BR9915280A - Processo para metalizar uma superfìcie plástica - Google Patents
Processo para metalizar uma superfìcie plásticaInfo
- Publication number
- BR9915280A BR9915280A BR9915280-0A BR9915280A BR9915280A BR 9915280 A BR9915280 A BR 9915280A BR 9915280 A BR9915280 A BR 9915280A BR 9915280 A BR9915280 A BR 9915280A
- Authority
- BR
- Brazil
- Prior art keywords
- plastic surface
- salt
- metallizing
- treated
- solution
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
Patente de Invenção: <B>"PROCESSO PARA METALIZAR UMA SUPERFìCIE PLáSTICA"<D>. Um processo para metalização de uma superfície plástica, onde as seguintes etapas de processo são executados em seq³ência, um após o outro: A superfície plástica é submetida a um tratamento de causticação sob condições suaves de causticação. Subseq³entemente a superfície plástica é tratada com uma solução de sal metálico, contendo pelo menos um sal do seguinte grupo: "Sal de cobalto, sal de prata, sal de estanho, sal de chumbo". A superfície plástica é tratada com uma solução de sulfeto. Finalmente a superfície plástica é metalizada em um banho de metalização.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
LT98-161A LT4713B (lt) | 1998-11-13 | 1998-11-13 | Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas |
DE1999104665 DE19904665A1 (de) | 1999-02-04 | 1999-02-04 | Verfahren zur Metallisierung einer Kunststoffoberfläche |
EP99115967A EP1001052B1 (de) | 1998-11-13 | 1999-08-13 | Verfahren zur Metallisierung einer Kunststoffoberfläche |
PCT/US1999/026066 WO2000029646A1 (en) | 1998-11-13 | 1999-11-05 | Process for metallizing a plastic surface |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9915280A true BR9915280A (pt) | 2001-08-07 |
Family
ID=27218955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9915280-0A BR9915280A (pt) | 1998-11-13 | 1999-11-05 | Processo para metalizar uma superfìcie plástica |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP2002530529A (pt) |
CN (1) | CN1184361C (pt) |
AU (1) | AU1243300A (pt) |
BR (1) | BR9915280A (pt) |
CA (1) | CA2350422A1 (pt) |
MX (1) | MXPA01004811A (pt) |
TW (1) | TWI221163B (pt) |
WO (1) | WO2000029646A1 (pt) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
LT2000074A (lt) * | 2000-07-20 | 2002-01-25 | Mykolas Baranauskas | Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas |
GB0118870D0 (en) * | 2001-08-02 | 2001-09-26 | Shipley Co Llc | A combined adhesion promotion and direct metallization process |
DE10138446A1 (de) * | 2001-08-04 | 2003-02-13 | Enthone Omi Deutschland Gmbh | Verfahren zur Metallisierung von Kunststoffoberflächen |
US7163835B2 (en) * | 2003-09-26 | 2007-01-16 | E. I. Du Pont De Nemours And Company | Method for producing thin semiconductor films by deposition from solution |
DE102004026489B3 (de) * | 2004-05-27 | 2005-09-29 | Enthone Inc., West Haven | Verfahren zur Metallisierung von Kunststoffoberflächen |
JP4494310B2 (ja) * | 2005-08-05 | 2010-06-30 | 柿原工業株式会社 | 銅フリー樹脂めっきの成膜方法 |
JP4494309B2 (ja) * | 2005-08-05 | 2010-06-30 | 柿原工業株式会社 | 銅フリーのニッケル−クロム樹脂めっきの耐食性向上方法 |
DE102005051632B4 (de) | 2005-10-28 | 2009-02-19 | Enthone Inc., West Haven | Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen |
US7354870B2 (en) | 2005-11-14 | 2008-04-08 | National Research Council Of Canada | Process for chemical etching of parts fabricated by stereolithography |
CN102102197B (zh) * | 2005-12-06 | 2014-04-16 | 荏原优莱特科技股份有限公司 | 钯配合物以及使用该配合物的催化剂赋予处理液 |
EP2006415A2 (en) * | 2006-03-31 | 2008-12-24 | Ebara-Udylite Co., Ltd. | Surface modification liquid for plastic and method of metallizing plastic surface therewith |
US8394289B2 (en) | 2006-04-18 | 2013-03-12 | Okuno Chemicals Industries Co., Ltd. | Composition for etching treatment of resin molded article |
KR20100014699A (ko) * | 2007-04-18 | 2010-02-10 | 에바라 유지라이토 가부시키가이샤 | 에칭액 및 이를 이용한 플라스틱 표면의 금속화 방법 |
JP4849420B2 (ja) * | 2007-06-20 | 2012-01-11 | 奥野製薬工業株式会社 | エッチング液の電解処理方法 |
DE502007001745D1 (de) | 2007-08-10 | 2009-11-26 | Enthone | Chromfreie Beize für Kunststoffoberflächen |
JP5339023B2 (ja) * | 2007-10-09 | 2013-11-13 | 奥野製薬工業株式会社 | スミア除去用組成物 |
KR20120092673A (ko) * | 2009-11-18 | 2012-08-21 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Ⅱ-ⅵ족 반도체를 위한 신규한 습식 에칭제 및 방법 |
DE102011111294B4 (de) * | 2011-08-26 | 2018-12-20 | Atotech Deutschland Gmbh | Verfahren zur Behandlung von Kunststoffsubstraten und Vorrichtung zur Regeneration einer Behandlungslösung |
EP2639332A1 (de) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen |
EP2639333A1 (de) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen |
EP2639334A1 (de) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen |
LT6070B (lt) * | 2012-12-07 | 2014-09-25 | Atotech Deutschland Gmbh | Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas |
EP2767614A1 (en) * | 2013-02-13 | 2014-08-20 | ATOTECH Deutschland GmbH | Method for depositing a first metallic layer onto non-conductive polymers |
EP2937446B1 (en) * | 2013-10-22 | 2018-06-13 | Okuno Chemical Industries Co., Ltd. | Composition for etching treatment of resin material |
CN104975276B (zh) * | 2014-04-11 | 2019-07-12 | 深圳市泛友科技有限公司 | 在塑料表面形成选择性金属线路的方法及塑料部件 |
US10920321B2 (en) | 2014-05-30 | 2021-02-16 | Uab Rekin International | Chrome-free adhesion pre-treatment for plastics |
CN105369227B (zh) * | 2015-12-08 | 2017-08-25 | 丽水学院 | 用于酸性高锰酸钾溶液的稳定剂 |
JP6750293B2 (ja) * | 2016-04-28 | 2020-09-02 | 栗田工業株式会社 | プラスチック表面の処理方法 |
CN106086838B (zh) * | 2016-06-21 | 2019-04-02 | 太仓碧奇新材料研发有限公司 | 钕锌钴合金/聚丙烯支架材料的制备方法 |
CN106011801A (zh) * | 2016-06-27 | 2016-10-12 | 镇江阿尔法特种镀膜科技有限公司 | 一种特种工程塑料用粗化溶液 |
JP6288213B1 (ja) * | 2016-11-01 | 2018-03-07 | 栗田工業株式会社 | プラスチック表面の処理方法 |
MX2019007128A (es) * | 2016-12-21 | 2019-09-19 | Hso Herbert Schmidt Gmbh & Co Kg | Solucion de decapado para decapar materiales sinteticos. |
EP3825441A1 (en) * | 2019-11-21 | 2021-05-26 | COVENTYA S.p.A. | An electrolytic treatment device for preparing plastic parts to be metallized and a method for etching plastic parts |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4810333A (en) * | 1987-12-14 | 1989-03-07 | Shipley Company Inc. | Electroplating process |
US4917761A (en) * | 1989-08-14 | 1990-04-17 | Eastman Kodak Company | Method of rendering polymeric materials hydrophilic for etching |
US5110633A (en) * | 1989-09-01 | 1992-05-05 | Ciba-Geigy Corporation | Process for coating plastics articles |
US4919768A (en) * | 1989-09-22 | 1990-04-24 | Shipley Company Inc. | Electroplating process |
US5192590A (en) * | 1989-11-03 | 1993-03-09 | Raychem Corporation | Coating metal on poly(aryl ether ketone) surfaces |
US5238550A (en) * | 1991-11-27 | 1993-08-24 | Shipley Company Inc. | Electroplating process |
-
1999
- 1999-11-05 CA CA002350422A patent/CA2350422A1/en not_active Abandoned
- 1999-11-05 BR BR9915280-0A patent/BR9915280A/pt not_active IP Right Cessation
- 1999-11-05 JP JP2000582621A patent/JP2002530529A/ja active Pending
- 1999-11-05 AU AU12433/00A patent/AU1243300A/en not_active Abandoned
- 1999-11-05 WO PCT/US1999/026066 patent/WO2000029646A1/en not_active Application Discontinuation
- 1999-11-05 MX MXPA01004811A patent/MXPA01004811A/es not_active Application Discontinuation
- 1999-11-05 CN CNB998154938A patent/CN1184361C/zh not_active Expired - Fee Related
- 1999-11-11 TW TW088119793A patent/TWI221163B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU1243300A (en) | 2000-06-05 |
WO2000029646A1 (en) | 2000-05-25 |
JP2002530529A (ja) | 2002-09-17 |
CA2350422A1 (en) | 2000-05-25 |
TWI221163B (en) | 2004-09-21 |
MXPA01004811A (es) | 2002-09-18 |
CN1333843A (zh) | 2002-01-30 |
CN1184361C (zh) | 2005-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR9915280A (pt) | Processo para metalizar uma superfìcie plástica | |
DE69219645T2 (de) | Verfahren zur stromlosen Plattierung von Zinn, Blei oder Zinn-Blei-Legierung | |
KR840003716A (ko) | 도전성 재료 및 그의 제조방법 | |
ZA896403B (en) | Plating | |
DE69404496T2 (de) | Cyanidfreie Plattierungslösung für monovalente Metalle | |
ATE77806T1 (de) | Verfahren fuer die abscheidung von metallen. | |
FR2303871A1 (fr) | Procede d'obtention de depots electrolytiques de cuivre brillants et bien egalises, et bains utilises dans ce but | |
BR8506459A (pt) | Composicao e processo para a deposicao de cobre sem aplicacao de eletricidade,processo para reforcar uma composicao,bem como substrato revestido | |
SE8203085L (sv) | Badkomposition for stromfri guldpletering | |
DE69101621T2 (de) | Verfahren zur elektrolytischen Regenerierung von ammoniakalischen Kupferätzbädern. | |
ATE266107T1 (de) | Verfahren zur metallisierung einer kunststoffoberfläche | |
ATE144007T1 (de) | Verfahren zur metallisierung von nichtleiteroberflächen und die verwendung von hydroximethansulfinsäure im verfahren | |
ATE165874T1 (de) | Verfahren zur beschichtung phosphatierter metallsubstrate | |
BR8401197A (pt) | Fundente com base em cloreto de zinco,banho de fundente aquoso processo para revestir um artigo ferroso | |
GB2115008B (en) | Electroplating chromium | |
SE8106264L (sv) | Sett att selektivt avlegsna kopparfororeningar fran palladium- och tennhaltiga aktivatorlosningar | |
EP1029944A3 (en) | Method for enhancing the solderability of a surface | |
KR970052517A (ko) | 인규산화유리층에 형성된 콘택트 홀의 프로파일 개선 방법 | |
TH43288A3 (th) | กระบวนการสำหรับการชุบพื้นผิวพลาสติกด้วยโลหะ | |
BR8400185A (pt) | Banho de cobre sem eletrolise para a deposicao de cobre sobre um substrato,processo para a deposicao de cobre a partir de um banho de cobre sem eletrolise sobre um substrato;etilenodinitrilo-tetra-2-propanol | |
RU2005123880A (ru) | Способ нанесения металлического покрытия на изделия из пластмасс | |
BR9307327A (pt) | Processo para manter um banho de fluxagem de uma linha de galvanização | |
SU367746A1 (ru) | Контактно-химический способ осаждени металлов | |
RU93030804A (ru) | Способ лечения онихомикозов | |
RU93008708A (ru) | Способ металлизации пластмасс |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application fees: dismissal - article 86 of industrial property law |
Free format text: REFERENTE A 6A E 7A ANUIDADES. |
|
B08K | Lapse as no evidence of payment of the annual fee has been furnished to inpi (acc. art. 87) |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1876 DE 19/12/2006. |