JP2004530300A5 - - Google Patents
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- Publication number
- JP2004530300A5 JP2004530300A5 JP2002586384A JP2002586384A JP2004530300A5 JP 2004530300 A5 JP2004530300 A5 JP 2004530300A5 JP 2002586384 A JP2002586384 A JP 2002586384A JP 2002586384 A JP2002586384 A JP 2002586384A JP 2004530300 A5 JP2004530300 A5 JP 2004530300A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating
- layer
- forming
- gate
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 51
- 238000000034 method Methods 0.000 claims 42
- 239000000758 substrate Substances 0.000 claims 28
- 239000004065 semiconductor Substances 0.000 claims 12
- 238000005530 etching Methods 0.000 claims 10
- 239000011810 insulating material Substances 0.000 claims 10
- 125000006850 spacer group Chemical group 0.000 claims 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 6
- 229920005591 polysilicon Polymers 0.000 claims 6
- 229910052710 silicon Inorganic materials 0.000 claims 6
- 239000010703 silicon Substances 0.000 claims 6
- 239000000463 material Substances 0.000 claims 5
- 238000005498 polishing Methods 0.000 claims 4
- 229910021332 silicide Inorganic materials 0.000 claims 4
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims 4
- 239000003990 capacitor Substances 0.000 claims 3
- 238000002955 isolation Methods 0.000 claims 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 2
- 238000001020 plasma etching Methods 0.000 claims 2
- 239000011241 protective layer Substances 0.000 claims 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims 2
- 238000007373 indentation Methods 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/842,788 | 2001-04-27 | ||
| US09/842,788 US6498062B2 (en) | 2001-04-27 | 2001-04-27 | DRAM access transistor |
| PCT/US2002/013196 WO2002089182A2 (en) | 2001-04-27 | 2002-04-26 | Recessed gat dram transistor and method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009211925A Division JP5361626B2 (ja) | 2001-04-27 | 2009-09-14 | 窪み付きゲート構造を有するメモリデバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004530300A JP2004530300A (ja) | 2004-09-30 |
| JP2004530300A5 true JP2004530300A5 (enExample) | 2006-01-05 |
| JP4907838B2 JP4907838B2 (ja) | 2012-04-04 |
Family
ID=25288239
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002586384A Expired - Fee Related JP4907838B2 (ja) | 2001-04-27 | 2002-04-26 | 窪み付きゲート構造を有するメモリデバイス |
| JP2009211925A Expired - Lifetime JP5361626B2 (ja) | 2001-04-27 | 2009-09-14 | 窪み付きゲート構造を有するメモリデバイスの製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009211925A Expired - Lifetime JP5361626B2 (ja) | 2001-04-27 | 2009-09-14 | 窪み付きゲート構造を有するメモリデバイスの製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6498062B2 (enExample) |
| EP (1) | EP1382059A2 (enExample) |
| JP (2) | JP4907838B2 (enExample) |
| KR (1) | KR100547227B1 (enExample) |
| CN (1) | CN100375271C (enExample) |
| AU (1) | AU2002303494A1 (enExample) |
| WO (1) | WO2002089182A2 (enExample) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5977579A (en) * | 1998-12-03 | 1999-11-02 | Micron Technology, Inc. | Trench dram cell with vertical device and buried word lines |
| US7071043B2 (en) * | 2002-08-15 | 2006-07-04 | Micron Technology, Inc. | Methods of forming a field effect transistor having source/drain material over insulative material |
| KR100498476B1 (ko) * | 2003-01-11 | 2005-07-01 | 삼성전자주식회사 | 리세스 채널 mosfet 및 그 제조방법 |
| US7183600B2 (en) * | 2003-06-03 | 2007-02-27 | Samsung Electronics Co., Ltd. | Semiconductor device with trench gate type transistor and method of manufacturing the same |
| US6930030B2 (en) | 2003-06-03 | 2005-08-16 | International Business Machines Corporation | Method of forming an electronic device on a recess in the surface of a thin film of silicon etched to a precise thickness |
| KR100511045B1 (ko) * | 2003-07-14 | 2005-08-30 | 삼성전자주식회사 | 리세스된 게이트 전극을 갖는 반도체 소자의 집적방법 |
| US7012024B2 (en) * | 2003-08-15 | 2006-03-14 | Micron Technology, Inc. | Methods of forming a transistor with an integrated metal silicide gate electrode |
| US6844591B1 (en) * | 2003-09-17 | 2005-01-18 | Micron Technology, Inc. | Method of forming DRAM access transistors |
| KR100500472B1 (ko) * | 2003-10-13 | 2005-07-12 | 삼성전자주식회사 | 리세스 게이트 트랜지스터 구조 및 형성방법 |
| US7262089B2 (en) * | 2004-03-11 | 2007-08-28 | Micron Technology, Inc. | Methods of forming semiconductor structures |
| US7518182B2 (en) | 2004-07-20 | 2009-04-14 | Micron Technology, Inc. | DRAM layout with vertical FETs and method of formation |
| US7122425B2 (en) * | 2004-08-24 | 2006-10-17 | Micron Technology, Inc. | Methods of forming semiconductor constructions |
| US7547945B2 (en) * | 2004-09-01 | 2009-06-16 | Micron Technology, Inc. | Transistor devices, transistor structures and semiconductor constructions |
| JP2006173429A (ja) * | 2004-12-17 | 2006-06-29 | Elpida Memory Inc | 半導体装置の製造方法 |
| US7244659B2 (en) * | 2005-03-10 | 2007-07-17 | Micron Technology, Inc. | Integrated circuits and methods of forming a field effect transistor |
| US7384849B2 (en) | 2005-03-25 | 2008-06-10 | Micron Technology, Inc. | Methods of forming recessed access devices associated with semiconductor constructions |
| KR100663359B1 (ko) * | 2005-03-31 | 2007-01-02 | 삼성전자주식회사 | 리세스 채널 트랜지스터 구조를 갖는 단일 트랜지스터플로팅 바디 디램 셀 및 그 제조방법 |
| US7120046B1 (en) | 2005-05-13 | 2006-10-10 | Micron Technology, Inc. | Memory array with surrounding gate access transistors and capacitors with global and staggered local bit lines |
| US7371627B1 (en) | 2005-05-13 | 2008-05-13 | Micron Technology, Inc. | Memory array with ultra-thin etched pillar surround gate access transistors and buried data/bit lines |
| JP2006339476A (ja) * | 2005-06-03 | 2006-12-14 | Elpida Memory Inc | 半導体装置及びその製造方法 |
| US8338887B2 (en) | 2005-07-06 | 2012-12-25 | Infineon Technologies Ag | Buried gate transistor |
| US7888721B2 (en) | 2005-07-06 | 2011-02-15 | Micron Technology, Inc. | Surround gate access transistors with grown ultra-thin bodies |
| US7282401B2 (en) | 2005-07-08 | 2007-10-16 | Micron Technology, Inc. | Method and apparatus for a self-aligned recessed access device (RAD) transistor gate |
| US7768051B2 (en) | 2005-07-25 | 2010-08-03 | Micron Technology, Inc. | DRAM including a vertical surround gate transistor |
| US7488647B1 (en) * | 2005-08-11 | 2009-02-10 | National Semiconductor Corporation | System and method for providing a poly cap and a no field oxide area to prevent formation of a vertical bird's beak structure in the manufacture of a semiconductor device |
| US7867851B2 (en) * | 2005-08-30 | 2011-01-11 | Micron Technology, Inc. | Methods of forming field effect transistors on substrates |
| US7696567B2 (en) | 2005-08-31 | 2010-04-13 | Micron Technology, Inc | Semiconductor memory device |
| US7867845B2 (en) * | 2005-09-01 | 2011-01-11 | Micron Technology, Inc. | Transistor gate forming methods and transistor structures |
| US7687342B2 (en) | 2005-09-01 | 2010-03-30 | Micron Technology, Inc. | Method of manufacturing a memory device |
| US7416943B2 (en) | 2005-09-01 | 2008-08-26 | Micron Technology, Inc. | Peripheral gate stacks and recessed array gates |
| US7557032B2 (en) | 2005-09-01 | 2009-07-07 | Micron Technology, Inc. | Silicided recessed silicon |
| KR100721245B1 (ko) * | 2005-12-29 | 2007-05-22 | 동부일렉트로닉스 주식회사 | 트랜지스터 소자 및 형성 방법 |
| US7700441B2 (en) | 2006-02-02 | 2010-04-20 | Micron Technology, Inc. | Methods of forming field effect transistors, methods of forming field effect transistor gates, methods of forming integrated circuitry comprising a transistor gate array and circuitry peripheral to the gate array, and methods of forming integrated circuitry comprising a transistor gate array including first gates and second grounded isolation gates |
| KR100764439B1 (ko) * | 2006-04-25 | 2007-10-05 | 주식회사 하이닉스반도체 | 반도체 소자의 형성 방법 |
| US8008144B2 (en) | 2006-05-11 | 2011-08-30 | Micron Technology, Inc. | Dual work function recessed access device and methods of forming |
| US8860174B2 (en) * | 2006-05-11 | 2014-10-14 | Micron Technology, Inc. | Recessed antifuse structures and methods of making the same |
| US20070262395A1 (en) | 2006-05-11 | 2007-11-15 | Gibbons Jasper S | Memory cell access devices and methods of making the same |
| US7602001B2 (en) | 2006-07-17 | 2009-10-13 | Micron Technology, Inc. | Capacitorless one transistor DRAM cell, integrated circuitry comprising an array of capacitorless one transistor DRAM cells, and method of forming lines of capacitorless one transistor DRAM cells |
| US7772632B2 (en) * | 2006-08-21 | 2010-08-10 | Micron Technology, Inc. | Memory arrays and methods of fabricating memory arrays |
| US7589995B2 (en) | 2006-09-07 | 2009-09-15 | Micron Technology, Inc. | One-transistor memory cell with bias gate |
| US8089113B2 (en) * | 2006-12-05 | 2012-01-03 | Spansion Llc | Damascene metal-insulator-metal (MIM) device |
| US20080205023A1 (en) | 2007-02-27 | 2008-08-28 | International Business Machines Corporation | Electronic components on trenched substrates and method of forming same |
| US7768047B2 (en) * | 2007-05-10 | 2010-08-03 | Micron Technology, Inc. | Imager element, device and system with recessed transfer gate |
| KR100900232B1 (ko) * | 2007-05-22 | 2009-05-29 | 주식회사 하이닉스반도체 | 반도체 소자 및 그의 제조방법 |
| US7923373B2 (en) | 2007-06-04 | 2011-04-12 | Micron Technology, Inc. | Pitch multiplication using self-assembling materials |
| TWI346364B (en) * | 2007-08-14 | 2011-08-01 | Nanya Technology Corp | Method for fabricating line type recess channel mos transistor device |
| US7824986B2 (en) | 2008-11-05 | 2010-11-02 | Micron Technology, Inc. | Methods of forming a plurality of transistor gates, and methods of forming a plurality of transistor gates having at least two different work functions |
| KR101159900B1 (ko) * | 2009-04-22 | 2012-06-25 | 에스케이하이닉스 주식회사 | 반도체 소자 및 그 제조방법 |
| JP5434360B2 (ja) * | 2009-08-20 | 2014-03-05 | ソニー株式会社 | 半導体装置及びその製造方法 |
| US9401363B2 (en) | 2011-08-23 | 2016-07-26 | Micron Technology, Inc. | Vertical transistor devices, memory arrays, and methods of forming vertical transistor devices |
| CN108538839B (zh) | 2017-03-01 | 2019-08-23 | 联华电子股份有限公司 | 半导体结构、用于存储器元件的半导体结构及其制作方法 |
| KR102396583B1 (ko) | 2017-11-09 | 2022-05-11 | 삼성전자주식회사 | 메모리 소자 및 이의 제조방법 |
| CN110707086B (zh) | 2018-10-09 | 2022-02-18 | 联华电子股份有限公司 | 半导体元件 |
| CN113764504B (zh) * | 2020-06-03 | 2025-05-02 | 中芯北方集成电路制造(北京)有限公司 | 半导体结构及其形成方法 |
| KR20230139545A (ko) * | 2022-03-28 | 2023-10-05 | 삼성전자주식회사 | 반도체 소자 및 이를 포함하는 반도체 메모리 셀 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4651184A (en) * | 1984-08-31 | 1987-03-17 | Texas Instruments Incorporated | Dram cell and array |
| US4785337A (en) * | 1986-10-17 | 1988-11-15 | International Business Machines Corporation | Dynamic ram cell having shared trench storage capacitor with sidewall-defined bridge contacts and gate electrodes |
| US5283201A (en) | 1988-05-17 | 1994-02-01 | Advanced Power Technology, Inc. | High density power device fabrication process |
| US5346834A (en) | 1988-11-21 | 1994-09-13 | Hitachi, Ltd. | Method for manufacturing a semiconductor device and a semiconductor memory device |
| US4989055A (en) * | 1989-06-15 | 1991-01-29 | Texas Instruments Incorporated | Dynamic random access memory cell |
| US5276344A (en) | 1990-04-27 | 1994-01-04 | Mitsubishi Denki Kabushiki Kaisha | Field effect transistor having impurity regions of different depths and manufacturing method thereof |
| JPH04328860A (ja) * | 1991-04-30 | 1992-11-17 | Hitachi Ltd | 半導体集積回路装置及びその製造方法 |
| US5666002A (en) * | 1993-06-22 | 1997-09-09 | Kabushiki Kaisha Toshiba | Semiconductor device with wiring layer in tunnel in semiconductor substrate |
| JPH07106435A (ja) * | 1993-10-08 | 1995-04-21 | Hitachi Ltd | 半導体記憶装置及びその製造方法 |
| JP2658870B2 (ja) * | 1994-04-22 | 1997-09-30 | 日本電気株式会社 | 半導体記憶装置およびその製造方法 |
| US5429970A (en) | 1994-07-18 | 1995-07-04 | United Microelectronics Corporation | Method of making flash EEPROM memory cell |
| US5576227A (en) | 1994-11-02 | 1996-11-19 | United Microelectronics Corp. | Process for fabricating a recessed gate MOS device |
| DE19519159C2 (de) * | 1995-05-24 | 1998-07-09 | Siemens Ag | DRAM-Zellenanordnung und Verfahren zu deren Herstellung |
| EP0744722B1 (en) | 1995-05-24 | 2001-07-18 | Innovative Sputtering Technology N.V. (I.S.T.) | Magnetic antipilferage tag |
| US6054355A (en) * | 1997-06-30 | 2000-04-25 | Kabushiki Kaisha Toshiba | Method of manufacturing a semiconductor device which includes forming a dummy gate |
| US6236079B1 (en) * | 1997-12-02 | 2001-05-22 | Kabushiki Kaisha Toshiba | Dynamic semiconductor memory device having a trench capacitor |
| DE19805712A1 (de) * | 1998-02-12 | 1999-08-26 | Siemens Ag | Speicherzellenanordnung und entsprechendes Herstellungsverfahren |
| US5945707A (en) * | 1998-04-07 | 1999-08-31 | International Business Machines Corporation | DRAM cell with grooved transfer device |
| EP1003219B1 (en) * | 1998-11-19 | 2011-12-28 | Qimonda AG | DRAM with stacked capacitor and buried word line |
| JP3821611B2 (ja) * | 1999-06-22 | 2006-09-13 | シャープ株式会社 | 半導体装置の製造方法 |
| DE19928781C1 (de) * | 1999-06-23 | 2000-07-06 | Siemens Ag | DRAM-Zellenanordnung und Verfahren zu deren Herstellung |
| US6087235A (en) | 1999-10-14 | 2000-07-11 | Advanced Micro Devices, Inc. | Method for effective fabrication of a field effect transistor with elevated drain and source contact structures |
-
2001
- 2001-04-27 US US09/842,788 patent/US6498062B2/en not_active Expired - Lifetime
-
2002
- 2002-04-26 CN CNB028129016A patent/CN100375271C/zh not_active Expired - Lifetime
- 2002-04-26 EP EP02731519A patent/EP1382059A2/en not_active Ceased
- 2002-04-26 AU AU2002303494A patent/AU2002303494A1/en not_active Abandoned
- 2002-04-26 WO PCT/US2002/013196 patent/WO2002089182A2/en not_active Ceased
- 2002-04-26 KR KR1020037014077A patent/KR100547227B1/ko not_active Expired - Lifetime
- 2002-04-26 JP JP2002586384A patent/JP4907838B2/ja not_active Expired - Fee Related
- 2002-10-15 US US10/270,150 patent/US6780732B2/en not_active Expired - Lifetime
-
2009
- 2009-09-14 JP JP2009211925A patent/JP5361626B2/ja not_active Expired - Lifetime
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