JP2002241473A - 熱硬化性エポキシ樹脂組成物とその成形体および多層プリント配線板 - Google Patents

熱硬化性エポキシ樹脂組成物とその成形体および多層プリント配線板

Info

Publication number
JP2002241473A
JP2002241473A JP2001040572A JP2001040572A JP2002241473A JP 2002241473 A JP2002241473 A JP 2002241473A JP 2001040572 A JP2001040572 A JP 2001040572A JP 2001040572 A JP2001040572 A JP 2001040572A JP 2002241473 A JP2002241473 A JP 2002241473A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
thermosetting epoxy
wiring board
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001040572A
Other languages
English (en)
Japanese (ja)
Inventor
Norio Kimura
紀雄 木村
Yasukazu Watanabe
靖一 渡辺
Koshin Nakai
弘進 中居
Naoki Yoneda
直樹 米田
Naoko Ota
尚子 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Priority to JP2001040572A priority Critical patent/JP2002241473A/ja
Priority to KR1020020007082A priority patent/KR100776725B1/ko
Priority to CNB021206384A priority patent/CN1289600C/zh
Priority to TW091102614A priority patent/TWI237036B/zh
Publication of JP2002241473A publication Critical patent/JP2002241473A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Epoxy Resins (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2001040572A 2001-02-16 2001-02-16 熱硬化性エポキシ樹脂組成物とその成形体および多層プリント配線板 Withdrawn JP2002241473A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001040572A JP2002241473A (ja) 2001-02-16 2001-02-16 熱硬化性エポキシ樹脂組成物とその成形体および多層プリント配線板
KR1020020007082A KR100776725B1 (ko) 2001-02-16 2002-02-07 열경화성 에폭시수지조성물과 그 성형체 및다층프린트배선판
CNB021206384A CN1289600C (zh) 2001-02-16 2002-02-09 热固性环氧树脂组合物、其成型体及多层印刷线路板
TW091102614A TWI237036B (en) 2001-02-16 2002-02-15 Thermosetting epoxy resin composition and its formed body and multilayered printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001040572A JP2002241473A (ja) 2001-02-16 2001-02-16 熱硬化性エポキシ樹脂組成物とその成形体および多層プリント配線板

Publications (1)

Publication Number Publication Date
JP2002241473A true JP2002241473A (ja) 2002-08-28

Family

ID=18903153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001040572A Withdrawn JP2002241473A (ja) 2001-02-16 2001-02-16 熱硬化性エポキシ樹脂組成物とその成形体および多層プリント配線板

Country Status (4)

Country Link
JP (1) JP2002241473A (ko)
KR (1) KR100776725B1 (ko)
CN (1) CN1289600C (ko)
TW (1) TWI237036B (ko)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146142A (ja) * 2003-11-17 2005-06-09 Nippon Kayaku Co Ltd エポキシ樹脂組成物
JP2005179598A (ja) * 2003-12-22 2005-07-07 Chin Yee Chemical Industries Co Ltd 難燃性エポキシ樹脂及び難燃性エポキシ樹脂組成物
JP2007115993A (ja) * 2005-10-21 2007-05-10 Sumitomo Bakelite Co Ltd プリント配線板、プリント配線板の製造方法及び多層プリント配線板
WO2008044552A1 (fr) * 2006-10-06 2008-04-17 Sumitomo Bakelite Company, Ltd. composition de résine, feuille isolante avec base, préimprégné, plaque de circuit imprimé à couches multiples et dispositif semi-conducteur
WO2008114858A1 (ja) * 2007-03-20 2008-09-25 Mitsui Mining & Smelting Co., Ltd. プリント配線板の絶縁層構成用の樹脂組成物
JP2009176889A (ja) * 2008-01-23 2009-08-06 Hitachi Chem Co Ltd 多層プリント配線板用絶縁樹脂組成物、支持体付き絶縁フィルム、多層プリント配線板及びその製造方法
JP2009188163A (ja) * 2008-02-06 2009-08-20 Hitachi Chem Co Ltd 多層プリント配線板用支持体付き絶縁フィルム、多層プリント配線板およびその製造方法
JP2010031176A (ja) * 2008-07-30 2010-02-12 Sekisui Chem Co Ltd 樹脂組成物、樹脂フィルム、積層フィルム及びプリント配線板
JP2012235135A (ja) * 2005-05-27 2012-11-29 Hitachi Chem Co Ltd 接着補助剤付金属箔、およびこれを用いたプリント配線板およびその製造方法
KR101228734B1 (ko) 2010-11-05 2013-02-01 삼성전기주식회사 다층배선기판용 난연성 수지 조성물 및 이를 포함하는 다층배선기판
CN103625051A (zh) * 2008-03-25 2014-03-12 味之素株式会社 绝缘树脂片以及使用该绝缘树脂片的多层印刷布线板的制备方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5720118B2 (ja) * 2009-06-01 2015-05-20 三菱レイヨン株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
CN104302124A (zh) * 2014-08-27 2015-01-21 无锡长辉机电科技有限公司 一种双面挠性印制板的制造工艺
CN108093561A (zh) * 2017-12-22 2018-05-29 珠海市航达科技有限公司 一种热电分离印制电路板的制作方法
KR102051375B1 (ko) * 2018-05-11 2019-12-04 삼성전자주식회사 인쇄회로기판 및 ic 패키지용 수지 조성물, 및 이를 이용한 제품

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05121465A (ja) * 1991-10-28 1993-05-18 Hitachi Chem Co Ltd 導電性樹脂ペースト組成物およびこの組成物を用いた半導体装置
JPH05308109A (ja) * 1992-04-28 1993-11-19 Ube Ind Ltd 半導体封止用液状エポキシ樹脂組成物
JPH09194813A (ja) * 1996-01-23 1997-07-29 Hitachi Chem Co Ltd 導電性樹脂ペースト組成物及び半導体装置
JPH11269355A (ja) * 1998-01-07 1999-10-05 Taiyo Ink Mfg Ltd 液状熱硬化性充填用組成物及びそれを用いたプリント配線板の永久穴埋め方法
JP2000212391A (ja) * 1999-01-21 2000-08-02 Nippon Kayaku Co Ltd 難燃性エポキシ樹脂組成物
JP2000226432A (ja) * 1999-02-08 2000-08-15 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2000264956A (ja) * 1999-03-12 2000-09-26 Dainippon Ink & Chem Inc 積層板用エポキシ樹脂組成物及び積層板
JP2000309624A (ja) * 1999-02-23 2000-11-07 Dainippon Ink & Chem Inc 難燃性エポキシ樹脂組成物及び難燃性エポキシ樹脂の製造方法
JP2000355622A (ja) * 1999-04-15 2000-12-26 Shin Etsu Chem Co Ltd エポキシ樹脂組成物並びにこのエポキシ樹脂組成物を用いた積層フィルム及び半導体装置
JP2001040183A (ja) * 1999-07-29 2001-02-13 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2002069270A (ja) * 2000-01-11 2002-03-08 Nippon Kayaku Co Ltd 難燃性非ハロゲンエポキシ樹脂組成物及びその用途

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995003310A1 (fr) * 1993-07-20 1995-02-02 Nippon Steel Chemical Co., Ltd. Nouveau compose ortho spiro ester, composition a base de resine, et produit de durcissement

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05121465A (ja) * 1991-10-28 1993-05-18 Hitachi Chem Co Ltd 導電性樹脂ペースト組成物およびこの組成物を用いた半導体装置
JPH05308109A (ja) * 1992-04-28 1993-11-19 Ube Ind Ltd 半導体封止用液状エポキシ樹脂組成物
JPH09194813A (ja) * 1996-01-23 1997-07-29 Hitachi Chem Co Ltd 導電性樹脂ペースト組成物及び半導体装置
JPH11269355A (ja) * 1998-01-07 1999-10-05 Taiyo Ink Mfg Ltd 液状熱硬化性充填用組成物及びそれを用いたプリント配線板の永久穴埋め方法
JP2000212391A (ja) * 1999-01-21 2000-08-02 Nippon Kayaku Co Ltd 難燃性エポキシ樹脂組成物
JP2000226432A (ja) * 1999-02-08 2000-08-15 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2000309624A (ja) * 1999-02-23 2000-11-07 Dainippon Ink & Chem Inc 難燃性エポキシ樹脂組成物及び難燃性エポキシ樹脂の製造方法
JP2000264956A (ja) * 1999-03-12 2000-09-26 Dainippon Ink & Chem Inc 積層板用エポキシ樹脂組成物及び積層板
JP2000355622A (ja) * 1999-04-15 2000-12-26 Shin Etsu Chem Co Ltd エポキシ樹脂組成物並びにこのエポキシ樹脂組成物を用いた積層フィルム及び半導体装置
JP2001040183A (ja) * 1999-07-29 2001-02-13 Hitachi Chem Co Ltd 樹脂ペースト組成物及びこれを用いた半導体装置
JP2002069270A (ja) * 2000-01-11 2002-03-08 Nippon Kayaku Co Ltd 難燃性非ハロゲンエポキシ樹脂組成物及びその用途

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4509539B2 (ja) * 2003-11-17 2010-07-21 日本化薬株式会社 エポキシ樹脂組成物シート
JP2005146142A (ja) * 2003-11-17 2005-06-09 Nippon Kayaku Co Ltd エポキシ樹脂組成物
JP2005179598A (ja) * 2003-12-22 2005-07-07 Chin Yee Chemical Industries Co Ltd 難燃性エポキシ樹脂及び難燃性エポキシ樹脂組成物
JP2012235135A (ja) * 2005-05-27 2012-11-29 Hitachi Chem Co Ltd 接着補助剤付金属箔、およびこれを用いたプリント配線板およびその製造方法
JP2007115993A (ja) * 2005-10-21 2007-05-10 Sumitomo Bakelite Co Ltd プリント配線板、プリント配線板の製造方法及び多層プリント配線板
US8216668B2 (en) 2006-10-06 2012-07-10 Sumitomo Bakelite Company, Ltd. Resin composition, insulating sheet with base, prepreg, multilayer printed wiring board and semiconductor device
WO2008044552A1 (fr) * 2006-10-06 2008-04-17 Sumitomo Bakelite Company, Ltd. composition de résine, feuille isolante avec base, préimprégné, plaque de circuit imprimé à couches multiples et dispositif semi-conducteur
WO2008114858A1 (ja) * 2007-03-20 2008-09-25 Mitsui Mining & Smelting Co., Ltd. プリント配線板の絶縁層構成用の樹脂組成物
US8431224B2 (en) 2007-03-20 2013-04-30 Mitsui Mining & Smelting Co., Ltd. Resin composition for forming insulating layer of printed wiring board
JP2009176889A (ja) * 2008-01-23 2009-08-06 Hitachi Chem Co Ltd 多層プリント配線板用絶縁樹脂組成物、支持体付き絶縁フィルム、多層プリント配線板及びその製造方法
JP2009188163A (ja) * 2008-02-06 2009-08-20 Hitachi Chem Co Ltd 多層プリント配線板用支持体付き絶縁フィルム、多層プリント配線板およびその製造方法
CN103625051A (zh) * 2008-03-25 2014-03-12 味之素株式会社 绝缘树脂片以及使用该绝缘树脂片的多层印刷布线板的制备方法
CN103625051B (zh) * 2008-03-25 2016-01-13 味之素株式会社 绝缘树脂片以及使用该绝缘树脂片的多层印刷布线板的制备方法
JP2010031176A (ja) * 2008-07-30 2010-02-12 Sekisui Chem Co Ltd 樹脂組成物、樹脂フィルム、積層フィルム及びプリント配線板
KR101228734B1 (ko) 2010-11-05 2013-02-01 삼성전기주식회사 다층배선기판용 난연성 수지 조성물 및 이를 포함하는 다층배선기판

Also Published As

Publication number Publication date
KR100776725B1 (ko) 2007-11-19
CN1289600C (zh) 2006-12-13
CN1384144A (zh) 2002-12-11
KR20020067627A (ko) 2002-08-23
TWI237036B (en) 2005-08-01

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