CN1700360B - 球形银粉及其制造方法 - Google Patents

球形银粉及其制造方法 Download PDF

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Publication number
CN1700360B
CN1700360B CN200510074647XA CN200510074647A CN1700360B CN 1700360 B CN1700360 B CN 1700360B CN 200510074647X A CN200510074647X A CN 200510074647XA CN 200510074647 A CN200510074647 A CN 200510074647A CN 1700360 B CN1700360 B CN 1700360B
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CN
China
Prior art keywords
silver powder
silver
spherical silver
acid
reducing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN200510074647XA
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English (en)
Chinese (zh)
Other versions
CN1700360A (zh
Inventor
尾木孝造
藤野刚聡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
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Dowa Holdings Co Ltd
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Filing date
Publication date
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Publication of CN1700360A publication Critical patent/CN1700360A/zh
Application granted granted Critical
Publication of CN1700360B publication Critical patent/CN1700360B/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/065—Spherical particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Non-Insulated Conductors (AREA)
CN200510074647XA 2004-05-19 2005-05-19 球形银粉及其制造方法 Expired - Lifetime CN1700360B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004-149068 2004-05-19
JP2004149068 2004-05-19
JP2004149068A JP2005330529A (ja) 2004-05-19 2004-05-19 球状銀粉およびその製造方法

Publications (2)

Publication Number Publication Date
CN1700360A CN1700360A (zh) 2005-11-23
CN1700360B true CN1700360B (zh) 2010-10-06

Family

ID=35373926

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200510074647XA Expired - Lifetime CN1700360B (zh) 2004-05-19 2005-05-19 球形银粉及其制造方法

Country Status (5)

Country Link
US (1) US20050257643A1 (enExample)
JP (1) JP2005330529A (enExample)
KR (1) KR20060046103A (enExample)
CN (1) CN1700360B (enExample)
TW (1) TW200603922A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103737011A (zh) * 2013-04-22 2014-04-23 昆山西微美晶电子新材料科技有限公司 高振实球形银粉的制备方法

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5032005B2 (ja) * 2005-07-05 2012-09-26 三井金属鉱業株式会社 高結晶銀粉及びその高結晶銀粉の製造方法
US7766218B2 (en) * 2005-09-21 2010-08-03 Nihon Handa Co., Ltd. Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board
TWI408702B (zh) * 2005-12-22 2013-09-11 Namics Corp 熱硬化性導電性糊膏及具有使用該導電性糊膏而形成之外部電極之積層陶瓷質電子組件
CN100420528C (zh) * 2005-12-28 2008-09-24 中国科学院理化技术研究所 卤化银预结晶还原法制备可重新分散银纳米颗粒的方法
JP2007235082A (ja) * 2006-02-02 2007-09-13 E I Du Pont De Nemours & Co 太陽電池電極用ペースト
CN100366368C (zh) * 2006-03-23 2008-02-06 福州大学 纳米金属银的非水溶液均相还原的制备方法
US7648557B2 (en) 2006-06-02 2010-01-19 E. I. Du Pont De Nemours And Company Process for making highly dispersible spherical silver powder particles and silver particles formed therefrom
JP5098098B2 (ja) * 2006-09-29 2012-12-12 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
KR101334052B1 (ko) * 2007-01-09 2013-11-29 도와 일렉트로닉스 가부시키가이샤 은 입자 분산액 및 그 제조법
JP5252843B2 (ja) * 2007-01-09 2013-07-31 Ｄｏｗａエレクトロニクス株式会社 銀インクおよびその製法
US8795837B2 (en) * 2007-08-20 2014-08-05 Diemat, Inc. Adhesives with thermal conductivity enhanced by mixed silver fillers
CN101752162B (zh) * 2008-11-27 2012-07-04 太阳控股株式会社 感光性导电糊剂及使用其形成的电极和等离子体显示板
TWI423930B (zh) * 2008-12-31 2014-01-21 Ind Tech Res Inst 奈米金屬溶液、奈米金屬複合顆粒以及金屬膜層的製作方法
KR101366292B1 (ko) 2009-01-07 2014-02-20 엘지전자 주식회사 무선 네트워크에서의 전력 제어 방법
KR101276951B1 (ko) * 2009-03-31 2013-06-19 다이요 홀딩스 가부시키가이샤 감광성 도전 페이스트 및 전극 패턴
TW201043359A (en) * 2009-05-01 2010-12-16 Du Pont Silver particles and a process for making them
TW201100185A (en) * 2009-05-01 2011-01-01 Du Pont Silver particles and a process for making them
US20110048527A1 (en) * 2009-08-25 2011-03-03 E.I. Du Pont De Nemours And Company Silver thick film paste compositions and their use in conductors for photovoltaic cells
JP5163687B2 (ja) * 2010-04-30 2013-03-13 株式会社村田製作所 感光性導電ペースト、それを用いた積層型電子部品の製造方法、および積層型電子部品
CN101872652B (zh) * 2010-05-26 2012-07-04 广东风华高新科技股份有限公司 无铅可耐焊全银导体浆料
US8366799B2 (en) 2010-08-30 2013-02-05 E I Du Pont De Nemours And Company Silver particles and a process for making them
US8574338B2 (en) 2010-11-17 2013-11-05 E I Du Pont De Nemours And Company Reactor and continuous process for producing silver powders
WO2012102304A1 (ja) * 2011-01-26 2012-08-02 ナミックス株式会社 導電性ペースト及びその製造方法
US8715387B2 (en) * 2011-03-08 2014-05-06 E I Du Pont De Nemours And Company Process for making silver powder particles with small size crystallites
TWI570197B (zh) * 2011-03-31 2017-02-11 Taiyo Holdings Co Ltd Conductive paste
CN103702786B (zh) * 2011-07-29 2015-07-29 户田工业株式会社 银微颗粒以及含有该银微颗粒的导电性膏、导电性膜和电子器件
JP5872440B2 (ja) * 2012-02-13 2016-03-01 Ｄｏｗａエレクトロニクス株式会社 球状銀粉およびその製造方法
JP2015515714A (ja) * 2012-02-27 2015-05-28 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 銀ペーストおよび太陽電池の製造においてのその使用
JP5633045B2 (ja) * 2012-05-25 2014-12-03 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
US20130319496A1 (en) * 2012-06-01 2013-12-05 Heraeus Precious Metals North America Conshohocken Llc Low-metal content electroconductive paste composition
CN102842353B (zh) * 2012-08-14 2015-05-13 廖晓峰 一种用于片式元件端电极的导电浆料
JP2014098186A (ja) * 2012-11-14 2014-05-29 Mitsui Mining & Smelting Co Ltd 銀粉
JP5510531B1 (ja) * 2012-11-29 2014-06-04 住友金属鉱山株式会社 銀粉及び銀ペースト
JP6404554B2 (ja) * 2013-10-03 2018-10-10 住友金属鉱山株式会社 銀粉の製造方法
CN103551589B (zh) * 2013-10-30 2015-07-29 江苏理工学院 花状银微米颗粒的合成方法
CN104148665B (zh) * 2014-07-22 2017-04-12 西北大学 一种结晶银粉的制备方法
JP6282616B2 (ja) * 2014-07-30 2018-02-21 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
JP6029719B2 (ja) * 2014-07-31 2016-11-24 Ｄｏｗａエレクトロニクス株式会社 銀粉及びその製造方法、並びに導電性ペースト
CN104096850B (zh) * 2014-08-12 2017-10-10 天津市职业大学 用对氨基苯酚还原银氨络合物制备超细球形银粉的方法
CN104646683B (zh) * 2015-02-28 2017-03-15 贵州大龙汇成新材料有限公司 一种粒度可控的球形银粉及其制备方法
KR20180047528A (ko) * 2016-10-31 2018-05-10 엘에스니꼬동제련 주식회사 은 분말 및 이의 제조방법
KR101927476B1 (ko) * 2016-10-31 2018-12-10 엘에스니꼬동제련 주식회사 은 분말 및 이의 제조방법
CN106623978A (zh) * 2016-12-29 2017-05-10 广东羚光新材料股份有限公司 一种大粒径球形银粉及其制备方法
CN107068241A (zh) * 2017-02-20 2017-08-18 江苏瑞德新能源科技有限公司 一种正银浆料及其制备方法
KR102122317B1 (ko) * 2017-10-31 2020-06-12 엘에스니꼬동제련 주식회사 은 분말의 제조방법 및 은 분말을 포함하는 도전성 페이스트
CN107812958A (zh) * 2017-11-01 2018-03-20 昆明理工大学 一种高分散性超细银粉的制备方法
KR20200038742A (ko) * 2018-10-04 2020-04-14 대주전자재료 주식회사 은 분말 및 이의 제조 방법
KR102178009B1 (ko) * 2018-11-30 2020-11-12 엘에스니꼬동제련 주식회사 수축률 조절이 가능한 은 분말의 제조방법
KR102308468B1 (ko) * 2018-12-28 2021-10-06 대주전자재료 주식회사 구형 은 분말 및 이의 제조방법
KR102263618B1 (ko) * 2019-03-29 2021-06-10 대주전자재료 주식회사 혼합 은 분말 및 이를 포함하는 도전성 페이스트
US11270872B2 (en) * 2019-09-25 2022-03-08 Western Digital Technologies, Inc. Base conducting layer beneath graphite layer of ceramic cathode for use with cathodic arc deposition
CN110947953A (zh) * 2019-12-19 2020-04-03 苏州银瑞光电材料科技有限公司 用于太阳能正面银浆的高烧结活性的球形银粉的制备方法
JP7093475B1 (ja) * 2021-03-26 2022-06-29 Ｄｏｗａエレクトロニクス株式会社 銀粉及びその製造方法
CN114367674B (zh) * 2022-03-22 2022-06-24 南通领跑者新材料科技有限公司 银粉的制备方法
CN115846678A (zh) * 2023-02-27 2023-03-28 东方电气集团科学技术研究院有限公司 一种超疏水高分散性银粉的制备方法
JP7670919B1 (ja) * 2023-10-27 2025-04-30 Ｄｏｗａエレクトロニクス株式会社 銀粉及び樹脂硬化型導電性ペースト
WO2025204308A1 (ja) * 2024-03-29 2025-10-02 Ｄｏｗａエレクトロニクス株式会社 酸化ガリウム被着銀粉、その製造方法および導電性ペースト

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5389122A (en) * 1993-07-13 1995-02-14 E. I. Du Pont De Nemours And Company Process for making finely divided, dense packing, spherical shaped silver particles
CN1227148A (zh) * 1999-01-19 1999-09-01 沈阳黎明发动机制造公司 高纯高分散性球形超细银粉及生产方法
CN1387968A (zh) * 2001-05-26 2003-01-01 西北稀有金属材料研究院 超细球形银粉的制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5389122A (en) * 1993-07-13 1995-02-14 E. I. Du Pont De Nemours And Company Process for making finely divided, dense packing, spherical shaped silver particles
CN1227148A (zh) * 1999-01-19 1999-09-01 沈阳黎明发动机制造公司 高纯高分散性球形超细银粉及生产方法
CN1387968A (zh) * 2001-05-26 2003-01-01 西北稀有金属材料研究院 超细球形银粉的制备方法

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
CN 1387968 A,全文.
JP特开2002-80901A 2002.03.22
JP特开平10-88207A 1998.04.07
同上.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103737011A (zh) * 2013-04-22 2014-04-23 昆山西微美晶电子新材料科技有限公司 高振实球形银粉的制备方法
CN103737011B (zh) * 2013-04-22 2016-02-24 昆山西微美晶电子新材料科技有限公司 高振实球形银粉的制备方法

Also Published As

Publication number Publication date
TW200603922A (en) 2006-02-01
KR20060046103A (ko) 2006-05-17
JP2005330529A (ja) 2005-12-02
CN1700360A (zh) 2005-11-23
US20050257643A1 (en) 2005-11-24

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Granted publication date: 20101006