JPWO2023022179A5 - - Google Patents
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- Publication number
- JPWO2023022179A5 JPWO2023022179A5 JP2023542430A JP2023542430A JPWO2023022179A5 JP WO2023022179 A5 JPWO2023022179 A5 JP WO2023022179A5 JP 2023542430 A JP2023542430 A JP 2023542430A JP 2023542430 A JP2023542430 A JP 2023542430A JP WO2023022179 A5 JPWO2023022179 A5 JP WO2023022179A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- electrode
- bridge
- connection part
- connection portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 33
- 238000007789 sealing Methods 0.000 claims 24
- 238000000034 method Methods 0.000 claims 12
- 239000002245 particle Substances 0.000 claims 12
- 238000004519 manufacturing process Methods 0.000 claims 10
- 229910000679 solder Inorganic materials 0.000 claims 9
- 239000000945 filler Substances 0.000 claims 8
- 239000000463 material Substances 0.000 claims 8
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024085925A JP7832985B2 (ja) | 2021-08-20 | 2024-05-28 | 半導体モジュールおよび電子装置 |
| JP2025252176A JP2026031831A (ja) | 2021-08-20 | 2025-12-16 | 半導体モジュールおよび電子装置 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021135043 | 2021-08-20 | ||
| JP2021135043 | 2021-08-20 | ||
| JP2022032024 | 2022-03-02 | ||
| JP2022032024 | 2022-03-02 | ||
| PCT/JP2022/031116 WO2023022179A1 (ja) | 2021-08-20 | 2022-08-17 | 半導体モジュールおよびその製造方法、電子装置、電子モジュール、ならびに電子装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024085925A Division JP7832985B2 (ja) | 2021-08-20 | 2024-05-28 | 半導体モジュールおよび電子装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023022179A1 JPWO2023022179A1 (https=) | 2023-02-23 |
| JPWO2023022179A5 true JPWO2023022179A5 (https=) | 2023-12-22 |
| JP7496942B2 JP7496942B2 (ja) | 2024-06-07 |
Family
ID=85239847
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023542430A Active JP7496942B2 (ja) | 2021-08-20 | 2022-08-17 | 半導体モジュールおよびその製造方法、電子装置、電子モジュール、ならびに電子装置の製造方法 |
| JP2024085925A Active JP7832985B2 (ja) | 2021-08-20 | 2024-05-28 | 半導体モジュールおよび電子装置 |
| JP2025252176A Pending JP2026031831A (ja) | 2021-08-20 | 2025-12-16 | 半導体モジュールおよび電子装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024085925A Active JP7832985B2 (ja) | 2021-08-20 | 2024-05-28 | 半導体モジュールおよび電子装置 |
| JP2025252176A Pending JP2026031831A (ja) | 2021-08-20 | 2025-12-16 | 半導体モジュールおよび電子装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250015002A1 (https=) |
| JP (3) | JP7496942B2 (https=) |
| KR (1) | KR20240046499A (https=) |
| TW (1) | TW202322323A (https=) |
| WO (1) | WO2023022179A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021182529A1 (ja) | 2020-03-10 | 2021-09-16 | 日本製鉄株式会社 | 曲げ加工装置、鋼矢板の製造設備、曲げ加工方法、及び、鋼矢板の製造方法 |
| JPWO2024219502A1 (https=) * | 2023-04-19 | 2024-10-24 | ||
| US20240429142A1 (en) * | 2023-06-26 | 2024-12-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and manufacturing method thereof |
| US20250006644A1 (en) * | 2023-06-29 | 2025-01-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor package and manufacturing method thereof |
| CN121889709A (zh) * | 2023-09-27 | 2026-04-17 | 古河电气工业株式会社 | 基板组件 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090059504A (ko) * | 2007-12-06 | 2009-06-11 | 삼성전자주식회사 | 반도체 장치 및 그 제조방법들 |
| US8637392B2 (en) * | 2010-02-05 | 2014-01-28 | International Business Machines Corporation | Solder interconnect with non-wettable sidewall pillars and methods of manufacture |
| JP2014236188A (ja) * | 2013-06-05 | 2014-12-15 | イビデン株式会社 | 配線板及びその製造方法 |
| US9443824B1 (en) * | 2015-03-30 | 2016-09-13 | Qualcomm Incorporated | Cavity bridge connection for die split architecture |
| US10622311B2 (en) * | 2017-08-10 | 2020-04-14 | International Business Machines Corporation | High-density interconnecting adhesive tape |
| US10510721B2 (en) * | 2017-08-11 | 2019-12-17 | Advanced Micro Devices, Inc. | Molded chip combination |
| US10340253B2 (en) * | 2017-09-26 | 2019-07-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package structure and method of manufacturing the same |
| US10797022B2 (en) * | 2017-10-06 | 2020-10-06 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
| US10651126B2 (en) * | 2017-12-08 | 2020-05-12 | Applied Materials, Inc. | Methods and apparatus for wafer-level die bridge |
| US11289424B2 (en) * | 2018-11-29 | 2022-03-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package and method of manufacturing the same |
| US11735533B2 (en) | 2019-06-11 | 2023-08-22 | Intel Corporation | Heterogeneous nested interposer package for IC chips |
| US20210005542A1 (en) | 2019-07-03 | 2021-01-07 | Intel Corporation | Nested interposer package for ic chips |
| JP2021040012A (ja) * | 2019-09-02 | 2021-03-11 | キオクシア株式会社 | 半導体装置の製造方法 |
| US11854984B2 (en) * | 2019-09-25 | 2023-12-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor package and manufacturing method thereof |
| US11094637B2 (en) * | 2019-11-06 | 2021-08-17 | International Business Machines Corporation | Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers |
| US11239167B2 (en) * | 2019-12-04 | 2022-02-01 | International Business Machines Corporation | Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate |
| US11574872B2 (en) * | 2019-12-18 | 2023-02-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure and method of manufacturing the same |
| US11276620B2 (en) * | 2019-12-30 | 2022-03-15 | Advanced Semiconductor Engineering, Inc. | Package structure and method for manufacturing the same |
-
2022
- 2022-08-17 WO PCT/JP2022/031116 patent/WO2023022179A1/ja not_active Ceased
- 2022-08-17 KR KR1020247004921A patent/KR20240046499A/ko active Pending
- 2022-08-17 US US18/684,440 patent/US20250015002A1/en active Pending
- 2022-08-17 JP JP2023542430A patent/JP7496942B2/ja active Active
- 2022-08-19 TW TW111131350A patent/TW202322323A/zh unknown
-
2024
- 2024-05-28 JP JP2024085925A patent/JP7832985B2/ja active Active
-
2025
- 2025-12-16 JP JP2025252176A patent/JP2026031831A/ja active Pending
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