JP2005243621A - 低抵抗ポリマーマトリックスヒューズの装置および方法 - Google Patents

低抵抗ポリマーマトリックスヒューズの装置および方法 Download PDF

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Publication number
JP2005243621A
JP2005243621A JP2005020078A JP2005020078A JP2005243621A JP 2005243621 A JP2005243621 A JP 2005243621A JP 2005020078 A JP2005020078 A JP 2005020078A JP 2005020078 A JP2005020078 A JP 2005020078A JP 2005243621 A JP2005243621 A JP 2005243621A
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JP
Japan
Prior art keywords
fuse
fuse element
element layer
layer
low resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005020078A
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English (en)
Japanese (ja)
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JP2005243621A5 (enExample
Inventor
Joan Leslie Winnett Bender
レスリー ウィネット ベンダー ジョーン
Daniel Minas Manoukian
ミナス マノーキアン ダニエル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cooper Technologies Co
Original Assignee
Cooper Technologies Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooper Technologies Co filed Critical Cooper Technologies Co
Publication of JP2005243621A publication Critical patent/JP2005243621A/ja
Publication of JP2005243621A5 publication Critical patent/JP2005243621A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H01H69/022—Manufacture of fuses of printed circuit fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0039—Means for influencing the rupture process of the fusible element
    • H01H85/0047—Heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H01H2085/0414—Surface mounted fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0039—Means for influencing the rupture process of the fusible element
    • H01H85/0047—Heating means
    • H01H85/006—Heat reflective or insulating layer on the casing or on the fuse support

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuses (AREA)
JP2005020078A 2004-01-29 2005-01-27 低抵抗ポリマーマトリックスヒューズの装置および方法 Pending JP2005243621A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/767,027 US7436284B2 (en) 2002-01-10 2004-01-29 Low resistance polymer matrix fuse apparatus and method

Publications (2)

Publication Number Publication Date
JP2005243621A true JP2005243621A (ja) 2005-09-08
JP2005243621A5 JP2005243621A5 (enExample) 2008-03-13

Family

ID=34274907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005020078A Pending JP2005243621A (ja) 2004-01-29 2005-01-27 低抵抗ポリマーマトリックスヒューズの装置および方法

Country Status (9)

Country Link
US (1) US7436284B2 (enExample)
JP (1) JP2005243621A (enExample)
KR (1) KR20050077728A (enExample)
CN (1) CN1649065B (enExample)
DE (1) DE102004063035A1 (enExample)
FR (1) FR2869157A1 (enExample)
GB (1) GB2410627B8 (enExample)
IT (1) ITTO20050034A1 (enExample)
TW (1) TW200537539A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007095592A (ja) * 2005-09-30 2007-04-12 Mitsubishi Materials Corp チップ型ヒューズ及びその製造方法
KR100773324B1 (ko) * 2006-04-28 2007-11-05 단국대학교 산학협력단 블레이드형 퓨즈
JP2009510708A (ja) * 2005-10-03 2009-03-12 リッテルフューズ，インコーポレイティド 筐体を形成するキャビティをもったヒューズ
JP2013069707A (ja) * 2013-01-09 2013-04-18 Denso Corp 電子制御装置
WO2016171225A1 (ja) * 2015-04-22 2016-10-27 株式会社村田製作所 電子装置、及び電子装置の製造方法
JP2017220564A (ja) * 2016-06-08 2017-12-14 株式会社村田製作所 電子装置、及び電子装置の製造方法
KR20220136321A (ko) * 2020-09-23 2022-10-07 주식회사 유라코퍼레이션 연성 인쇄 회로 기판 및 그의 제조 방법

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US7385475B2 (en) * 2002-01-10 2008-06-10 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method
DE10355282A1 (de) * 2003-11-18 2005-06-16 E.G.O. Elektro-Gerätebau GmbH Verfahren zur Herstellung einer Übertemperatursicherung und Übertemperatursicherung
DE102004033251B3 (de) * 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip
US8368502B2 (en) * 2006-03-16 2013-02-05 Panasonic Corporation Surface-mount current fuse
JP2008311161A (ja) * 2007-06-18 2008-12-25 Sony Chemical & Information Device Corp 保護素子
US20090009281A1 (en) * 2007-07-06 2009-01-08 Cyntec Company Fuse element and manufacturing method thereof
US9190235B2 (en) * 2007-12-29 2015-11-17 Cooper Technologies Company Manufacturability of SMD and through-hole fuses using laser process
KR101043832B1 (ko) * 2008-03-11 2011-06-22 주식회사 하이닉스반도체 반도체 소자 및 그 제조 방법
JP4623161B2 (ja) 2008-08-07 2011-02-02 株式会社デンソー 液晶表示装置
DE102010002377A1 (de) * 2009-02-27 2010-11-18 Ceramtec Ag Elektrische Sicherung
US8203420B2 (en) * 2009-06-26 2012-06-19 Cooper Technologies Company Subminiature fuse with surface mount end caps and improved connectivity
TWI484520B (zh) * 2013-07-17 2015-05-11 Cyntec Co Ltd 保護元件及過電流及過電壓保護模組
JP5260592B2 (ja) * 2010-04-08 2013-08-14 デクセリアルズ株式会社 保護素子、バッテリ制御装置、及びバッテリパック
EP2408277B1 (de) * 2010-07-16 2016-02-17 Schurter AG Sicherungselement
US8421579B2 (en) * 2010-10-12 2013-04-16 Hung-Chih Chiu Current protection device
US9847203B2 (en) 2010-10-14 2017-12-19 Avx Corporation Low current fuse
US8971006B2 (en) 2011-02-04 2015-03-03 Denso Corporation Electronic control device including interrupt wire
US8780518B2 (en) 2011-02-04 2014-07-15 Denso Corporation Electronic control device including interrupt wire
JP2012164755A (ja) 2011-02-04 2012-08-30 Denso Corp 電子制御装置
JP5583042B2 (ja) 2011-02-04 2014-09-03 株式会社デンソー 電子制御装置
JP2012164756A (ja) * 2011-02-04 2012-08-30 Denso Corp 電子制御装置
DE102011113862A1 (de) * 2011-09-22 2013-03-28 Auto-Kabel Managementgesellschaft Mbh Elektrische Schmelzsicherung
EP2573790A1 (en) * 2011-09-26 2013-03-27 Siemens Aktiengesellschaft Fuse element
WO2013173594A1 (en) * 2012-05-16 2013-11-21 Littelfuse, Inc. Low-current fuse stamping method
EP2862192B1 (en) * 2012-06-13 2016-05-18 ABB Technology Ltd. Bypass switch assembly
TWI628688B (zh) * 2012-08-31 2018-07-01 太谷電子日本合同公司 保護元件、電氣裝置、2次電池單元及墊圈
JP5939311B2 (ja) * 2013-01-11 2016-06-22 株式会社村田製作所 ヒューズ
US9460882B2 (en) * 2013-03-14 2016-10-04 Littelfuse, Inc. Laminated electrical fuse
CA2967555A1 (en) * 2014-11-13 2016-05-19 Soc Corporation Chip fuse manufacturing method and chip fuse
JP2017073373A (ja) * 2015-10-09 2017-04-13 デクセリアルズ株式会社 ヒューズ素子
JP6782122B2 (ja) * 2016-08-24 2020-11-11 デクセリアルズ株式会社 保護素子、回路モジュール及び保護素子の製造方法
DE102016220058A1 (de) * 2016-10-14 2018-04-19 Continental Automotive Gmbh Schaltungsanordnung mit einer Schmelzsicherung, Kraftfahrzeug und Verfahren zum Herstellen der Schaltungsanordnung
US11355298B2 (en) * 2018-11-21 2022-06-07 Littelfuse, Inc. Method of manufacturing an open-cavity fuse using a sacrificial member
WO2020135914A1 (de) 2018-12-27 2020-07-02 Schurter Ag Schmelzsicherung
JP7231527B2 (ja) * 2018-12-28 2023-03-01 ショット日本株式会社 保護素子用ヒューズ素子およびそれを利用した保護素子
US12048068B2 (en) * 2019-01-22 2024-07-23 Amogreentech Co., Ltd. Heating element having fuse function and heater unit comprising same
US11404372B2 (en) * 2019-05-02 2022-08-02 KYOCERA AVX Components Corporation Surface-mount thin-film fuse having compliant terminals
US20200373109A1 (en) * 2019-05-21 2020-11-26 Rosemount Aerospace, Inc. Fuse assembly and method of making
DE202019103963U1 (de) * 2019-07-18 2020-10-20 Tridonic Gmbh & Co Kg Leiterplatte mit Schutzelement
CN114144859B (zh) * 2019-09-13 2025-06-27 赤多尼科两合股份有限公司 印制导线保险装置
US11217415B2 (en) * 2019-09-25 2022-01-04 Littelfuse, Inc. High breaking capacity chip fuse
US10861665B1 (en) * 2019-10-04 2020-12-08 Rosemount Aerospace Inc. Inert environment fusible links
TWI731801B (zh) * 2020-10-12 2021-06-21 功得電子工業股份有限公司 保護元件及其製作方法
US11532452B2 (en) * 2021-03-25 2022-12-20 Littelfuse, Inc. Protection device with laser trimmed fusible element
JP7729689B2 (ja) 2021-10-28 2025-08-26 エルジー エナジー ソリューション リミテッド パターンヒューズ及びその製造方法

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JPH0636672A (ja) * 1992-07-16 1994-02-10 Sumitomo Wiring Syst Ltd カード型ヒューズおよびその製造方法
JPH06176680A (ja) * 1992-12-03 1994-06-24 Mitsubishi Materials Corp ヒューズ
JPH10162715A (ja) * 1996-11-28 1998-06-19 Kyocera Corp チップヒューズ
JPH10269927A (ja) * 1997-03-28 1998-10-09 Hitachi Chem Co Ltd チップフューズおよびその製造法
JPH10302605A (ja) * 1997-04-25 1998-11-13 Hitachi Chem Co Ltd チップフューズおよびその製造法
JPH1196886A (ja) * 1997-09-16 1999-04-09 Matsuo Electric Co Ltd チップ形ヒューズ及びその製造方法
JP2001052593A (ja) * 1999-08-09 2001-02-23 Daito Tsushinki Kk ヒューズおよびその製造方法
JP2003263949A (ja) * 2002-01-10 2003-09-19 Cooper Technol Co 低抵抗ポリマーマトリクスヒューズ装置および方法

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Publication number Priority date Publication date Assignee Title
JPH0636672A (ja) * 1992-07-16 1994-02-10 Sumitomo Wiring Syst Ltd カード型ヒューズおよびその製造方法
JPH06176680A (ja) * 1992-12-03 1994-06-24 Mitsubishi Materials Corp ヒューズ
JPH10162715A (ja) * 1996-11-28 1998-06-19 Kyocera Corp チップヒューズ
JPH10269927A (ja) * 1997-03-28 1998-10-09 Hitachi Chem Co Ltd チップフューズおよびその製造法
JPH10302605A (ja) * 1997-04-25 1998-11-13 Hitachi Chem Co Ltd チップフューズおよびその製造法
JPH1196886A (ja) * 1997-09-16 1999-04-09 Matsuo Electric Co Ltd チップ形ヒューズ及びその製造方法
JP2001052593A (ja) * 1999-08-09 2001-02-23 Daito Tsushinki Kk ヒューズおよびその製造方法
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007095592A (ja) * 2005-09-30 2007-04-12 Mitsubishi Materials Corp チップ型ヒューズ及びその製造方法
JP2009510708A (ja) * 2005-10-03 2009-03-12 リッテルフューズ，インコーポレイティド 筐体を形成するキャビティをもったヒューズ
KR100773324B1 (ko) * 2006-04-28 2007-11-05 단국대학교 산학협력단 블레이드형 퓨즈
JP2013069707A (ja) * 2013-01-09 2013-04-18 Denso Corp 電子制御装置
WO2016171225A1 (ja) * 2015-04-22 2016-10-27 株式会社村田製作所 電子装置、及び電子装置の製造方法
KR20170128504A (ko) * 2015-04-22 2017-11-22 가부시키가이샤 무라타 세이사쿠쇼 전자 장치 및 전자 장치의 제조 방법
JPWO2016171225A1 (ja) * 2015-04-22 2018-02-08 株式会社村田製作所 電子装置、及び電子装置の製造方法
US10340682B2 (en) 2015-04-22 2019-07-02 Murata Manufacturing Co., Ltd. Electronic device and method of manufacturing the same
KR102043406B1 (ko) * 2015-04-22 2019-12-02 가부시키가이샤 무라타 세이사쿠쇼 전자 장치 및 전자 장치의 제조 방법
JP2017220564A (ja) * 2016-06-08 2017-12-14 株式会社村田製作所 電子装置、及び電子装置の製造方法
KR20220136321A (ko) * 2020-09-23 2022-10-07 주식회사 유라코퍼레이션 연성 인쇄 회로 기판 및 그의 제조 방법
KR102620302B1 (ko) 2020-09-23 2023-12-29 주식회사 유라코퍼레이션 연성 인쇄 회로 기판 및 그의 제조 방법

Also Published As

Publication number Publication date
FR2869157A1 (fr) 2005-10-21
GB2410627A (en) 2005-08-03
GB2410627A8 (en) 2008-10-01
GB2410627B (en) 2007-12-27
CN1649065A (zh) 2005-08-03
TW200537539A (en) 2005-11-16
US20040184211A1 (en) 2004-09-23
DE102004063035A1 (de) 2005-08-18
CN1649065B (zh) 2010-10-27
US7436284B2 (en) 2008-10-14
GB0501603D0 (en) 2005-03-02
KR20050077728A (ko) 2005-08-03
HK1075130A1 (en) 2005-12-02
GB2410627B8 (en) 2008-10-01
ITTO20050034A1 (it) 2005-07-30

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