JP2002530529A - プラスチック面の金属化処理プロセス - Google Patents

プラスチック面の金属化処理プロセス

Info

Publication number
JP2002530529A
JP2002530529A JP2000582621A JP2000582621A JP2002530529A JP 2002530529 A JP2002530529 A JP 2002530529A JP 2000582621 A JP2000582621 A JP 2000582621A JP 2000582621 A JP2000582621 A JP 2000582621A JP 2002530529 A JP2002530529 A JP 2002530529A
Authority
JP
Japan
Prior art keywords
solution
plastic surface
process according
etching
minutes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000582621A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002530529A5 (zh
Inventor
ナルスケフィシャス，レオナス
ロゾフスキス，グリゴリュース
フィンケフィシャス，ヨナス
バラナウスカス，ミコラス
モビウス，アンドレイアース
ピィエス，ペイター
Original Assignee
エントン・オーエムアイ・インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from LT98-161A external-priority patent/LT4713B/lt
Priority claimed from DE1999104665 external-priority patent/DE19904665A1/de
Priority claimed from EP99115967A external-priority patent/EP1001052B1/de
Application filed by エントン・オーエムアイ・インコーポレイテッド filed Critical エントン・オーエムアイ・インコーポレイテッド
Publication of JP2002530529A publication Critical patent/JP2002530529A/ja
Publication of JP2002530529A5 publication Critical patent/JP2002530529A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2000582621A 1998-11-13 1999-11-05 プラスチック面の金属化処理プロセス Pending JP2002530529A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
LT98-161A LT4713B (lt) 1998-11-13 1998-11-13 Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas
DE1999104665 DE19904665A1 (de) 1999-02-04 1999-02-04 Verfahren zur Metallisierung einer Kunststoffoberfläche
EP19904665.4 1999-08-13
EP99115967.4 1999-08-13
EP98-161 1999-08-13
EP99115967A EP1001052B1 (de) 1998-11-13 1999-08-13 Verfahren zur Metallisierung einer Kunststoffoberfläche
PCT/US1999/026066 WO2000029646A1 (en) 1998-11-13 1999-11-05 Process for metallizing a plastic surface

Publications (2)

Publication Number Publication Date
JP2002530529A true JP2002530529A (ja) 2002-09-17
JP2002530529A5 JP2002530529A5 (zh) 2006-02-09

Family

ID=27218955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000582621A Pending JP2002530529A (ja) 1998-11-13 1999-11-05 プラスチック面の金属化処理プロセス

Country Status (8)

Country Link
JP (1) JP2002530529A (zh)
CN (1) CN1184361C (zh)
AU (1) AU1243300A (zh)
BR (1) BR9915280A (zh)
CA (1) CA2350422A1 (zh)
MX (1) MXPA01004811A (zh)
TW (1) TWI221163B (zh)
WO (1) WO2000029646A1 (zh)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002146589A (ja) * 2000-07-20 2002-05-22 Shipley Co Llc 誘電体表面上に導電層を製造する方法
JP2005336614A (ja) * 2004-05-27 2005-12-08 Enthone Inc プラスチック表面をめっきするための方法
JP2007039772A (ja) * 2005-08-05 2007-02-15 Kakihara Kogyo Kk 銅フリー樹脂めっきの成膜方法
JP2007039770A (ja) * 2005-08-05 2007-02-15 Kakihara Kogyo Kk 銅フリー樹脂めっきの耐食性向上方法
WO2007116493A1 (ja) * 2006-03-31 2007-10-18 Ebara-Udylite Co., Ltd. プラスチック用の表面改質液およびそれを利用したプラスチック表面の金属化方法
WO2008132926A1 (ja) * 2007-04-18 2008-11-06 Ebara-Udylite Co., Ltd. エッチング液およびこれを用いたプラスチック表面の金属化方法
JP2009022948A (ja) * 2007-06-20 2009-02-05 Okuno Chem Ind Co Ltd エッチング液の電解処理方法
JP2009094277A (ja) * 2007-10-09 2009-04-30 Okuno Chem Ind Co Ltd スミア除去用組成物
JP2010535935A (ja) * 2007-08-10 2010-11-25 エントン インコーポレイテッド プラスチック表面のための無クロム酸洗
US8394289B2 (en) 2006-04-18 2013-03-12 Okuno Chemicals Industries Co., Ltd. Composition for etching treatment of resin molded article
JP2013511844A (ja) * 2009-11-18 2013-04-04 スリーエム イノベイティブ プロパティズ カンパニー Ｉｉ〜ｖｉ半導体のための新規なウェットエッチング剤及び方法
JP2015513003A (ja) * 2012-03-15 2015-04-30 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 非導電性プラスチック表面の金属化方法
JP5830807B2 (ja) * 2013-10-22 2015-12-09 奥野製薬工業株式会社 樹脂材料のエッチング処理用組成物
JP2022551764A (ja) * 2019-11-21 2022-12-13 コヴェンティア ソチエタ ペル アツィオーニ 金属化すべきプラスチック部品を調製するための電解処理装置及びプラスチック部品をエッチングする方法

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0118870D0 (en) 2001-08-02 2001-09-26 Shipley Co Llc A combined adhesion promotion and direct metallization process
DE10138446A1 (de) * 2001-08-04 2003-02-13 Enthone Omi Deutschland Gmbh Verfahren zur Metallisierung von Kunststoffoberflächen
US7163835B2 (en) * 2003-09-26 2007-01-16 E. I. Du Pont De Nemours And Company Method for producing thin semiconductor films by deposition from solution
DE102005051632B4 (de) 2005-10-28 2009-02-19 Enthone Inc., West Haven Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
US7354870B2 (en) 2005-11-14 2008-04-08 National Research Council Of Canada Process for chemical etching of parts fabricated by stereolithography
CN102102197B (zh) * 2005-12-06 2014-04-16 荏原优莱特科技股份有限公司 钯配合物以及使用该配合物的催化剂赋予处理液
DE102011111294B4 (de) * 2011-08-26 2018-12-20 Atotech Deutschland Gmbh Verfahren zur Behandlung von Kunststoffsubstraten und Vorrichtung zur Regeneration einer Behandlungslösung
EP2639332A1 (de) * 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639333A1 (de) * 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
LT6070B (lt) * 2012-12-07 2014-09-25 Atotech Deutschland Gmbh Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas
EP2767614A1 (en) * 2013-02-13 2014-08-20 ATOTECH Deutschland GmbH Method for depositing a first metallic layer onto non-conductive polymers
CN104975276B (zh) * 2014-04-11 2019-07-12 深圳市泛友科技有限公司 在塑料表面形成选择性金属线路的方法及塑料部件
US10920321B2 (en) 2014-05-30 2021-02-16 Uab Rekin International Chrome-free adhesion pre-treatment for plastics
CN105369227B (zh) * 2015-12-08 2017-08-25 丽水学院 用于酸性高锰酸钾溶液的稳定剂
JP6750293B2 (ja) * 2016-04-28 2020-09-02 栗田工業株式会社 プラスチック表面の処理方法
CN106086838B (zh) * 2016-06-21 2019-04-02 太仓碧奇新材料研发有限公司 钕锌钴合金/聚丙烯支架材料的制备方法
CN106011801A (zh) * 2016-06-27 2016-10-12 镇江阿尔法特种镀膜科技有限公司 一种特种工程塑料用粗化溶液
JP6288213B1 (ja) * 2016-11-01 2018-03-07 栗田工業株式会社 プラスチック表面の処理方法
CN110402304A (zh) * 2016-12-21 2019-11-01 哈索赫伯特施密特有限两合公司 用于酸洗合成材料的酸洗液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4810333A (en) * 1987-12-14 1989-03-07 Shipley Company Inc. Electroplating process
US4917761A (en) * 1989-08-14 1990-04-17 Eastman Kodak Company Method of rendering polymeric materials hydrophilic for etching
US5110633A (en) * 1989-09-01 1992-05-05 Ciba-Geigy Corporation Process for coating plastics articles
US4919768A (en) * 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process
US5192590A (en) * 1989-11-03 1993-03-09 Raychem Corporation Coating metal on poly(aryl ether ketone) surfaces
US5238550A (en) * 1991-11-27 1993-08-24 Shipley Company Inc. Electroplating process

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002146589A (ja) * 2000-07-20 2002-05-22 Shipley Co Llc 誘電体表面上に導電層を製造する方法
JP2005336614A (ja) * 2004-05-27 2005-12-08 Enthone Inc プラスチック表面をめっきするための方法
JP2007039772A (ja) * 2005-08-05 2007-02-15 Kakihara Kogyo Kk 銅フリー樹脂めっきの成膜方法
JP2007039770A (ja) * 2005-08-05 2007-02-15 Kakihara Kogyo Kk 銅フリー樹脂めっきの耐食性向上方法
JP4494310B2 (ja) * 2005-08-05 2010-06-30 柿原工業株式会社 銅フリー樹脂めっきの成膜方法
JP4494309B2 (ja) * 2005-08-05 2010-06-30 柿原工業株式会社 銅フリーのニッケル−クロム樹脂めっきの耐食性向上方法
WO2007116493A1 (ja) * 2006-03-31 2007-10-18 Ebara-Udylite Co., Ltd. プラスチック用の表面改質液およびそれを利用したプラスチック表面の金属化方法
US8394289B2 (en) 2006-04-18 2013-03-12 Okuno Chemicals Industries Co., Ltd. Composition for etching treatment of resin molded article
JP5177426B2 (ja) * 2006-04-18 2013-04-03 奥野製薬工業株式会社 樹脂成形体に対するエッチング処理用組成物
WO2008132926A1 (ja) * 2007-04-18 2008-11-06 Ebara-Udylite Co., Ltd. エッチング液およびこれを用いたプラスチック表面の金属化方法
JP2009022948A (ja) * 2007-06-20 2009-02-05 Okuno Chem Ind Co Ltd エッチング液の電解処理方法
JP2010535935A (ja) * 2007-08-10 2010-11-25 エントン インコーポレイテッド プラスチック表面のための無クロム酸洗
KR101576693B1 (ko) 2007-08-10 2015-12-10 엔쏜 인코포레이티드 플라스틱 표면용 무크롬 산세
JP2009094277A (ja) * 2007-10-09 2009-04-30 Okuno Chem Ind Co Ltd スミア除去用組成物
JP2013511844A (ja) * 2009-11-18 2013-04-04 スリーエム イノベイティブ プロパティズ カンパニー Ｉｉ〜ｖｉ半導体のための新規なウェットエッチング剤及び方法
JP2015513003A (ja) * 2012-03-15 2015-04-30 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 非導電性プラスチック表面の金属化方法
JP5830807B2 (ja) * 2013-10-22 2015-12-09 奥野製薬工業株式会社 樹脂材料のエッチング処理用組成物
US9657226B2 (en) 2013-10-22 2017-05-23 Okuno Chemical Industries Co., Ltd. Composition for etching treatment of resin material
KR20170077274A (ko) * 2013-10-22 2017-07-05 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 수지 재료의 에칭 처리용 조성물
KR102011851B1 (ko) 2013-10-22 2019-08-20 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 수지 재료의 에칭 처리용 조성물
JP2022551764A (ja) * 2019-11-21 2022-12-13 コヴェンティア ソチエタ ペル アツィオーニ 金属化すべきプラスチック部品を調製するための電解処理装置及びプラスチック部品をエッチングする方法
JP7291858B2 (ja) 2019-11-21 2023-06-15 コヴェンティア ソチエタ ペル アツィオーニ 金属化すべきプラスチック部品を調製するための電解処理装置及びプラスチック部品をエッチングする方法

Also Published As

Publication number Publication date
CA2350422A1 (en) 2000-05-25
WO2000029646A1 (en) 2000-05-25
MXPA01004811A (es) 2002-09-18
CN1184361C (zh) 2005-01-12
CN1333843A (zh) 2002-01-30
BR9915280A (pt) 2001-08-07
AU1243300A (en) 2000-06-05
TWI221163B (en) 2004-09-21

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