JP2015513003A - 非導電性プラスチック表面の金属化方法 - Google Patents
非導電性プラスチック表面の金属化方法 Download PDFInfo
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- JP2015513003A JP2015513003A JP2014561462A JP2014561462A JP2015513003A JP 2015513003 A JP2015513003 A JP 2015513003A JP 2014561462 A JP2014561462 A JP 2014561462A JP 2014561462 A JP2014561462 A JP 2014561462A JP 2015513003 A JP2015513003 A JP 2015513003A
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- plastic surface
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- etchant
- plastic
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- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 58
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- NALMPLUMOWIVJC-UHFFFAOYSA-N n,n,4-trimethylbenzeneamine oxide Chemical compound CC1=CC=C([N+](C)(C)[O-])C=C1 NALMPLUMOWIVJC-UHFFFAOYSA-N 0.000 description 1
- 239000006199 nebulizer Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000013386 optimize process Methods 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- YJVFFLUZDVXJQI-UHFFFAOYSA-L palladium(ii) acetate Chemical compound [Pd+2].CC([O-])=O.CC([O-])=O YJVFFLUZDVXJQI-UHFFFAOYSA-L 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000008363 phosphate buffer Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 description 1
- 239000001230 potassium iodate Substances 0.000 description 1
- 235000006666 potassium iodate Nutrition 0.000 description 1
- 229940093930 potassium iodate Drugs 0.000 description 1
- 239000008057 potassium phosphate buffer Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 1
- 229940071536 silver acetate Drugs 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 235000015281 sodium iodate Nutrition 0.000 description 1
- 239000011697 sodium iodate Substances 0.000 description 1
- 229940032753 sodium iodate Drugs 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 235000001508 sulfur Nutrition 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
-
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
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Abstract
Description
物品の電気的非導電性プラスチック表面の金属化方法であって、以下の工程段階:
A)前記プラスチック表面をエッチング液で処理する工程、
B)前記プラスチック表面をコロイド溶液または金属化合物溶液で処理する工程、および
C)前記プラスチック表面を金属化溶液で金属化する工程、
を含む前記方法であって、前記エッチング液が、少なくとも1種の酸性のエッチング液および少なくとも1種のアルカリ性のエッチング液を含んでいること、かつこれらのエッチング液それぞれが、過マンガン酸イオン源を含んでいることを特徴とする前記方法。
前記治具をヨウ素酸イオン源を含む溶液で処理する工程
が実施されてよい。
前記物品または複数の物品を治具に固定する工程
が実施されてよい。
前記プラスチック表面を少なくとも1種のグリコール化合物を含む水溶液中で処理する工程
が実施される。
nは、1から4までの整数であり、
R1およびR2は、それぞれ独立して、−H、−CH3、−CH2−CH3、−CH2−CH2−CH3、−CH(CH3)−CH3、−CH2−CH2−CH2−CH3、−CH(CH3)−CH2−CH3、−CH2−CH(CH3)−CH3、−CH2−CH2−CH2−CH2−CH3、−CH(CH3)−CH2−CH2−CH3、−CH2−CH(CH3)−CH2−CH3、−CH2−CH2−CH(CH3)−CH3、−CH(CH2−CH3)−CH2−CH3、−CH2−CH(CH2−CH3)−CH3、−CO−CH3、−CO−CH2−CH3、−CO−CH2−CH2−CH3、−CO−CH(CH3)−CH3、−CO−CH(CH3)−CH2−CH3、−CO−CH2−CH(CH3)−CH3、−CO−CH2−CH2−CH2−CH3である]
の化合物を意味すると理解される。
1.過マンガン酸イオン源、および
2.酸
前記アルカリ性のエッチング液は、以下を含んでいる:
1.過マンガン酸イオン源、および
2.水酸化物イオン源。
Ai)前記プラスチック表面を酸性のエッチング液で処理する工程、および
Aii)前記プラスチック表面をアルカリ性のエッチング液で処理する工程
を含んでいる。
Ai)前記プラスチック表面をアルカリ性のエッチング液で処理する工程、および
Aii)前記プラスチック表面を酸性のエッチング液で処理する工程
を含んでいる。
ABS:ABSコポリマー
BB:Bayblend T45、ABS/PC混合物
過マンガン酸塩、第一段階:エッチング処理IIIに相当する、酸性の過マンガン酸塩溶液による処理
過マンガン酸塩、第二段階:エッチング処理Iに相当する、最初に酸性の過マンガン酸塩溶液、次にアルカリ性の過マンガン酸塩溶液による処理。
Aiii)前記プラスチック表面を二酸化マンガンのための還元剤を含む溶液中で処理する工程
が、工程段階A)とB)との間に実施される。
Aiv)前記プラスチック表面を酸性水溶液中で処理する工程
が、実施されてよい。
Bi)前記プラスチック表面を酸性水溶液中で処理する工程、および
Bii)前記プラスチック表面を金属化溶液中で無電解金属化する工程
が実施される。
Bi)前記プラスチック表面を化成液(conversion solution)中で処理する工程
が、工程段階B)とC)との間に実施される。
Ci)前記金属化されたプラスチック表面を高温で保管する工程
が実施される。
以下の実施例は、本発明を詳細に説明することを目的としている。
Bayblend T45PGの1つのパネル(10cm×5cm、ABS/PC混合物)を、リン酸カリウム衝撃剤でpH=7に調節された2−(2−エトキシエトキシ)エチルアセテート40%溶液中で、25℃で7分間処理した(前処理段階)。続いて、前記パネルを、流水下で約1分間洗浄した。
Bayblend T45PGの2つのパネル(10cm×5cm、ABS/PC混合物)を、例1に記載の通り、2−(2−エトキシエトキシ)エチルアセテートの溶液中で前処理して、次に流水下で約1分洗浄した。
Bayblend T45の4つのパネル(5.2×14.9×0.3cm、ABS/PC混合物)を、2−(2−エトキシエトキシ)エチルアセテート溶液中で10分間、前処理して、例1に記載の通り洗浄した。
Novodur P2MC(ABS)およびBayblend T45(ABS/PC混合物)の2組のプラスチックパネル(寸法10.4cm×14.9cm×3mm)を、リン酸カリウム緩衝剤でpH=7に調節して、サーモスタット内で45℃に保たれた2−(2−エトキシエトキシ)エチルアセテート15%およびブトキシエタノール10%の溶液中で10分間処理した。
パラジウムの波長:340.458nmおよび360.955nm
測定の繰り返し:3
噴霧器ガス圧:200kPa
補助装置ガス流速:1.5l/min
プラズマガス流速:16.5l/min
高周波発生器のRF電力:1250ワット。
種々のエッチング処理後に直接電気めっきにより設けられた、ABS/PCパネル上の金属層の接着強度の比較。
種々のエッチング処理後のABS/PCによるパラジウムの取り込みの比較
この試験は、ABS/PC混合物(Bayblend T45PG)のパネルを使用して実施した。前記パネルの寸法は、10cm×7.5cm×3mmであった。
Novodur P2MC(ABS)およびBayblend T45(ABS/PC混合物)のプラスチックパネル(寸法10cm×7.5cm×3mm)のそれぞれ2つのパネルを、2−(2−エトキシエトキシ)エチルアセテート溶液中で、例1に記載の通り10分間処理した。
グリコール化合物溶液中の滞留時間の接着強度に対する影響、および析出した二酸化マンガンおよびパラジウムの量
Bayblend T45PG(ABS/PC混合物)の複数のパネルを、2−(2−エトキシエトキシ)エチルアセテート40%溶液中で、25℃で種々の時間(滞留時間は第10.2表参照)で処理した。
アルカリ性の過マンガン酸塩溶液中の処理時間および温度のプラスチック表面に対する影響
Bayblend T45PGの複数のパネル(14.9cm×5.1cm×3mm、表面積:1.64dm2、ABS/PC混合物)を、例1に記載の通り、2−(2−エトキシエトキシ)エチルアセテート溶液中で処理して(前処理段階)、洗浄した。
種々のエッチング処理後の、金属層の接着強度の比較
Bayblend T45PGの4つのパネル(10cm×5cm、ABS/PC混合物)を、例1に記載の通り、2−(2−エトキシエトキシ)エチルアセテートの溶液中で前処理して、次に流水下で約1分洗浄した。
Claims (14)
- 物品の電気的非導電性プラスチック表面の金属化方法であって、以下の工程段階:
A)前記プラスチック表面をエッチング液で処理する工程、
B)前記プラスチック表面をコロイド溶液または金属化合物溶液で処理する工程、および
C)前記プラスチック表面を金属化溶液で金属化する工程
を含む前記方法であって、前記エッチング液が、少なくとも1種の酸性のエッチング液および少なくとも1種のアルカリ性のエッチング液を含んでいること、かつ該エッチング液それぞれが、過マンガン酸イオン源を含んでいることを特徴とする前記方法。 - 工程段階A)が、以下の段階:
Ai)前記プラスチック表面を酸性のエッチング液で処理する工程、および
Aii)前記プラスチック表面をアルカリ性のエッチング液で処理する工程、
を含んでいることを特徴とする、請求項1に記載の方法。 - 工程段階A)に先立って、以下のさらなる工程段階:
前処理段階:前記プラスチック表面を少なくとも1種のグリコール化合物を含む水溶液中で処理する工程
が実施されることを特徴とする、請求項1または2に記載の方法。 - 前記少なくとも1種のグリコール化合物が、一般式(I)
R1およびR2は、それぞれ独立して、−H、−CH3、−CH2−CH3、−CH2−CH2−CH3、−CH(CH3)−CH3、−CH2−CH2−CH2−CH3、−CH(CH3)−CH2−CH3、−CH2−CH(CH3)−CH3、−CH2−CH2−CH2−CH2−CH3、−CH(CH3)−CH2−CH2−CH3、−CH2−CH(CH3)−CH2−CH3、−CH2−CH2−CH(CH3)−CH3、−CH(CH2−CH3)−CH2−CH3、−CH2−CH(CH2−CH3)−CH3、−CO−CH3、−CO−CH2−CH3、−CO−CH2−CH2−CH3、−CO−CH(CH3)−CH3、−CO−CH(CH3)−CH2−CH3、−CO−CH2−CH(CH3)−CH3、−CO−CH2−CH2−CH2−CH3である]
の化合物から選択されることを特徴とする、請求項3に記載の方法。 - 工程段階A)のエッチング液中の過マンガン酸イオン源が、過マンガン酸カリウムおよび過マンガン酸ナトリウムを含むアルカリ金属過マンガン酸塩の群から独立して選択されることを特徴とする、請求項4に記載の方法。
- 工程段階A)のエッチング液中の過マンガン酸イオン源が、30g/l〜250g/lの濃度で独立して存在することを特徴とする、請求項4または5に記載の方法。
- 工程段階A)の酸性のエッチング液が、さらに無機酸を含むことを特徴とする、請求項1または2に記載の方法。
- 前記無機酸が、工程段階A)の酸性のエッチング液中に、一塩基酸に対して0.02〜0.6mol/lの濃度で存在することを特徴とする、請求項7に記載の方法。
- 工程段階A)のアルカリ性のエッチング液が、水酸化物イオン源をさらに含むことを特徴とする、請求項1または2に記載の方法。
- 前記水酸化物イオン源が、工程段階A)のアルカリ性のエッチング液中に、1g/l〜100g/lの濃度で存在することを特徴とする、請求項9に記載の方法。
- 前記プラスチック表面が、少なくとも1種の電気的非導電性プラスチックから製造されており、該少なくとも1種の電気的非導電性プラスチックが、アクリロニトリルブタジエンスチレンコポリマー、ポリアミド、ポリカーボネート、およびアクリロニトリルブタジエンスチレンコポリマーと少なくとも1種のさらなるポリマーとの混合物を含む群から選択されることを特徴とする、請求項1から10までのいずれか1項に記載の方法。
- 以下のさらなる工程段階:
Aiii)前記プラスチック表面を二酸化マンガンのための還元剤を含む溶液中で処理する工程
が、工程段階A)とB)との間に実施されることを特徴とする、請求項1から11までのいずれか1項に記載の方法。 - 前記二酸化マンガンのための還元剤が、硫酸ヒドロキシルアンモニウム、塩化ヒドロキシルアンモニウム、および過酸化水素を含む群から選択されることを特徴とする、請求項12に記載の方法。
- 以下のさらなる工程段階:
Bi)前記プラスチック表面を化成液中で処理する工程
が、工程段階B)とC)との間に実施されることを特徴とする、請求項1から13までのいずれか1項に記載の方法。
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EP20120159659 EP2639334A1 (de) | 2012-03-15 | 2012-03-15 | Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen |
PCT/EP2013/055357 WO2013135863A1 (en) | 2012-03-15 | 2013-03-15 | Process for metallizing nonconductive plastic surfaces |
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CN104169466A (zh) | 2014-11-26 |
EP2825688A1 (en) | 2015-01-21 |
US20150017331A1 (en) | 2015-01-15 |
WO2013135863A1 (en) | 2013-09-19 |
US9051643B2 (en) | 2015-06-09 |
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PL2825688T3 (pl) | 2016-11-30 |
EP2825688B1 (en) | 2016-05-18 |
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KR20140138290A (ko) | 2014-12-03 |
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