JP2004528700A5 - - Google Patents

Download PDF

Info

Publication number
JP2004528700A5
JP2004528700A5 JP2001567026A JP2001567026A JP2004528700A5 JP 2004528700 A5 JP2004528700 A5 JP 2004528700A5 JP 2001567026 A JP2001567026 A JP 2001567026A JP 2001567026 A JP2001567026 A JP 2001567026A JP 2004528700 A5 JP2004528700 A5 JP 2004528700A5
Authority
JP
Japan
Prior art keywords
semiconductor material
barrier layer
reactor
passivation barrier
passivation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001567026A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004528700A (ja
JP5314233B2 (ja
Filing date
Publication date
Priority claimed from US09/644,875 external-priority patent/US6498111B1/en
Application filed filed Critical
Priority claimed from PCT/US2001/007976 external-priority patent/WO2001069659A2/en
Publication of JP2004528700A publication Critical patent/JP2004528700A/ja
Publication of JP2004528700A5 publication Critical patent/JP2004528700A5/ja
Application granted granted Critical
Publication of JP5314233B2 publication Critical patent/JP5314233B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2001567026A 2000-03-14 2001-03-13 制御された導電率を有する半導体材料および半導体デバイスの製造方法 Expired - Lifetime JP5314233B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US18963000P 2000-03-14 2000-03-14
US60/189,630 2000-03-14
US09/644,875 US6498111B1 (en) 2000-08-23 2000-08-23 Fabrication of semiconductor materials and devices with controlled electrical conductivity
US09/644,875 2000-08-23
PCT/US2001/007976 WO2001069659A2 (en) 2000-03-14 2001-03-13 Fabrication of semiconductor materials and devices with controlled electrical conductivity

Publications (3)

Publication Number Publication Date
JP2004528700A JP2004528700A (ja) 2004-09-16
JP2004528700A5 true JP2004528700A5 (https=) 2005-01-20
JP5314233B2 JP5314233B2 (ja) 2013-10-16

Family

ID=26885351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001567026A Expired - Lifetime JP5314233B2 (ja) 2000-03-14 2001-03-13 制御された導電率を有する半導体材料および半導体デバイスの製造方法

Country Status (9)

Country Link
EP (1) EP1269520A2 (https=)
JP (1) JP5314233B2 (https=)
KR (1) KR100923937B1 (https=)
CN (1) CN100559619C (https=)
AU (1) AU2001243606A1 (https=)
CA (1) CA2402662C (https=)
MY (1) MY126104A (https=)
TW (1) TWI238541B (https=)
WO (1) WO2001069659A2 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1022021C2 (nl) * 2002-11-28 2004-06-02 Univ Eindhoven Tech Werkwijze ter vorming van vacatures in een III-V-halfgeleider, een op GaN gebaseerde structuur, en de toepassing hiervan.
KR101008285B1 (ko) 2005-10-28 2011-01-13 주식회사 에피밸리 3족 질화물 반도체 발광소자
KR100742988B1 (ko) * 2005-11-25 2007-07-26 (주)더리즈 p형 질화갈륨계 디바이스 제조방법
JP2009130316A (ja) * 2007-11-28 2009-06-11 Panasonic Corp 窒化物半導体装置およびその製造方法
KR100941877B1 (ko) * 2008-04-25 2010-02-11 김화민 패시배이션 조성물과 이를 이용한 스퍼터링 타겟과패시배이션막 및 그 제조방법
FR3026558B1 (fr) * 2014-09-26 2018-03-09 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede d'activation de dopants dans une couche semi-conductrice a base de gan
CN104377547B (zh) * 2014-11-19 2017-07-21 北京工业大学 一种GaN基HEMT和LD单片集成的直接调制半导体激光器结构及其生长过程
TWI548000B (zh) * 2014-12-22 2016-09-01 力晶科技股份有限公司 半導體元件及其製作方法
CN109285774B (zh) * 2018-09-12 2023-03-24 江苏能华微电子科技发展有限公司 一种基于氮化镓的结势垒肖特基二极管及其形成方法
CN115606010B (zh) 2020-06-11 2025-07-15 苏州晶湛半导体有限公司 半导体结构及其制作方法
JPWO2025203491A1 (https=) * 2024-03-28 2025-10-02

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653550A (ja) * 1992-07-31 1994-02-25 Toshiba Corp 多波長光半導体整列素子
JP3244980B2 (ja) * 1995-01-06 2002-01-07 株式会社東芝 半導体素子の製造方法
JP3325713B2 (ja) * 1994-08-22 2002-09-17 ローム株式会社 半導体発光素子の製法
JP2872096B2 (ja) * 1996-01-19 1999-03-17 日本電気株式会社 低抵抗p型窒化ガリウム系化合物半導体の気相成長方法
JP3361964B2 (ja) * 1996-09-10 2003-01-07 株式会社東芝 半導体発光素子およびその製造方法
US5930656A (en) * 1996-10-21 1999-07-27 Kabushiki Kaisha Toshiba Method of fabricating a compound semiconductor device
JP3326371B2 (ja) * 1996-10-21 2002-09-24 東芝電子エンジニアリング株式会社 化合物半導体装置の製造方法
JP3463524B2 (ja) * 1997-08-04 2003-11-05 松下電器産業株式会社 窒化ガリウム系化合物半導体薄膜の製造方法
US5926726A (en) * 1997-09-12 1999-07-20 Sdl, Inc. In-situ acceptor activation in group III-v nitride compound semiconductors
JP3509514B2 (ja) * 1997-11-13 2004-03-22 豊田合成株式会社 窒化ガリウム系化合物半導体の製造方法
JP3653384B2 (ja) * 1998-02-10 2005-05-25 シャープ株式会社 発光ダイオードの製造方法
JP2000058462A (ja) * 1998-08-13 2000-02-25 Sony Corp 窒化物系iii−v族化合物半導体の製造方法
JP3987985B2 (ja) * 1999-04-30 2007-10-10 サンケン電気株式会社 半導体装置の製造方法
JP3833848B2 (ja) * 1999-05-10 2006-10-18 パイオニア株式会社 3族窒化物半導体素子製造方法
JP4162385B2 (ja) * 2000-03-02 2008-10-08 株式会社リコー p型III族窒化物半導体の製造方法

Similar Documents

Publication Publication Date Title
CN113795609A (zh) 非金属表面上的选择性沉积
JP2011146711A5 (https=)
WO2009118514A1 (en) Method of depositing an amorphus aluminium oxynitride layer by reactive sputtering of an aluminium target in a nitrogen / oxygen atmosphere
JPH08232079A (ja) 新規なタングステン溶着プロセス
JPH08316321A (ja) 半導体装置の拡散障壁膜の形成方法
JP2004528700A5 (https=)
JP2005537660A5 (https=)
TW201144474A (en) A method for producing a deposit and a deposit on a surface of a silicon substrate
JPH04257227A (ja) 配線形成方法
US11769666B2 (en) Selective deposition of silicon using deposition-treat-etch process
CN101136328B (zh) 半导体器件的栅极及其形成方法
CA2402662A1 (en) Fabrication of semiconductor materials and devices with controlled electrical conductivity
TWI868426B (zh) 選擇性沉積的表面處理
US6224942B1 (en) Method of forming an aluminum comprising line having a titanium nitride comprising layer thereon
CN110729409B (zh) 一种有机光电器件封装薄膜及其制备方法
JP3194256B2 (ja) 膜成長方法と膜成長装置
JP4529424B2 (ja) 熱処理用治具の表面保護膜形成方法及び熱処理用治具
US6530997B1 (en) Use of gaseous silicon hydrides as a reducing agent to remove re-sputtered silicon oxide
JP2763101B2 (ja) 薄膜形成方法
TWI683919B (zh) Cu膜之形成方法
KR100585011B1 (ko) 반도체 소자의 게이트전극 형성 방법
KR100728942B1 (ko) 오믹콘택층 형성방법
CN114864662A (zh) 基于TiN/TaN模板的肖特基结构及其制备方法和应用
Kumar et al. X-ray photoelectron spectroscopy characteristics of the W/TiN/Si and W/TiN/SiO2/Si structures
JP2008182001A (ja) 半導体装置の製造方法