JP2005330529A - 球状銀粉およびその製造方法 - Google Patents

球状銀粉およびその製造方法 Download PDF

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Publication number
JP2005330529A
JP2005330529A JP2004149068A JP2004149068A JP2005330529A JP 2005330529 A JP2005330529 A JP 2005330529A JP 2004149068 A JP2004149068 A JP 2004149068A JP 2004149068 A JP2004149068 A JP 2004149068A JP 2005330529 A JP2005330529 A JP 2005330529A
Authority
JP
Japan
Prior art keywords
silver powder
silver
spherical
spherical silver
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004149068A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005330529A5 (enExample
Inventor
Kozo Ogi
孝造 尾木
Takeaki Fujino
剛聡 藤野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Mining Co Ltd filed Critical Dowa Mining Co Ltd
Priority to JP2004149068A priority Critical patent/JP2005330529A/ja
Priority to US11/132,980 priority patent/US20050257643A1/en
Priority to TW094116087A priority patent/TW200603922A/zh
Priority to CN200510074647XA priority patent/CN1700360B/zh
Priority to KR1020050041948A priority patent/KR20060046103A/ko
Publication of JP2005330529A publication Critical patent/JP2005330529A/ja
Publication of JP2005330529A5 publication Critical patent/JP2005330529A5/ja
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05Metallic powder characterised by the size or surface area of the particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06Metallic powder characterised by the shape of the particles
    • B22F1/065Spherical particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07Metallic powder characterised by particles having a nanoscale microstructure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
JP2004149068A 2004-05-19 2004-05-19 球状銀粉およびその製造方法 Pending JP2005330529A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004149068A JP2005330529A (ja) 2004-05-19 2004-05-19 球状銀粉およびその製造方法
US11/132,980 US20050257643A1 (en) 2004-05-19 2005-05-18 Spherical silver powder and method for producing same
TW094116087A TW200603922A (en) 2004-05-19 2005-05-18 Spherical silver powder and method for producing same
CN200510074647XA CN1700360B (zh) 2004-05-19 2005-05-19 球形银粉及其制造方法
KR1020050041948A KR20060046103A (ko) 2004-05-19 2005-05-19 구상 은 분말 및 그의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004149068A JP2005330529A (ja) 2004-05-19 2004-05-19 球状銀粉およびその製造方法

Publications (2)

Publication Number Publication Date
JP2005330529A true JP2005330529A (ja) 2005-12-02
JP2005330529A5 JP2005330529A5 (enExample) 2007-04-26

Family

ID=35373926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004149068A Pending JP2005330529A (ja) 2004-05-19 2004-05-19 球状銀粉およびその製造方法

Country Status (5)

Country Link
US (1) US20050257643A1 (enExample)
JP (1) JP2005330529A (enExample)
KR (1) KR20060046103A (enExample)
CN (1) CN1700360B (enExample)
TW (1) TW200603922A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007004649A1 (ja) * 2005-07-05 2007-01-11 Mitsui Mining & Smelting Co., Ltd. 高結晶銀粉及びその高結晶銀粉の製造方法
JP2007235082A (ja) * 2006-02-02 2007-09-13 E I Du Pont De Nemours & Co 太陽電池電極用ペースト
CN100366368C (zh) * 2006-03-23 2008-02-06 福州大学 纳米金属银的非水溶液均相还原的制备方法
JP2008088453A (ja) * 2006-09-29 2008-04-17 Dowa Holdings Co Ltd 銀粉およびその製造方法
JP2012193454A (ja) * 2012-05-25 2012-10-11 Dowa Holdings Co Ltd 銀粉およびその製造方法
KR101366292B1 (ko) 2009-01-07 2014-02-20 엘지전자 주식회사 무선 네트워크에서의 전력 제어 방법
JP2015071814A (ja) * 2013-10-03 2015-04-16 住友金属鉱山株式会社 銀粉の製造方法
CN104646683A (zh) * 2015-02-28 2015-05-27 湖南汇通科技有限责任公司 一种粒度可控的球形银粉及其制备方法
JP2021501267A (ja) * 2017-10-31 2021-01-14 エルエスニッコカッパー インコーポレイテッドLs−Nikko Copper Inc. 銀粉末の製造方法及び銀粉末を含む導電性ペースト
JP7670919B1 (ja) 2023-10-27 2025-04-30 Dowaエレクトロニクス株式会社 銀粉及び樹脂硬化型導電性ペースト
WO2025204308A1 (ja) * 2024-03-29 2025-10-02 Dowaエレクトロニクス株式会社 酸化ガリウム被着銀粉、その製造方法および導電性ペースト

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7766218B2 (en) * 2005-09-21 2010-08-03 Nihon Handa Co., Ltd. Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board
TWI408702B (zh) * 2005-12-22 2013-09-11 Namics Corp 熱硬化性導電性糊膏及具有使用該導電性糊膏而形成之外部電極之積層陶瓷質電子組件
CN100420528C (zh) * 2005-12-28 2008-09-24 中国科学院理化技术研究所 卤化银预结晶还原法制备可重新分散银纳米颗粒的方法
US7648557B2 (en) 2006-06-02 2010-01-19 E. I. Du Pont De Nemours And Company Process for making highly dispersible spherical silver powder particles and silver particles formed therefrom
KR101334052B1 (ko) * 2007-01-09 2013-11-29 도와 일렉트로닉스 가부시키가이샤 은 입자 분산액 및 그 제조법
JP5252843B2 (ja) * 2007-01-09 2013-07-31 Dowaエレクトロニクス株式会社 銀インクおよびその製法
US8795837B2 (en) * 2007-08-20 2014-08-05 Diemat, Inc. Adhesives with thermal conductivity enhanced by mixed silver fillers
CN101752162B (zh) * 2008-11-27 2012-07-04 太阳控股株式会社 感光性导电糊剂及使用其形成的电极和等离子体显示板
TWI423930B (zh) * 2008-12-31 2014-01-21 Ind Tech Res Inst 奈米金屬溶液、奈米金屬複合顆粒以及金屬膜層的製作方法
KR101276951B1 (ko) * 2009-03-31 2013-06-19 다이요 홀딩스 가부시키가이샤 감광성 도전 페이스트 및 전극 패턴
TW201043359A (en) * 2009-05-01 2010-12-16 Du Pont Silver particles and a process for making them
TW201100185A (en) * 2009-05-01 2011-01-01 Du Pont Silver particles and a process for making them
US20110048527A1 (en) * 2009-08-25 2011-03-03 E.I. Du Pont De Nemours And Company Silver thick film paste compositions and their use in conductors for photovoltaic cells
JP5163687B2 (ja) * 2010-04-30 2013-03-13 株式会社村田製作所 感光性導電ペースト、それを用いた積層型電子部品の製造方法、および積層型電子部品
CN101872652B (zh) * 2010-05-26 2012-07-04 广东风华高新科技股份有限公司 无铅可耐焊全银导体浆料
US8366799B2 (en) 2010-08-30 2013-02-05 E I Du Pont De Nemours And Company Silver particles and a process for making them
US8574338B2 (en) 2010-11-17 2013-11-05 E I Du Pont De Nemours And Company Reactor and continuous process for producing silver powders
WO2012102304A1 (ja) * 2011-01-26 2012-08-02 ナミックス株式会社 導電性ペースト及びその製造方法
US8715387B2 (en) * 2011-03-08 2014-05-06 E I Du Pont De Nemours And Company Process for making silver powder particles with small size crystallites
TWI570197B (zh) * 2011-03-31 2017-02-11 Taiyo Holdings Co Ltd Conductive paste
CN103702786B (zh) * 2011-07-29 2015-07-29 户田工业株式会社 银微颗粒以及含有该银微颗粒的导电性膏、导电性膜和电子器件
JP5872440B2 (ja) * 2012-02-13 2016-03-01 Dowaエレクトロニクス株式会社 球状銀粉およびその製造方法
JP2015515714A (ja) * 2012-02-27 2015-05-28 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company 銀ペーストおよび太陽電池の製造においてのその使用
US20130319496A1 (en) * 2012-06-01 2013-12-05 Heraeus Precious Metals North America Conshohocken Llc Low-metal content electroconductive paste composition
CN102842353B (zh) * 2012-08-14 2015-05-13 廖晓峰 一种用于片式元件端电极的导电浆料
JP2014098186A (ja) * 2012-11-14 2014-05-29 Mitsui Mining & Smelting Co Ltd 銀粉
JP5510531B1 (ja) * 2012-11-29 2014-06-04 住友金属鉱山株式会社 銀粉及び銀ペースト
CN103737011B (zh) * 2013-04-22 2016-02-24 昆山西微美晶电子新材料科技有限公司 高振实球形银粉的制备方法
CN103551589B (zh) * 2013-10-30 2015-07-29 江苏理工学院 花状银微米颗粒的合成方法
CN104148665B (zh) * 2014-07-22 2017-04-12 西北大学 一种结晶银粉的制备方法
JP6282616B2 (ja) * 2014-07-30 2018-02-21 Dowaエレクトロニクス株式会社 銀粉およびその製造方法
JP6029719B2 (ja) * 2014-07-31 2016-11-24 Dowaエレクトロニクス株式会社 銀粉及びその製造方法、並びに導電性ペースト
CN104096850B (zh) * 2014-08-12 2017-10-10 天津市职业大学 用对氨基苯酚还原银氨络合物制备超细球形银粉的方法
KR20180047528A (ko) * 2016-10-31 2018-05-10 엘에스니꼬동제련 주식회사 은 분말 및 이의 제조방법
KR101927476B1 (ko) * 2016-10-31 2018-12-10 엘에스니꼬동제련 주식회사 은 분말 및 이의 제조방법
CN106623978A (zh) * 2016-12-29 2017-05-10 广东羚光新材料股份有限公司 一种大粒径球形银粉及其制备方法
CN107068241A (zh) * 2017-02-20 2017-08-18 江苏瑞德新能源科技有限公司 一种正银浆料及其制备方法
CN107812958A (zh) * 2017-11-01 2018-03-20 昆明理工大学 一种高分散性超细银粉的制备方法
KR20200038742A (ko) * 2018-10-04 2020-04-14 대주전자재료 주식회사 은 분말 및 이의 제조 방법
KR102178009B1 (ko) * 2018-11-30 2020-11-12 엘에스니꼬동제련 주식회사 수축률 조절이 가능한 은 분말의 제조방법
KR102308468B1 (ko) * 2018-12-28 2021-10-06 대주전자재료 주식회사 구형 은 분말 및 이의 제조방법
KR102263618B1 (ko) * 2019-03-29 2021-06-10 대주전자재료 주식회사 혼합 은 분말 및 이를 포함하는 도전성 페이스트
US11270872B2 (en) * 2019-09-25 2022-03-08 Western Digital Technologies, Inc. Base conducting layer beneath graphite layer of ceramic cathode for use with cathodic arc deposition
CN110947953A (zh) * 2019-12-19 2020-04-03 苏州银瑞光电材料科技有限公司 用于太阳能正面银浆的高烧结活性的球形银粉的制备方法
JP7093475B1 (ja) * 2021-03-26 2022-06-29 Dowaエレクトロニクス株式会社 銀粉及びその製造方法
CN114367674B (zh) * 2022-03-22 2022-06-24 南通领跑者新材料科技有限公司 银粉的制备方法
CN115846678A (zh) * 2023-02-27 2023-03-28 东方电气集团科学技术研究院有限公司 一种超疏水高分散性银粉的制备方法

Family Cites Families (3)

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US5389122A (en) * 1993-07-13 1995-02-14 E. I. Du Pont De Nemours And Company Process for making finely divided, dense packing, spherical shaped silver particles
CN1227148A (zh) * 1999-01-19 1999-09-01 沈阳黎明发动机制造公司 高纯高分散性球形超细银粉及生产方法
CN1164388C (zh) * 2001-05-26 2004-09-01 宁夏东方特种材料科技开发有限责任公司 一种制取粒径在0.3-3.0μm之间的球形银粉的方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007004649A1 (ja) * 2005-07-05 2007-01-11 Mitsui Mining & Smelting Co., Ltd. 高結晶銀粉及びその高結晶銀粉の製造方法
JP2007235082A (ja) * 2006-02-02 2007-09-13 E I Du Pont De Nemours & Co 太陽電池電極用ペースト
EP1979950A1 (en) 2006-02-02 2008-10-15 E.I. Du Pont De Nemours And Company Paste for solar cell electrode and solar cell
CN100366368C (zh) * 2006-03-23 2008-02-06 福州大学 纳米金属银的非水溶液均相还原的制备方法
JP2008088453A (ja) * 2006-09-29 2008-04-17 Dowa Holdings Co Ltd 銀粉およびその製造方法
KR101366292B1 (ko) 2009-01-07 2014-02-20 엘지전자 주식회사 무선 네트워크에서의 전력 제어 방법
JP2012193454A (ja) * 2012-05-25 2012-10-11 Dowa Holdings Co Ltd 銀粉およびその製造方法
JP2015071814A (ja) * 2013-10-03 2015-04-16 住友金属鉱山株式会社 銀粉の製造方法
CN104646683A (zh) * 2015-02-28 2015-05-27 湖南汇通科技有限责任公司 一种粒度可控的球形银粉及其制备方法
JP2021501267A (ja) * 2017-10-31 2021-01-14 エルエスニッコカッパー インコーポレイテッドLs−Nikko Copper Inc. 銀粉末の製造方法及び銀粉末を含む導電性ペースト
JP7069311B2 (ja) 2017-10-31 2022-05-17 エルエスニッコカッパー インコーポレイテッド 銀粉末の製造方法及び銀粉末を含む導電性ペースト
JP7670919B1 (ja) 2023-10-27 2025-04-30 Dowaエレクトロニクス株式会社 銀粉及び樹脂硬化型導電性ペースト
WO2025089418A1 (ja) * 2023-10-27 2025-05-01 Dowaエレクトロニクス株式会社 銀粉及び樹脂硬化型導電性ペースト
JP2025074051A (ja) * 2023-10-27 2025-05-13 Dowaエレクトロニクス株式会社 銀粉及び樹脂硬化型導電性ペースト
WO2025204308A1 (ja) * 2024-03-29 2025-10-02 Dowaエレクトロニクス株式会社 酸化ガリウム被着銀粉、その製造方法および導電性ペースト

Also Published As

Publication number Publication date
TW200603922A (en) 2006-02-01
KR20060046103A (ko) 2006-05-17
CN1700360A (zh) 2005-11-23
US20050257643A1 (en) 2005-11-24
CN1700360B (zh) 2010-10-06

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