CN100384939C - 含耐电晕复合填料的高温聚合材料及其制备方法 - Google Patents
含耐电晕复合填料的高温聚合材料及其制备方法 Download PDFInfo
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- CN100384939C CN100384939C CNB2004100595649A CN200410059564A CN100384939C CN 100384939 C CN100384939 C CN 100384939C CN B2004100595649 A CNB2004100595649 A CN B2004100595649A CN 200410059564 A CN200410059564 A CN 200410059564A CN 100384939 C CN100384939 C CN 100384939C
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- 238000010348 incorporation Methods 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- 239000002114 nanocomposite Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical class C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 238000007797 non-conventional method Methods 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- UFOIOXZLTXNHQH-UHFFFAOYSA-N oxolane-2,3,4,5-tetracarboxylic acid Chemical compound OC(=O)C1OC(C(O)=O)C(C(O)=O)C1C(O)=O UFOIOXZLTXNHQH-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011238 particulate composite Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- JGGWKXMPICYBKC-UHFFFAOYSA-N phenanthrene-1,8,9,10-tetracarboxylic acid Chemical compound C1=CC=C(C(O)=O)C2=C(C(O)=O)C(C(O)=O)=C3C(C(=O)O)=CC=CC3=C21 JGGWKXMPICYBKC-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- ARJOQCYCJMAIFR-UHFFFAOYSA-N prop-2-enoyl prop-2-enoate Chemical compound C=CC(=O)OC(=O)C=C ARJOQCYCJMAIFR-UHFFFAOYSA-N 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- RTHVZRHBNXZKKB-UHFFFAOYSA-N pyrazine-2,3,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=NC(C(O)=O)=C(C(O)=O)N=C1C(O)=O RTHVZRHBNXZKKB-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- LUEGQDUCMILDOJ-UHFFFAOYSA-N thiophene-2,3,4,5-tetracarboxylic acid Chemical compound OC(=O)C=1SC(C(O)=O)=C(C(O)=O)C=1C(O)=O LUEGQDUCMILDOJ-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/454359 | 2003-06-04 | ||
| US10/454,359 US7015260B2 (en) | 2003-06-04 | 2003-06-04 | High temperature polymeric materials containing corona resistant composite filler, and methods relating thereto |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1572837A CN1572837A (zh) | 2005-02-02 |
| CN100384939C true CN100384939C (zh) | 2008-04-30 |
Family
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Family Applications (1)
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| CNB2004100595649A Expired - Fee Related CN100384939C (zh) | 2003-06-04 | 2004-06-04 | 含耐电晕复合填料的高温聚合材料及其制备方法 |
Country Status (5)
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|---|---|
| US (1) | US7015260B2 (https=) |
| EP (1) | EP1484361A1 (https=) |
| JP (1) | JP4700294B2 (https=) |
| CN (1) | CN100384939C (https=) |
| CA (1) | CA2469703A1 (https=) |
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| JP4584014B2 (ja) * | 2005-04-25 | 2010-11-17 | 日立マグネットワイヤ株式会社 | 耐部分放電性絶縁塗料、絶縁電線、及びそれらの製造方法 |
| WO2007100078A1 (ja) * | 2006-03-03 | 2007-09-07 | Pi R & D Co., Ltd. | スクリーン印刷用感光性インク組成物及びそれを用いたポジ型レリーフパターンの形成方法 |
| US7763312B2 (en) * | 2006-04-17 | 2010-07-27 | Elantas Pdg, Inc. | Dispersion of nano-alumina in a resin or solvent system |
| US20070258190A1 (en) * | 2006-05-05 | 2007-11-08 | Irwin Patricia C | High temperature capacitors and method of manufacturing the same |
| US20070262695A1 (en) * | 2006-05-11 | 2007-11-15 | Reisman Juliana P | UV and near visible lamp filter |
| DE102006033236A1 (de) * | 2006-07-18 | 2008-01-24 | Wacker Chemie Ag | Zusammensetzung auf der Basis von Organosiliciumverbindungen |
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| CN101289542B (zh) * | 2007-04-17 | 2011-01-19 | 中国科学院化学研究所 | 球型二氧化硅/聚酰亚胺复合薄膜及其制备方法与应用 |
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| US11203192B2 (en) | 2009-08-03 | 2021-12-21 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US9926415B2 (en) | 2010-08-05 | 2018-03-27 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US8541107B2 (en) * | 2009-08-13 | 2013-09-24 | E. I. Du Pont De Nemours And Company | Pigmented polyimide films and methods relating thereto |
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| US20130209788A1 (en) * | 2012-02-09 | 2013-08-15 | E. I. Du Pont De Nemours And Company | Corona resistant structure and methods relating thereto |
| DE102012207750A1 (de) * | 2012-05-09 | 2013-11-28 | Leibniz-Institut für Plasmaforschung und Technologie e.V. | Vorrichtung zur plasmabehandlung von menschlichen, tierischen oder pflanzlichen oberflächen, insbesondere von haut oder schleimhautarealen |
| CN102676047B (zh) * | 2012-06-05 | 2014-11-05 | 东华大学 | 一种自润滑漆包线漆及其制备方法 |
| CN102796376A (zh) * | 2012-08-31 | 2012-11-28 | 江苏亚宝绝缘材料股份有限公司 | 一种耐电晕组合物及其制备方法 |
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| US9911521B2 (en) | 2014-06-06 | 2018-03-06 | General Electric Company | Curable composition for electrical machine, and associated method |
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| CN106497051A (zh) * | 2016-10-07 | 2017-03-15 | 常州市鼎升环保科技有限公司 | 一种聚酰亚胺基耐电晕材料的制备方法 |
| CN107856383B (zh) * | 2017-12-07 | 2020-04-14 | 株洲时代华昇新材料技术有限公司 | 一种耐电晕聚酰亚胺复合薄膜及其制备方法 |
| US11728068B2 (en) | 2018-05-07 | 2023-08-15 | Essex Furukawa Magnet Wire Usa Llc | Magnet wire with corona resistant polyimide insulation |
| KR102572152B1 (ko) * | 2018-05-07 | 2023-08-28 | 에섹스 후루카와 마그넷 와이어 유에스에이 엘엘씨 | 코로나 저항성 폴리이미드 절연체를 갖는 자석 와이어 |
| CN109135554B (zh) * | 2018-09-05 | 2021-03-19 | 住井科技(深圳)有限公司 | 聚酰亚胺清漆及其制备方法和应用 |
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| CN111653381B (zh) * | 2020-06-29 | 2021-11-12 | 西比里电机技术(苏州)有限公司 | 一种高温耐电晕陶瓷膜包线 |
| CN112280036A (zh) * | 2020-11-17 | 2021-01-29 | 潍坊弘润新材料有限公司 | 一种聚酰亚胺薄膜的加工工艺 |
| CN112358639A (zh) * | 2020-11-26 | 2021-02-12 | 河北金力新能源科技股份有限公司 | 聚酰胺酸浆料及其制备方法和应用 |
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| JP3633199B2 (ja) * | 1997-04-21 | 2005-03-30 | 三菱エンジニアリングプラスチックス株式会社 | ポリエステル樹脂組成物 |
| DE19717645C2 (de) * | 1997-04-25 | 2001-01-18 | Daetwyler Ag Altdorf | Keramisierbare flammwidrige Zusammensetzung, Verfahren zur Herstellung und deren Verwendung |
| DE19822137A1 (de) * | 1998-05-16 | 1999-11-18 | Asea Brown Boveri | Hochspannungsisolierte Statorwicklung |
| US5989706A (en) * | 1998-09-30 | 1999-11-23 | Battelle Memorial Institute | Thermally-protective intumescent coating system and method |
| DE19961972A1 (de) * | 1999-12-22 | 2001-06-28 | Degussa | Organosilan- und/oder Organosiloxan-haltige Mittel für gefülltes Polyamid |
| DE50013562D1 (de) * | 2000-06-20 | 2006-11-16 | Abb Research Ltd | Vergussmassen für die Herstellung von elektrischen Isolierungen |
| JP2002201365A (ja) * | 2001-01-05 | 2002-07-19 | Hitachi Chem Co Ltd | 樹脂組成物及びそれを含む被膜形成材料 |
| US7442727B2 (en) * | 2003-06-04 | 2008-10-28 | Degussa Ag | Pyrogenically prepared, surface modified aluminum oxide |
-
2003
- 2003-06-04 US US10/454,359 patent/US7015260B2/en not_active Expired - Lifetime
-
2004
- 2004-05-17 EP EP04011637A patent/EP1484361A1/en not_active Withdrawn
- 2004-06-03 CA CA002469703A patent/CA2469703A1/en not_active Abandoned
- 2004-06-03 JP JP2004166441A patent/JP4700294B2/ja not_active Expired - Fee Related
- 2004-06-04 CN CNB2004100595649A patent/CN100384939C/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1123582A (zh) * | 1993-05-17 | 1996-05-29 | 雷伊化学有限公司 | 聚合物组合物及电线绝缘 |
| WO1997038041A1 (en) * | 1996-04-04 | 1997-10-16 | Nanophase Technologies Corporation | Siloxane star-graft polymers, ceramic powders coated therewith and method of preparing coated ceramic powders |
| US6033781A (en) * | 1996-04-04 | 2000-03-07 | Nanophase Technologies Corporation | Ceramic powders coated with siloxane star-graft polymers |
| JP2002294075A (ja) * | 2001-03-30 | 2002-10-09 | Ge Toshiba Silicones Co Ltd | 高電圧電気絶縁体用シリコーンゴム組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| US7015260B2 (en) | 2006-03-21 |
| JP2004359957A (ja) | 2004-12-24 |
| EP1484361A1 (en) | 2004-12-08 |
| CN1572837A (zh) | 2005-02-02 |
| CA2469703A1 (en) | 2004-12-04 |
| US20040249041A1 (en) | 2004-12-09 |
| JP4700294B2 (ja) | 2011-06-15 |
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