WO2008143190A1 - 樹脂成形体に対する無電解めっきの前処理方法、樹脂成形体に対するめっき方法、及び前処理剤 - Google Patents

樹脂成形体に対する無電解めっきの前処理方法、樹脂成形体に対するめっき方法、及び前処理剤 Download PDF

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Publication number
WO2008143190A1
WO2008143190A1 PCT/JP2008/059075 JP2008059075W WO2008143190A1 WO 2008143190 A1 WO2008143190 A1 WO 2008143190A1 JP 2008059075 W JP2008059075 W JP 2008059075W WO 2008143190 A1 WO2008143190 A1 WO 2008143190A1
Authority
WO
WIPO (PCT)
Prior art keywords
molded body
resin molded
plating
pretreatment process
pretreatment
Prior art date
Application number
PCT/JP2008/059075
Other languages
English (en)
French (fr)
Inventor
Toshimitsu Nagao
Yusuke Yoshikane
Junji Yoshikawa
Toru Morimoto
Toshiya Murata
Kazuya Satou
Original Assignee
Okuno Chemical Industries Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okuno Chemical Industries Co., Ltd. filed Critical Okuno Chemical Industries Co., Ltd.
Priority to US12/601,163 priority Critical patent/US20100155255A1/en
Priority to JP2009515217A priority patent/JP5585980B2/ja
Priority to EP08752904A priority patent/EP2149622A4/en
Publication of WO2008143190A1 publication Critical patent/WO2008143190A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Abstract

　本発明は、樹脂成形体に対する無電解めっきの前処理方法において、マンガン酸塩を含むエッチング液を用いて樹脂成形体に対してエッチング処理を行った後、還元性化合物及び無機酸を含む水溶液に該樹脂成形体を接触させる工程を含むことを特徴とする、前処理方法、並びに該前処理方法を含む樹脂成形体に対するめっき方法を提供するものである。更に、本発明は、該めっき方法において用いる各種処理剤も提供するものである。本発明によれば、樹脂成形体に対する無電解めっき処理において、マンガン酸塩を含むエッチング液を用いてエッチング処理を行う場合に、十分な密着性を有するめっき層を形成することが可能となる。
PCT/JP2008/059075 2007-05-22 2008-05-16 樹脂成形体に対する無電解めっきの前処理方法、樹脂成形体に対するめっき方法、及び前処理剤 WO2008143190A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/601,163 US20100155255A1 (en) 2007-05-22 2008-05-16 Pretreatment process for electroless plating of resin molded body, method for plating resin molded body, and pretreatment agent
JP2009515217A JP5585980B2 (ja) 2007-05-22 2008-05-16 樹脂成形体に対する無電解めっきの前処理方法、樹脂成形体に対するめっき方法、及び前処理剤
EP08752904A EP2149622A4 (en) 2007-05-22 2008-05-16 PRE-TREATMENT METHOD FOR ELECTRICALLY PLATING A RESIN FORM BODY, METHOD FOR PLATING A RESIN MOLD BODY AND PRE-TREATMENT AGENT

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-135200 2007-05-22
JP2007135200 2007-05-22

Publications (1)

Publication Number Publication Date
WO2008143190A1 true WO2008143190A1 (ja) 2008-11-27

Family

ID=40031891

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059075 WO2008143190A1 (ja) 2007-05-22 2008-05-16 樹脂成形体に対する無電解めっきの前処理方法、樹脂成形体に対するめっき方法、及び前処理剤

Country Status (4)

Country Link
US (1) US20100155255A1 (ja)
EP (1) EP2149622A4 (ja)
JP (1) JP5585980B2 (ja)
WO (1) WO2008143190A1 (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013047385A (ja) * 2011-08-17 2013-03-07 Rohm & Haas Electronic Materials Llc 無電解金属化のための安定な触媒
JP2013129856A (ja) * 2011-12-20 2013-07-04 Adeka Corp 無電解めっき前処理剤及び該前処理剤を用いた無電解めっき前処理方法
JP2014528515A (ja) * 2011-09-29 2014-10-27 マクダーミッド アキューメン インコーポレーテッド 硝酸含有媒質中でのエッチング後のプラスチック表面の処理
JP2015512985A (ja) * 2012-03-15 2015-04-30 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 非導電性プラスチック表面の金属化方法
JP2015513003A (ja) * 2012-03-15 2015-04-30 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 非導電性プラスチック表面の金属化方法
WO2016006301A1 (ja) * 2014-07-10 2016-01-14 奥野製薬工業株式会社 樹脂めっき方法
JP2017101304A (ja) * 2015-12-04 2017-06-08 株式会社Ｊｃｕ 樹脂表面のエッチング方法およびこれを利用した樹脂へのめっき方法
JPWO2017056285A1 (ja) * 2015-10-01 2018-10-04 株式会社Ｊｃｕ 樹脂成形体用エッチング液およびその用途
JPWO2018220946A1 (ja) * 2017-06-01 2020-04-02 株式会社Ｊｃｕ 樹脂表面の多段エッチング方法およびこれを利用した樹脂へのめっき方法

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GB0724870D0 (en) * 2007-12-21 2008-01-30 Univ Lincoln The Preparation of metal colloids
CN101928937B (zh) * 2009-06-22 2012-02-22 比亚迪股份有限公司 一种胶体钯活化液及其制备方法和一种非金属表面活化方法
US9534306B2 (en) 2012-01-23 2017-01-03 Macdermid Acumen, Inc. Electrolytic generation of manganese (III) ions in strong sulfuric acid
WO2014098064A1 (ja) * 2012-12-21 2014-06-26 奥野製薬工業株式会社 導電性皮膜形成浴
SI2971260T1 (sl) * 2013-03-12 2019-12-31 Macdermid Acumen, Inc. Elektrolitsko tvorjenje manganovih (III) ionov v močni žveplovi kislini
US10000652B2 (en) 2013-07-24 2018-06-19 National Research Council Of Canada Process for depositing metal on a substrate
KR20180077326A (ko) 2013-10-22 2018-07-06 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 수지 재료의 에칭 처리용 조성물
JP6024044B2 (ja) * 2014-01-27 2016-11-09 奥野製薬工業株式会社 導電性皮膜形成浴
US20170159184A1 (en) * 2015-12-07 2017-06-08 Averatek Corporation Metallization of low temperature fibers and porous substrates
EP3228729A1 (en) * 2016-04-04 2017-10-11 COVENTYA S.p.A. Process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath
JP2018104739A (ja) * 2016-12-22 2018-07-05 ローム・アンド・ハース電子材料株式会社 無電解めっき方法
CN112030148A (zh) * 2020-09-03 2020-12-04 深圳市生利科技有限公司 一种镀层高耐磨的镀铬工艺

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See also references of EP2149622A4

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013047385A (ja) * 2011-08-17 2013-03-07 Rohm & Haas Electronic Materials Llc 無電解金属化のための安定な触媒
JP2014528515A (ja) * 2011-09-29 2014-10-27 マクダーミッド アキューメン インコーポレーテッド 硝酸含有媒質中でのエッチング後のプラスチック表面の処理
JP2013129856A (ja) * 2011-12-20 2013-07-04 Adeka Corp 無電解めっき前処理剤及び該前処理剤を用いた無電解めっき前処理方法
JP2015512985A (ja) * 2012-03-15 2015-04-30 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 非導電性プラスチック表面の金属化方法
JP2015513003A (ja) * 2012-03-15 2015-04-30 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 非導電性プラスチック表面の金属化方法
JPWO2016006301A1 (ja) * 2014-07-10 2017-04-27 奥野製薬工業株式会社 樹脂めっき方法
WO2016006301A1 (ja) * 2014-07-10 2016-01-14 奥野製薬工業株式会社 樹脂めっき方法
KR20180059581A (ko) * 2014-07-10 2018-06-04 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 수지 도금 방법
KR101970970B1 (ko) * 2014-07-10 2019-04-22 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 수지 도금 방법
US11047052B2 (en) 2014-07-10 2021-06-29 Okuno Chemical Industries Co., Ltd. Resin plating method
JPWO2017056285A1 (ja) * 2015-10-01 2018-10-04 株式会社Ｊｃｕ 樹脂成形体用エッチング液およびその用途
JP2017101304A (ja) * 2015-12-04 2017-06-08 株式会社Ｊｃｕ 樹脂表面のエッチング方法およびこれを利用した樹脂へのめっき方法
WO2017094754A1 (ja) * 2015-12-04 2017-06-08 株式会社Ｊｃｕ 樹脂表面のエッチング方法およびこれを利用した樹脂へのめっき方法
JPWO2018220946A1 (ja) * 2017-06-01 2020-04-02 株式会社Ｊｃｕ 樹脂表面の多段エッチング方法およびこれを利用した樹脂へのめっき方法
JP7036817B2 (ja) 2017-06-01 2022-03-15 株式会社Jcu 樹脂表面の多段エッチング方法およびこれを利用した樹脂へのめっき方法

Also Published As

Publication number Publication date
EP2149622A4 (en) 2010-07-28
EP2149622A8 (en) 2010-04-14
JP5585980B2 (ja) 2014-09-10
EP2149622A1 (en) 2010-02-03
JPWO2008143190A1 (ja) 2010-08-05
US20100155255A1 (en) 2010-06-24

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