JP2002368190A5 - - Google Patents

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Publication number
JP2002368190A5
JP2002368190A5 JP2002012775A JP2002012775A JP2002368190A5 JP 2002368190 A5 JP2002368190 A5 JP 2002368190A5 JP 2002012775 A JP2002012775 A JP 2002012775A JP 2002012775 A JP2002012775 A JP 2002012775A JP 2002368190 A5 JP2002368190 A5 JP 2002368190A5
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JP
Japan
Prior art keywords
semiconductor chip
semiconductor
wiring board
electrodes
main surface
Prior art date
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Application number
JP2002012775A
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English (en)
Japanese (ja)
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JP2002368190A (ja
JP3839323B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2002012775A priority Critical patent/JP3839323B2/ja
Priority claimed from JP2002012775A external-priority patent/JP3839323B2/ja
Priority to US10/086,717 priority patent/US6951774B2/en
Priority to TW091103953A priority patent/TWI286806B/zh
Priority to KR1020020012170A priority patent/KR100818423B1/ko
Publication of JP2002368190A publication Critical patent/JP2002368190A/ja
Publication of JP2002368190A5 publication Critical patent/JP2002368190A5/ja
Application granted granted Critical
Publication of JP3839323B2 publication Critical patent/JP3839323B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002012775A 2001-04-06 2002-01-22 半導体装置の製造方法 Expired - Fee Related JP3839323B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002012775A JP3839323B2 (ja) 2001-04-06 2002-01-22 半導体装置の製造方法
US10/086,717 US6951774B2 (en) 2001-04-06 2002-03-04 Semiconductor device and method of manufacturing the same
TW091103953A TWI286806B (en) 2001-04-06 2002-03-04 Semiconductor device and method for manufacturing the same
KR1020020012170A KR100818423B1 (ko) 2001-04-06 2002-03-07 반도체 장치 및 그 제조 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-108603 2001-04-06
JP2001108603 2001-04-06
JP2002012775A JP3839323B2 (ja) 2001-04-06 2002-01-22 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2002368190A JP2002368190A (ja) 2002-12-20
JP2002368190A5 true JP2002368190A5 (https=) 2005-07-28
JP3839323B2 JP3839323B2 (ja) 2006-11-01

Family

ID=26613215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002012775A Expired - Fee Related JP3839323B2 (ja) 2001-04-06 2002-01-22 半導体装置の製造方法

Country Status (4)

Country Link
US (1) US6951774B2 (https=)
JP (1) JP3839323B2 (https=)
KR (1) KR100818423B1 (https=)
TW (1) TWI286806B (https=)

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US8586413B2 (en) * 2005-05-04 2013-11-19 Spansion Llc Multi-chip module having a support structure and method of manufacture
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US8816487B2 (en) * 2008-03-18 2014-08-26 Stats Chippac Ltd. Integrated circuit packaging system with package-in-package and method of manufacture thereof
US20090278262A1 (en) * 2008-05-09 2009-11-12 Boon Keat Tan Multi-chip package including component supporting die overhang and system including same
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