JP2004359957A5 - - Google Patents
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- JP2004359957A5 JP2004359957A5 JP2004166441A JP2004166441A JP2004359957A5 JP 2004359957 A5 JP2004359957 A5 JP 2004359957A5 JP 2004166441 A JP2004166441 A JP 2004166441A JP 2004166441 A JP2004166441 A JP 2004166441A JP 2004359957 A5 JP2004359957 A5 JP 2004359957A5
- Authority
- JP
- Japan
- Prior art keywords
- corona
- resistant
- dianhydride
- bis
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000203 mixture Substances 0.000 claims description 43
- 239000000945 filler Substances 0.000 claims description 33
- 239000002131 composite material Substances 0.000 claims description 26
- 229920000642 polymer Polymers 0.000 claims description 13
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 239000004642 Polyimide Substances 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 150000004985 diamines Chemical class 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- BWAPJIHJXDYDPW-UHFFFAOYSA-N 2,5-dimethyl-p-phenylenediamine Chemical compound CC1=CC(N)=C(C)C=C1N BWAPJIHJXDYDPW-UHFFFAOYSA-N 0.000 claims description 5
- MQAHXEQUBNDFGI-UHFFFAOYSA-N 5-[4-[2-[4-[(1,3-dioxo-2-benzofuran-5-yl)oxy]phenyl]propan-2-yl]phenoxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC2=CC=C(C=C2)C(C)(C=2C=CC(OC=3C=C4C(=O)OC(=O)C4=CC=3)=CC=2)C)=C1 MQAHXEQUBNDFGI-UHFFFAOYSA-N 0.000 claims description 5
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 claims description 4
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 4
- 150000003949 imides Chemical class 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920006149 polyester-amide block copolymer Polymers 0.000 claims description 4
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 claims description 3
- 239000004695 Polyether sulfone Substances 0.000 claims description 3
- 239000004954 Polyphthalamide Substances 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 3
- 229920006393 polyether sulfone Polymers 0.000 claims description 3
- 229920006375 polyphtalamide Polymers 0.000 claims description 3
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 claims description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 claims description 2
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 claims description 2
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 claims description 2
- BZXJAHGHOJFYRT-UHFFFAOYSA-N 3-[2-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C(=CC=CC=2)OC=2C=C(N)C=CC=2)=C1 BZXJAHGHOJFYRT-UHFFFAOYSA-N 0.000 claims description 2
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 claims description 2
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 claims description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 2
- XBAMMTPCYPMBNO-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfinylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 XBAMMTPCYPMBNO-UHFFFAOYSA-N 0.000 claims description 2
- RYYUUQPLFHRZOY-UHFFFAOYSA-N 4-[2-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC=C1OC1=CC=C(N)C=C1 RYYUUQPLFHRZOY-UHFFFAOYSA-N 0.000 claims description 2
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical group C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 claims description 2
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 claims description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 2
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 claims description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000004962 Polyamide-imide Substances 0.000 claims description 2
- 239000004697 Polyetherimide Substances 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 125000005375 organosiloxane group Chemical group 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920002312 polyamide-imide Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 claims description 2
- 150000003457 sulfones Chemical class 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims 1
- LBPVOEHZEWAJKQ-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 LBPVOEHZEWAJKQ-UHFFFAOYSA-N 0.000 claims 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 claims 1
- 150000002170 ethers Chemical class 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- ZYKKNUDKJDICOK-UHFFFAOYSA-N 3-[4-(3-aminophenoxy)phenoxy]aniline 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=C(OC2=CC=C(C=C2)OC2=CC=C(C=C2)N)C=C1.NC=1C=C(OC2=CC=C(C=C2)OC2=CC(=CC=C2)N)C=CC1 ZYKKNUDKJDICOK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/454,359 US7015260B2 (en) | 2003-06-04 | 2003-06-04 | High temperature polymeric materials containing corona resistant composite filler, and methods relating thereto |
| US10/454,359 | 2003-06-04 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004359957A JP2004359957A (ja) | 2004-12-24 |
| JP2004359957A5 true JP2004359957A5 (https=) | 2007-06-28 |
| JP4700294B2 JP4700294B2 (ja) | 2011-06-15 |
Family
ID=33159548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004166441A Expired - Fee Related JP4700294B2 (ja) | 2003-06-04 | 2004-06-03 | コロナ抵抗性複合充填剤を含む耐熱ポリマー材料およびその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7015260B2 (https=) |
| EP (1) | EP1484361A1 (https=) |
| JP (1) | JP4700294B2 (https=) |
| CN (1) | CN100384939C (https=) |
| CA (1) | CA2469703A1 (https=) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005194491A (ja) * | 2003-12-09 | 2005-07-21 | Mitsubishi Plastics Ind Ltd | 樹脂組成物及びこれを用いた樹脂フィルム |
| JP4542463B2 (ja) * | 2005-04-25 | 2010-09-15 | 日立マグネットワイヤ株式会社 | 耐部分放電性絶縁塗料、絶縁電線、及びそれらの製造方法 |
| JP4584014B2 (ja) * | 2005-04-25 | 2010-11-17 | 日立マグネットワイヤ株式会社 | 耐部分放電性絶縁塗料、絶縁電線、及びそれらの製造方法 |
| WO2007100078A1 (ja) * | 2006-03-03 | 2007-09-07 | Pi R & D Co., Ltd. | スクリーン印刷用感光性インク組成物及びそれを用いたポジ型レリーフパターンの形成方法 |
| US7763312B2 (en) * | 2006-04-17 | 2010-07-27 | Elantas Pdg, Inc. | Dispersion of nano-alumina in a resin or solvent system |
| US20070258190A1 (en) * | 2006-05-05 | 2007-11-08 | Irwin Patricia C | High temperature capacitors and method of manufacturing the same |
| US20070262695A1 (en) * | 2006-05-11 | 2007-11-15 | Reisman Juliana P | UV and near visible lamp filter |
| DE102006033236A1 (de) * | 2006-07-18 | 2008-01-24 | Wacker Chemie Ag | Zusammensetzung auf der Basis von Organosiliciumverbindungen |
| EP1983022A1 (en) * | 2007-04-16 | 2008-10-22 | Altana Electrical Insulation GmbH | Nano-modified wire enamels and enamelled wires thereof |
| CN101289542B (zh) * | 2007-04-17 | 2011-01-19 | 中国科学院化学研究所 | 球型二氧化硅/聚酰亚胺复合薄膜及其制备方法与应用 |
| CN101835830B (zh) * | 2007-08-31 | 2013-02-20 | 卡伯特公司 | 热界面材料 |
| KR101064816B1 (ko) * | 2009-04-03 | 2011-09-14 | 주식회사 두산 | 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판 |
| US9631054B2 (en) | 2010-07-23 | 2017-04-25 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US8574720B2 (en) | 2009-08-03 | 2013-11-05 | E.I. Du Pont De Nemours & Company | Matte finish polyimide films and methods relating thereto |
| US11203192B2 (en) | 2009-08-03 | 2021-12-21 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US9926415B2 (en) | 2010-08-05 | 2018-03-27 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US8541107B2 (en) * | 2009-08-13 | 2013-09-24 | E. I. Du Pont De Nemours And Company | Pigmented polyimide films and methods relating thereto |
| CN101735716B (zh) * | 2009-11-24 | 2013-11-27 | 丹阳四达化工有限公司 | 一种耐电晕漆包线漆的制备方法 |
| CN102725802B (zh) * | 2010-02-03 | 2016-04-06 | Abb研究有限公司 | 电绝缘体系 |
| US8784993B2 (en) | 2010-12-15 | 2014-07-22 | General Electric Company | High temperature high frequency magnet wire and method of making |
| US20110207863A1 (en) * | 2010-02-22 | 2011-08-25 | General Electric Company | Composite films comprising passivated nanoparticulated ceramic oxides |
| CN101789654B (zh) * | 2010-02-26 | 2012-12-26 | 株洲敏锐轨道电气有限责任公司 | 变频器供电的电力机车变压器油泵电机定子绝缘方法及装置 |
| CN103168068A (zh) * | 2010-07-23 | 2013-06-19 | E.I.内穆尔杜邦公司 | 消光整理聚酰亚胺膜及其相关方法 |
| US20120211258A1 (en) * | 2011-02-18 | 2012-08-23 | Hitachi Cable, Ltd. | Polyamide-imide resin insulating coating material and insulated wire using the same |
| JP6110373B2 (ja) * | 2011-06-21 | 2017-04-05 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ | 熱安定化アクリレートエラストマー組成物およびその製造方法 |
| JP6121995B2 (ja) | 2011-06-21 | 2017-04-26 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ | 熱安定化ポリアミド充填アクリレートポリマーの製造方法 |
| US8431444B2 (en) * | 2011-08-16 | 2013-04-30 | General Electric Company | Epoxy encapsulating and lamination adhesive and method of making same |
| US20130209788A1 (en) * | 2012-02-09 | 2013-08-15 | E. I. Du Pont De Nemours And Company | Corona resistant structure and methods relating thereto |
| DE102012207750A1 (de) * | 2012-05-09 | 2013-11-28 | Leibniz-Institut für Plasmaforschung und Technologie e.V. | Vorrichtung zur plasmabehandlung von menschlichen, tierischen oder pflanzlichen oberflächen, insbesondere von haut oder schleimhautarealen |
| CN102676047B (zh) * | 2012-06-05 | 2014-11-05 | 东华大学 | 一种自润滑漆包线漆及其制备方法 |
| CN102796376A (zh) * | 2012-08-31 | 2012-11-28 | 江苏亚宝绝缘材料股份有限公司 | 一种耐电晕组合物及其制备方法 |
| WO2014132445A1 (ja) * | 2013-03-01 | 2014-09-04 | 国立大学法人京都大学 | セラミックス微粒子分散液の製造方法 |
| US9928935B2 (en) | 2013-05-31 | 2018-03-27 | General Electric Company | Electrical insulation system |
| US9879163B2 (en) | 2014-06-06 | 2018-01-30 | General Electric Company | Composition for bonding windings or core laminates in an electrical machine, and associated method |
| US9911521B2 (en) | 2014-06-06 | 2018-03-06 | General Electric Company | Curable composition for electrical machine, and associated method |
| CN105623259A (zh) * | 2014-10-30 | 2016-06-01 | 国家电网公司 | 一种新型电网设备用绝缘材料 |
| CN106497051A (zh) * | 2016-10-07 | 2017-03-15 | 常州市鼎升环保科技有限公司 | 一种聚酰亚胺基耐电晕材料的制备方法 |
| CN107856383B (zh) * | 2017-12-07 | 2020-04-14 | 株洲时代华昇新材料技术有限公司 | 一种耐电晕聚酰亚胺复合薄膜及其制备方法 |
| US11728068B2 (en) | 2018-05-07 | 2023-08-15 | Essex Furukawa Magnet Wire Usa Llc | Magnet wire with corona resistant polyimide insulation |
| KR102572152B1 (ko) * | 2018-05-07 | 2023-08-28 | 에섹스 후루카와 마그넷 와이어 유에스에이 엘엘씨 | 코로나 저항성 폴리이미드 절연체를 갖는 자석 와이어 |
| CN109135554B (zh) * | 2018-09-05 | 2021-03-19 | 住井科技(深圳)有限公司 | 聚酰亚胺清漆及其制备方法和应用 |
| CN109688683A (zh) * | 2018-12-30 | 2019-04-26 | 上海安平静电科技有限公司 | 一种交流粉体电荷消除器及粉体输送管路电荷消除系统 |
| CN111646491B (zh) * | 2020-06-09 | 2022-06-07 | 湖南科技大学 | 用于分散耐电晕漆中纳米粒子的分散液、制备方法和应用及稳定型纳米粒子分散液的应用 |
| CN112011198B (zh) * | 2020-06-22 | 2021-09-14 | 中天电子材料有限公司 | 纳米氧化物f的制备方法、耐电晕聚酰亚胺薄膜的制备方法 |
| CN111653381B (zh) * | 2020-06-29 | 2021-11-12 | 西比里电机技术(苏州)有限公司 | 一种高温耐电晕陶瓷膜包线 |
| CN112280036A (zh) * | 2020-11-17 | 2021-01-29 | 潍坊弘润新材料有限公司 | 一种聚酰亚胺薄膜的加工工艺 |
| CN112358639A (zh) * | 2020-11-26 | 2021-02-12 | 河北金力新能源科技股份有限公司 | 聚酰胺酸浆料及其制备方法和应用 |
| CN113258703A (zh) * | 2021-06-11 | 2021-08-13 | 哈尔滨电机厂有限责任公司 | 一种大型发电机定子端部斜边间隔块电晕放电抑制方法 |
| CN116082682B (zh) * | 2023-03-03 | 2024-04-05 | 四川大学 | 一种聚酰亚胺/氟化纳米Al2O3复合薄膜及其制备方法 |
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-
2003
- 2003-06-04 US US10/454,359 patent/US7015260B2/en not_active Expired - Lifetime
-
2004
- 2004-05-17 EP EP04011637A patent/EP1484361A1/en not_active Withdrawn
- 2004-06-03 CA CA002469703A patent/CA2469703A1/en not_active Abandoned
- 2004-06-03 JP JP2004166441A patent/JP4700294B2/ja not_active Expired - Fee Related
- 2004-06-04 CN CNB2004100595649A patent/CN100384939C/zh not_active Expired - Fee Related
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