CN100420546C - 用于固定半导体片的组装体系及半导体片的制造方法 - Google Patents

用于固定半导体片的组装体系及半导体片的制造方法 Download PDF

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Publication number
CN100420546C
CN100420546C CNB028200500A CN02820050A CN100420546C CN 100420546 C CN100420546 C CN 100420546C CN B028200500 A CNB028200500 A CN B028200500A CN 02820050 A CN02820050 A CN 02820050A CN 100420546 C CN100420546 C CN 100420546C
Authority
CN
China
Prior art keywords
semiconductor chip
assembly system
methyl
adhesive composition
alkyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028200500A
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English (en)
Chinese (zh)
Other versions
CN1568244A (zh
Inventor
S·F·万奈特
R·普拉斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AZ Electronic Materials Japan Co Ltd
Original Assignee
AZ Electronic Materials Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AZ Electronic Materials Japan Co Ltd filed Critical AZ Electronic Materials Japan Co Ltd
Publication of CN1568244A publication Critical patent/CN1568244A/zh
Application granted granted Critical
Publication of CN100420546C publication Critical patent/CN100420546C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Bipolar Transistors (AREA)
CNB028200500A 2001-10-11 2002-10-02 用于固定半导体片的组装体系及半导体片的制造方法 Expired - Fee Related CN100420546C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/975,437 US20030092246A1 (en) 2001-10-11 2001-10-11 Assembly system for stationing semiconductor wafer suitable for processing and process for manufacturing semiconductor wafer
US09/975,437 2001-10-11

Publications (2)

Publication Number Publication Date
CN1568244A CN1568244A (zh) 2005-01-19
CN100420546C true CN100420546C (zh) 2008-09-24

Family

ID=25523031

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028200500A Expired - Fee Related CN100420546C (zh) 2001-10-11 2002-10-02 用于固定半导体片的组装体系及半导体片的制造方法

Country Status (10)

Country Link
US (2) US20030092246A1 (https=)
EP (1) EP1448340B1 (https=)
JP (1) JP2005505943A (https=)
KR (1) KR20040041666A (https=)
CN (1) CN100420546C (https=)
AT (1) ATE332211T1 (https=)
DE (1) DE60212992T2 (https=)
MY (1) MY132030A (https=)
TW (1) TW593613B (https=)
WO (1) WO2003033208A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6643507B1 (en) 1998-12-31 2003-11-04 At&T Corp. Wireless centrex automatic callback
US20050282961A1 (en) * 2004-06-18 2005-12-22 Hsienkun Tsai Pressure-sensitive label laminates with improved convertability and broad temperature adhesion performance
EP1966410B1 (en) 2005-09-26 2018-12-26 Planar Solutions LLC Ultrapure colloidal silica for use in chemical mechanical polishing applications
JP5020496B2 (ja) * 2005-10-28 2012-09-05 東京応化工業株式会社 接着剤組成物および接着フィルム
NL1036215A1 (nl) * 2007-12-11 2009-06-15 Asml Netherlands Bv Lithographic method and carrier substrate.
CN101885613B (zh) * 2010-07-29 2012-07-04 西安理工大学 电子陶瓷成型用粘合剂及其制备方法
FR3005895B1 (fr) * 2013-05-27 2015-06-26 Commissariat Energie Atomique Procede d'assemblage de deux substrats de nature differente via une couche intermediaire ductile
US10556317B2 (en) 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
CN106041739B (zh) * 2016-05-27 2018-02-23 华侨大学 一种超硬磨料磨具的微生物修整方法

Citations (5)

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Publication number Priority date Publication date Assignee Title
US4853286A (en) * 1984-05-29 1989-08-01 Mitsui Toatsu Chemicals, Incorporated Wafer processing film
EP0530729A1 (en) * 1991-09-02 1993-03-10 MITSUI TOATSU CHEMICALS, Inc. Method for grinding back side of semiconductor wafer and pressure-sensitive adhesive tape used in said method
CN1169452A (zh) * 1996-06-26 1998-01-07 国际商业机器公司 用于粘结半导体晶片的无溶剂环氧基粘合剂和其制备方法
US5942445A (en) * 1996-03-25 1999-08-24 Shin-Etsu Handotai Co., Ltd. Method of manufacturing semiconductor wafers
US6171385B1 (en) * 1997-12-18 2001-01-09 Wacker Siltronic Gesellschaft f{umlaut over (u)}r Halbleitermaterialien AG Adhesive mixture suitable for mounting and demounting a semiconductor wafer

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US4251400A (en) * 1971-11-03 1981-02-17 Borden, Inc. Hot and cold water redispersible polyvinyl acetate adhesives
US3905928A (en) * 1974-02-15 1975-09-16 Burlington Industries Inc Hot melt size and yarn sized therewith
US4073756A (en) * 1976-04-26 1978-02-14 Konishi Co., Ltd. Solid adhesive compositions
JPS608426Y2 (ja) * 1976-12-08 1985-03-25 シャープ株式会社 半導体ウエハ−の保持基板
US5714029A (en) * 1984-03-12 1998-02-03 Nitto Electric Industrial Co., Ltd. Process for working a semiconductor wafer
JP2807322B2 (ja) * 1989-10-09 1998-10-08 三井化学株式会社 帯電防止性に優れた樹脂組成物
JPH0641504A (ja) * 1991-07-12 1994-02-15 Saiden Kagaku Kk アルカリ可溶型粘着剤組成物
US5196443A (en) * 1991-09-25 1993-03-23 Buckman Laboratories International, Inc. Synergistic combinations of 2-(thiocyanomethylthio) benzothiazole with a mixture of 4,4-dimethyloxazolidine and 3,4,4-trimethyloxazolidine in controlling fungal and bacterial growth in aqueous fluids
US5534053A (en) * 1993-01-12 1996-07-09 Rodel, Inc. Composition for reducing or eliminating static charge in adhesive film
JP3410202B2 (ja) * 1993-04-28 2003-05-26 日本テキサス・インスツルメンツ株式会社 ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法
IL113583A (en) * 1994-05-26 1999-12-22 Rohm & Haas Acrylic pressure sensitive adhesive
TW311927B (https=) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg
IT1279051B1 (it) * 1995-10-27 1997-12-04 3V Sigma Spa Composizioni addensanti in forma solida costituite da polimeri o copolimeri e poliglicoli
JP2741362B2 (ja) * 1995-12-05 1998-04-15 日化精工株式会社 ウエハ−の仮着用接着剤
JPH09260471A (ja) * 1996-03-18 1997-10-03 Kazuo Inoue 焼結炭化硅素基体上に化学蒸着炭化硅素膜をコーティングした半導体ウエハ用真空チャック
JP2000015573A (ja) 1998-06-30 2000-01-18 Ibiden Co Ltd ウェハ研磨装置用ウェハ保持プレート及び半導体ウェハの研磨方法
JP4275221B2 (ja) * 1998-07-06 2009-06-10 リンテック株式会社 粘接着剤組成物および粘接着シート
JP2001226650A (ja) * 2000-02-16 2001-08-21 Nitto Denko Corp 放射線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
US6952025B2 (en) * 2000-06-08 2005-10-04 Showa Denko K.K. Semiconductor light-emitting device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4853286A (en) * 1984-05-29 1989-08-01 Mitsui Toatsu Chemicals, Incorporated Wafer processing film
EP0530729A1 (en) * 1991-09-02 1993-03-10 MITSUI TOATSU CHEMICALS, Inc. Method for grinding back side of semiconductor wafer and pressure-sensitive adhesive tape used in said method
US5942445A (en) * 1996-03-25 1999-08-24 Shin-Etsu Handotai Co., Ltd. Method of manufacturing semiconductor wafers
CN1169452A (zh) * 1996-06-26 1998-01-07 国际商业机器公司 用于粘结半导体晶片的无溶剂环氧基粘合剂和其制备方法
US6171385B1 (en) * 1997-12-18 2001-01-09 Wacker Siltronic Gesellschaft f{umlaut over (u)}r Halbleitermaterialien AG Adhesive mixture suitable for mounting and demounting a semiconductor wafer

Also Published As

Publication number Publication date
DE60212992D1 (de) 2006-08-17
DE60212992T2 (de) 2007-02-22
TW593613B (en) 2004-06-21
EP1448340B1 (en) 2006-07-05
ATE332211T1 (de) 2006-07-15
CN1568244A (zh) 2005-01-19
JP2005505943A (ja) 2005-02-24
US20030190446A1 (en) 2003-10-09
EP1448340A1 (en) 2004-08-25
US6924016B2 (en) 2005-08-02
KR20040041666A (ko) 2004-05-17
WO2003033208A1 (en) 2003-04-24
MY132030A (en) 2007-09-28
US20030092246A1 (en) 2003-05-15

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