n is 4-14.
• Suitable nonlimiting examples include those fluorosurfactants available from Dupont under the name “ZONYL®”, those available from Dainippon Ink & Chemicals, Inc., under the name “MEGAFACETM”, and those available from 3M under the name “FLUORAD”.
• the silicone polymers include without limitation polydimethylsiloxane (PDMS) materials, including silicone-urethane copolymers. While not wishing to be bound by theory, it is believed that the silicone polymers migrate to the surface and act as release coats due to their low surface tension. Both “reactive” modified and “nonreactive” modified PDMS polymers can be used.
• PDMS polydimethylsiloxane
• Nonreactive modified PDMS materials can be chemically bonded to the adhesive matrix to provide less different adhesive properties in the bulk and at both the upper and lower bonding interfaces.
• Nonreactive modified PDMS materials include alkoxylate-modified PDMS that have limited water solubility for use in aqueous systems.
• silicone—urethane copolymers (polyurethane copolymers made with dimethylsiloxane segments) give the properties of a film forming urethane with their high temperature stability combined with ultra high release properties of silicones without phase separation.
• Such copolymers are commercially available from Dinichiseika Color and Chemicals MFG Co. Ltd. (DNS), and from Polyurethane Specialties Co. Inc.
• the (meth)acrylic acid or (meth)acrylate polymer can be any polymer comprising acrylic acid, methacrylic acid, an acrylate or a methacrylate repeating unit.
• the (meth)acrylic acid or (meth)acrylate polymer is a styrene-acrylic acid copolymer.
• This copolymer preferably has a weight average molecular weight (M w ) ranging from 500 to 300,000 and in one embodiment from 500 to 2500, and in one embodiment from 500 to 50,000. They may be available commercially, for example, under the name “JONCRYL®” from S. C. Johnson Polymer.
• JONCRYL® materials are usually aqueous solutions containing water, ammonium hydroxide and styrene-acrylic acid copolymers.
• the styrene acrylic acid copolymer is present in the adhesive composition at a level of about 5 to 40% by weight of the adhesive composition.
• the polyvinyl acetate is not limited in any way. In one embodiment, it is available as an aqueous emulsion from National Starch Chemical Corporation. In one embodiment, the vinyl acetate is a dextrin-modified polyvinyl acetate. In one embodiment, vinyl acetate polymer comprises a vinyl alcohol-vinyl acetate copolymer. These copolymers can be made by partial hydrolysis of starting polyvinyl acetate with methanol, in the presence of a suitable catalyst such as sodium hydroxide.
• the vinyl alcohol-vinyl acetate copolymer preferably has a weight average molecular weight (M w ) ranging from 5000 to 250,000 and in one embodiment from 10,000 to 100,000 and in one embodiment from 5,000 to 50,000.
• M w weight average molecular weight
• These copolymers are available commercially, for example, under the name “MOWIOL®” available from Clariant Corporation.
• Some preferred Mowiol copolymers include Mowiol 3-83, Mowiol 8-88, Mowiol 5-72 and Mowiol 15-20. The first number in this nomenclature relates to molecular weight and viscosity, while the second number relates to the degree of hydrolysis.
• Mowiol 3-83 is 83% hydrolyzed polyvinyl acetate, and has a P w (weight average degree of polymerization) of 350, while Mowiol 8-88 has P w of 1000 and is 88% hydrolyzed polyvinyl acetate.
• [0046] preferably is an adduct of an ethoxylated nonylphenol with poly(ethyl acrylate-co-methyacrylic acid-co-3-(1-isocyanato-1-methylethyl)-alpha-methylstyrene), said adduct being represented by the formula
• w, x, y, and z represent respectively the number of repeating units of ethyl acrylate, acrylic acid, 3-(1-isocyanato-1-methylethyl)-alpha-methylstyrene/ethoxylated nonylphenol adduct, as shown, and ethylene oxide.
• the parameters w, x, and y can be varied by one skilled in the art to obtain appropriate molecular weights of these polymers and the appropriate ratios of the various repeat units.
• a 25 wt % solution in water of copolymer is available from Aldrich (product number 45,815-5; viscosity 10-100 cps; bp 73° C.).
• the rosin-modified maleic resin of this invention has no limitations on the kind thereof, and its commercially available products include those available under the names “MALKYDTM” and “HIPARACTM”, such as Malkyd No. 31 and Malkyd No. 32 (by Arakawa Chemicals Co., Ltd.), Hiparac C and Hiparac PR (by Nippon Shellac Co., Ltd.), Harimac 145P and Harimac R-120AH (by Harima Chemical Industry Co., Ltd.), etc.
• MALKYDTM Malkyd No. 31 and Malkyd No. 32
• Hiparac C and Hiparac PR by Nippon Shellac Co., Ltd.
• Harimac 145P and Harimac R-120AH by Harima Chemical Industry Co., Ltd.
• the novolak resin of the present invention is not limited in any way.
• Preferred novolak resins include those made from ortho- and para-cresol, and in one embodiment, in order to provide enhanced aqueous base solubilities, the novolak resins are preferentially polyhydroxy-based phenolic resins.
• the adhesive composition adheres more strongly to the holding block than to the semiconductor wafer. This means that the adhesive force between the holding block and the adhesive composition is stronger than that between the semiconductor wafer and the adhesive composition.
• the aqueous adhesive composition of the present invention can also contain optional ingredients.
• Some preferred ingredients include alcohols having 2 to 5 carbon atoms, aqueous ammonium hydroxide solution and biocide compositions.
• suitable alcohols include ethanol, 1-propanol, 2-propanol (isopropanol), 1- and 2-butanols, and 1-, 2-, and 3-pentanols, with isopropanol being the most preferred.
• the ammonium hydroxide is a 0.5% to 60wt % dilute solution.
• biocide compositions include compounds such as dimethyloxazolidine (such as 4,4-dimethyloxazolidine) and 3,44-trimethyloxalidine.
• the biocide composition is present at a level of 0.05% to 1% by weight of the aqueous adhesive composition.
• the present invention also provides a process for manufacturing a semiconductor wafer, comprising the steps of:
• the coated holding block or the coated semiconductor wafer is heated at a temperature of 80-95° C., and in one embodiment, 90-95° C.
• Tables 3 and 4 below illustrate some formulations with styrene-acrylic acid copolymer resins.
• TABLE 3 Sample Joncryl PEG Flourad No. Eco 84 7 200 2 FC-430 8 Water 19 41.86 6.98 — 51.16 20 41.69 6.95 0.40 50.95 21 41.41 6.91 1.06 50.62 PEG- 1000 22 42 14 44 23 42 9.3 48.7 24 42 4.7 53.3
• Table 5 illustrates some formulations with adduct of ethoxylated nonylphenol with poly(ethyl acrylate-co-methyacrylic acid-co-3-(1-isocyanato-1-methylethyl)-alpha-methylstyrene).
• the adhesive composition is applied to the holding block by spin coating using spray, puddle coating or other solvent based dispense methods.
• the coated holding block is dried by heating (90-95° C.) the block by hot plate, infrared heaters or forced hot air dryers. Unpolished wafers are adhered to the adhesive by pressing the warm coated block onto the wafer. Adhesion is assisted by applying pressure to the assembly or pulling vacuum on the system while allowing the wafer/adhesive/holding block “sandwich” to cool.
• the cooled wafer is polished by means of aqueous slurries containing polishing abrasives known to those skilled in the art. These may include, but are not limited to, quartz, pumice, silicon carbide etc. or mixtures thereof.
• polishing abrasives known to those skilled in the art. These may include, but are not limited to, quartz, pumice, silicon carbide etc. or mixtures thereof.
• the wafer is polished in a series of finer polishes until the desired surface polish is achieved.
• the polished wafer/adhesive/holding block array is then rinsed with cold water and air dried with spinning.
• the polished wafer is finally removed by separating the wafer from the adhesive which essentially remains attached to the holding block.
• the separation can be accomplished by application of a blade or several blades to the interface between the wafer and the adhesive and exerting enough force to make a clean separation without deforming or breaking the wafer. Any adhesive that remains adhered to the unpolished side of the wafer can be removed/cleaned with a suitable cleaning solution.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Mechanical Treatment Of Semiconductor (AREA)
• Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Bipolar Transistors (AREA)

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• 2001
  • 2001-10-11 US US09/975,437 patent/US20030092246A1/en not_active Abandoned
• 2002
  • 2002-10-02 WO PCT/EP2002/011043 patent/WO2003033208A1/en not_active Ceased
  • 2002-10-02 JP JP2003535983A patent/JP2005505943A/ja active Pending
  • 2002-10-02 DE DE60212992T patent/DE60212992T2/de not_active Expired - Lifetime
  • 2002-10-02 AT AT02782813T patent/ATE332211T1/de not_active IP Right Cessation
  • 2002-10-02 EP EP02782813A patent/EP1448340B1/en not_active Expired - Lifetime
  • 2002-10-02 KR KR10-2004-7005000A patent/KR20040041666A/ko not_active Ceased
  • 2002-10-02 CN CNB028200500A patent/CN100420546C/zh not_active Expired - Fee Related
  • 2002-10-09 MY MYPI20023763A patent/MY132030A/en unknown
  • 2002-10-11 TW TW091123455A patent/TW593613B/zh not_active IP Right Cessation
• 2003
  • 2003-03-24 US US10/395,747 patent/US6924016B2/en not_active Expired - Fee Related

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