JP2005243621A5 - - Google Patents

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Publication number
JP2005243621A5
JP2005243621A5 JP2005020078A JP2005020078A JP2005243621A5 JP 2005243621 A5 JP2005243621 A5 JP 2005243621A5 JP 2005020078 A JP2005020078 A JP 2005020078A JP 2005020078 A JP2005020078 A JP 2005020078A JP 2005243621 A5 JP2005243621 A5 JP 2005243621A5
Authority
JP
Japan
Prior art keywords
fuse
element layer
fuse element
low resistance
insulating layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005020078A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005243621A (ja
Filing date
Publication date
Priority claimed from US10/767,027 external-priority patent/US7436284B2/en
Application filed filed Critical
Publication of JP2005243621A publication Critical patent/JP2005243621A/ja
Publication of JP2005243621A5 publication Critical patent/JP2005243621A5/ja
Pending legal-status Critical Current

Links

JP2005020078A 2004-01-29 2005-01-27 低抵抗ポリマーマトリックスヒューズの装置および方法 Pending JP2005243621A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/767,027 US7436284B2 (en) 2002-01-10 2004-01-29 Low resistance polymer matrix fuse apparatus and method

Publications (2)

Publication Number Publication Date
JP2005243621A JP2005243621A (ja) 2005-09-08
JP2005243621A5 true JP2005243621A5 (enExample) 2008-03-13

Family

ID=34274907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005020078A Pending JP2005243621A (ja) 2004-01-29 2005-01-27 低抵抗ポリマーマトリックスヒューズの装置および方法

Country Status (9)

Country Link
US (1) US7436284B2 (enExample)
JP (1) JP2005243621A (enExample)
KR (1) KR20050077728A (enExample)
CN (1) CN1649065B (enExample)
DE (1) DE102004063035A1 (enExample)
FR (1) FR2869157A1 (enExample)
GB (1) GB2410627B8 (enExample)
IT (1) ITTO20050034A1 (enExample)
TW (1) TW200537539A (enExample)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7385475B2 (en) * 2002-01-10 2008-06-10 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method
DE10355282A1 (de) * 2003-11-18 2005-06-16 E.G.O. Elektro-Gerätebau GmbH Verfahren zur Herstellung einer Übertemperatursicherung und Übertemperatursicherung
DE102004033251B3 (de) * 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip
JP4716099B2 (ja) * 2005-09-30 2011-07-06 三菱マテリアル株式会社 チップ型ヒューズの製造方法
US20070075822A1 (en) * 2005-10-03 2007-04-05 Littlefuse, Inc. Fuse with cavity forming enclosure
US8368502B2 (en) * 2006-03-16 2013-02-05 Panasonic Corporation Surface-mount current fuse
KR100773324B1 (ko) * 2006-04-28 2007-11-05 단국대학교 산학협력단 블레이드형 퓨즈
JP2008311161A (ja) * 2007-06-18 2008-12-25 Sony Chemical & Information Device Corp 保護素子
US20090009281A1 (en) * 2007-07-06 2009-01-08 Cyntec Company Fuse element and manufacturing method thereof
US9190235B2 (en) * 2007-12-29 2015-11-17 Cooper Technologies Company Manufacturability of SMD and through-hole fuses using laser process
KR101043832B1 (ko) * 2008-03-11 2011-06-22 주식회사 하이닉스반도체 반도체 소자 및 그 제조 방법
JP4623161B2 (ja) 2008-08-07 2011-02-02 株式会社デンソー 液晶表示装置
DE102010002377A1 (de) * 2009-02-27 2010-11-18 Ceramtec Ag Elektrische Sicherung
US8203420B2 (en) * 2009-06-26 2012-06-19 Cooper Technologies Company Subminiature fuse with surface mount end caps and improved connectivity
TWI484520B (zh) * 2013-07-17 2015-05-11 Cyntec Co Ltd 保護元件及過電流及過電壓保護模組
JP5260592B2 (ja) * 2010-04-08 2013-08-14 デクセリアルズ株式会社 保護素子、バッテリ制御装置、及びバッテリパック
EP2408277B1 (de) * 2010-07-16 2016-02-17 Schurter AG Sicherungselement
US8421579B2 (en) * 2010-10-12 2013-04-16 Hung-Chih Chiu Current protection device
US9847203B2 (en) 2010-10-14 2017-12-19 Avx Corporation Low current fuse
US8971006B2 (en) 2011-02-04 2015-03-03 Denso Corporation Electronic control device including interrupt wire
US8780518B2 (en) 2011-02-04 2014-07-15 Denso Corporation Electronic control device including interrupt wire
JP2012164755A (ja) 2011-02-04 2012-08-30 Denso Corp 電子制御装置
JP5583042B2 (ja) 2011-02-04 2014-09-03 株式会社デンソー 電子制御装置
JP2012164756A (ja) * 2011-02-04 2012-08-30 Denso Corp 電子制御装置
DE102011113862A1 (de) * 2011-09-22 2013-03-28 Auto-Kabel Managementgesellschaft Mbh Elektrische Schmelzsicherung
EP2573790A1 (en) * 2011-09-26 2013-03-27 Siemens Aktiengesellschaft Fuse element
WO2013173594A1 (en) * 2012-05-16 2013-11-21 Littelfuse, Inc. Low-current fuse stamping method
EP2862192B1 (en) * 2012-06-13 2016-05-18 ABB Technology Ltd. Bypass switch assembly
TWI628688B (zh) * 2012-08-31 2018-07-01 太谷電子日本合同公司 保護元件、電氣裝置、2次電池單元及墊圈
JP5561382B2 (ja) * 2013-01-09 2014-07-30 株式会社デンソー 電子制御装置
JP5939311B2 (ja) * 2013-01-11 2016-06-22 株式会社村田製作所 ヒューズ
US9460882B2 (en) * 2013-03-14 2016-10-04 Littelfuse, Inc. Laminated electrical fuse
CA2967555A1 (en) * 2014-11-13 2016-05-19 Soc Corporation Chip fuse manufacturing method and chip fuse
JP6572971B2 (ja) 2015-04-22 2019-09-11 株式会社村田製作所 電子装置、及び電子装置の製造方法
JP2017073373A (ja) * 2015-10-09 2017-04-13 デクセリアルズ株式会社 ヒューズ素子
JP6452001B2 (ja) * 2016-06-08 2019-01-16 株式会社村田製作所 電子装置、及び電子装置の製造方法
JP6782122B2 (ja) * 2016-08-24 2020-11-11 デクセリアルズ株式会社 保護素子、回路モジュール及び保護素子の製造方法
DE102016220058A1 (de) * 2016-10-14 2018-04-19 Continental Automotive Gmbh Schaltungsanordnung mit einer Schmelzsicherung, Kraftfahrzeug und Verfahren zum Herstellen der Schaltungsanordnung
US11355298B2 (en) * 2018-11-21 2022-06-07 Littelfuse, Inc. Method of manufacturing an open-cavity fuse using a sacrificial member
WO2020135914A1 (de) 2018-12-27 2020-07-02 Schurter Ag Schmelzsicherung
JP7231527B2 (ja) * 2018-12-28 2023-03-01 ショット日本株式会社 保護素子用ヒューズ素子およびそれを利用した保護素子
US12048068B2 (en) * 2019-01-22 2024-07-23 Amogreentech Co., Ltd. Heating element having fuse function and heater unit comprising same
US11404372B2 (en) * 2019-05-02 2022-08-02 KYOCERA AVX Components Corporation Surface-mount thin-film fuse having compliant terminals
US20200373109A1 (en) * 2019-05-21 2020-11-26 Rosemount Aerospace, Inc. Fuse assembly and method of making
DE202019103963U1 (de) * 2019-07-18 2020-10-20 Tridonic Gmbh & Co Kg Leiterplatte mit Schutzelement
CN114144859B (zh) * 2019-09-13 2025-06-27 赤多尼科两合股份有限公司 印制导线保险装置
US11217415B2 (en) * 2019-09-25 2022-01-04 Littelfuse, Inc. High breaking capacity chip fuse
US10861665B1 (en) * 2019-10-04 2020-12-08 Rosemount Aerospace Inc. Inert environment fusible links
KR102450313B1 (ko) * 2020-09-23 2022-10-04 주식회사 유라코퍼레이션 연성 인쇄 회로 기판 및 그의 제조 방법
TWI731801B (zh) * 2020-10-12 2021-06-21 功得電子工業股份有限公司 保護元件及其製作方法
US11532452B2 (en) * 2021-03-25 2022-12-20 Littelfuse, Inc. Protection device with laser trimmed fusible element
JP7729689B2 (ja) 2021-10-28 2025-08-26 エルジー エナジー ソリューション リミテッド パターンヒューズ及びその製造方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4388603A (en) * 1981-05-15 1983-06-14 Mcgraw-Edison Company Current limiting fuse
JPS60103880A (ja) * 1983-11-11 1985-06-08 Matsushita Electric Ind Co Ltd ２進符号受信装置
US4612529A (en) * 1985-03-25 1986-09-16 Cooper Industries, Inc. Subminiature fuse
US4924203A (en) * 1987-03-24 1990-05-08 Cooper Industries, Inc. Wire bonded microfuse and method of making
US4814946A (en) * 1987-11-20 1989-03-21 Kemet Electronics Corporation Fuse assembly for solid electrolytic capacitor
NL8802872A (nl) 1988-11-21 1990-06-18 Littelfuse Tracor Smeltveiligheid.
US4988969A (en) * 1990-04-23 1991-01-29 Cooper Industries, Inc. Higher current carrying capacity 250V subminiature fuse
JPH04275018A (ja) 1991-02-27 1992-09-30 Mitsubishi Electric Corp 変電所事故区間検出装置
US5153553A (en) * 1991-11-08 1992-10-06 Illinois Tool Works, Inc. Fuse structure
US5166656A (en) * 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses
JPH0610388A (ja) 1992-06-25 1994-01-18 Matsushita Electric Ind Co Ltd 洗浄便座
JPH0636672A (ja) * 1992-07-16 1994-02-10 Sumitomo Wiring Syst Ltd カード型ヒューズおよびその製造方法
JPH06176680A (ja) * 1992-12-03 1994-06-24 Mitsubishi Materials Corp ヒューズ
JP2557019B2 (ja) * 1993-10-01 1996-11-27 エス・オー・シー株式会社 超小型チップヒューズおよびその製造方法
US5432378A (en) * 1993-12-15 1995-07-11 Cooper Industries, Inc. Subminiature surface mounted circuit protector
JPH07182600A (ja) 1993-12-22 1995-07-21 Nissan Motor Co Ltd 車両用距離検出装置
US5552757A (en) 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device
US5790008A (en) 1994-05-27 1998-08-04 Littlefuse, Inc. Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces
US5712610C1 (en) * 1994-08-19 2002-06-25 Sony Chemicals Corp Protective device
US5726621A (en) * 1994-09-12 1998-03-10 Cooper Industries, Inc. Ceramic chip fuses with multiple current carrying elements and a method for making the same
US5929741A (en) * 1994-11-30 1999-07-27 Hitachi Chemical Company, Ltd. Current protector
US5699032A (en) 1996-06-07 1997-12-16 Littelfuse, Inc. Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material
US5977860A (en) 1996-06-07 1999-11-02 Littelfuse, Inc. Surface-mount fuse and the manufacture thereof
JPH10162715A (ja) * 1996-11-28 1998-06-19 Kyocera Corp チップヒューズ
JPH10269927A (ja) * 1997-03-28 1998-10-09 Hitachi Chem Co Ltd チップフューズおよびその製造法
JPH10302605A (ja) * 1997-04-25 1998-11-13 Hitachi Chem Co Ltd チップフューズおよびその製造法
US5914649A (en) * 1997-03-28 1999-06-22 Hitachi Chemical Company, Ltd. Chip fuse and process for production thereof
JPH1196886A (ja) * 1997-09-16 1999-04-09 Matsuo Electric Co Ltd チップ形ヒューズ及びその製造方法
US5923239A (en) 1997-12-02 1999-07-13 Littelfuse, Inc. Printed circuit board assembly having an integrated fusible link
US5982268A (en) * 1998-03-31 1999-11-09 Uchihashi Estec Co., Ltd Thin type fuses
US6002322A (en) 1998-05-05 1999-12-14 Littelfuse, Inc. Chip protector surface-mounted fuse device
US6078245A (en) 1998-12-17 2000-06-20 Littelfuse, Inc. Containment of tin diffusion bar
JP2001052593A (ja) * 1999-08-09 2001-02-23 Daito Tsushinki Kk ヒューズおよびその製造方法
US20030048620A1 (en) 2000-03-14 2003-03-13 Kohshi Nishimura Printed-circuit board with fuse
US7570148B2 (en) 2002-01-10 2009-08-04 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method

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