JP2012235135A - 接着補助剤付金属箔、およびこれを用いたプリント配線板およびその製造方法 - Google Patents
接着補助剤付金属箔、およびこれを用いたプリント配線板およびその製造方法 Download PDFInfo
- Publication number
- JP2012235135A JP2012235135A JP2012142230A JP2012142230A JP2012235135A JP 2012235135 A JP2012235135 A JP 2012235135A JP 2012142230 A JP2012142230 A JP 2012142230A JP 2012142230 A JP2012142230 A JP 2012142230A JP 2012235135 A JP2012235135 A JP 2012235135A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- metal foil
- wiring board
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011888 foil Substances 0.000 title abstract description 66
- 238000004519 manufacturing process Methods 0.000 title abstract description 10
- 239000012752 auxiliary agent Substances 0.000 title description 5
- 239000003822 epoxy resin Substances 0.000 claims abstract description 43
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 43
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 125000003710 aryl alkyl group Chemical group 0.000 claims abstract description 18
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 239000002245 particle Substances 0.000 claims description 22
- 229920003986 novolac Polymers 0.000 claims description 17
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 16
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 15
- 229920000459 Nitrile rubber Polymers 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 12
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- 230000015572 biosynthetic process Effects 0.000 abstract description 7
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- 239000005011 phenolic resin Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000011342 resin composition Substances 0.000 description 8
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- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 7
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
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- 239000004305 biphenyl Chemical group 0.000 description 4
- 235000010290 biphenyl Nutrition 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical class C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
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- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
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- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
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- 238000000576 coating method Methods 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
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- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical group C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
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- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
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Abstract
【解決手段】表面の十点平均粗さがRz=2.0μm以下の金属箔上に,(A)アラルキル型エポキシ樹脂と(B)エポキシ樹脂硬化剤としてフェノール性水酸基を有するアラルキル型樹脂とを含むエポキシ樹脂組成物からなる厚さ0.1〜10μmの接着補助層である。
【選択図】なし
Description
また、本発明の接着補助剤付金属箔を使用することにより,微細配線の形成が可能でありながら,通常の銅箔を使用した場合とほぼ同等の引き剥がし強さを有することができ,かつ吸湿耐熱性に優れた多層配線板を作製することができる。
下記に示す樹脂組成物1を作製した。
・アラルキル型エポキシ樹脂、ESN-480(新日鐵化学株式会社製) 62重量部
・フェノール性水酸基を有するアラルキル型樹脂,HEM−7851(明和化成株式会社製) 30重量部
・カルボン酸変性アクリロニトリルブタジエンゴム粒子、XER−91SE−15(JSR株式会社製) 8重量部
・イミダゾール誘導体化合物、1−シアノエチル−2フェニルイミダゾールリウム
トリメリテート、2PZ−CNS(四国化成工業株式会社製) 0.3重量部
・溶剤、メチルエチルケトン
(金属箔1の作製)
幅510mm、厚み18μmの電解銅箔(製品名F0-WS18:古河サーキットフォイル社製。Rz=1.2μm)の被接着面に,上記樹脂組成物1を塗工し金属箔1を作製した。塗工後は残溶剤が3%以下になるように170℃で10分程度の乾燥を行った。塗工した樹脂組成物1の厚みは,3.0μmであった。
実施例1において、金属箔1を作製する際、樹脂組成物1を6μmの厚みに塗布したこと以外は実施例1と同様に評価用サンプルを作製した。
実施例1において、アラルキル型エポキシ樹脂としてNC3000S−H(日本化薬株式会社製)62重量部,フェノール性水酸基を有するアラルキル型樹脂としてSN-480(新日鐵化学製)を20重量部、トリアジン環含有クレゾールノボラック型フェノール樹脂LA−3018(大日本インキ株式会社製)を10重量部用いた。その他は、実施例1と同様にして行った。
実施例3において,カルボン酸変性アクリロニトリルブタジエンゴム粒子8重量部の代わりに,ブタジエンゴム−アクリル樹脂のコアシェル粒子,EXL−2655(呉羽化学工業株式会社)8重量部を用いた。その他は、実施例3と同様にして行った。
実施例3において,ポリビニルアセタール樹脂,KS−23Z(積水化学製)を5重量部添加した。その他は、実施例3と同様にして行った。
実施例1において、金属箔1を積層する代わりにF0-WS箔18μm(古河サーキットフォイル社製)を積層したこと以外は実施例1と同様に評価用サンプルを作製した。
実施例1の樹脂組成物1を作製する際に,エポキシ樹脂にクレゾールノボラック型エポキシ樹脂,N−665(大日本インキ株式会社製)60重量部を用い,エポキシ樹脂硬化剤にノボラック型フェノール樹脂HP−850N(日立化成工業株式会社製)を30重量部とした他は,実施例1と同様に評価用サンプルを作製した。
実施例1〜6、比較例1〜2用の評価サンプルの導体引き剥がし強さを測定した。引き剥がしは垂直引き剥がし強さを測定した。測定は常に20℃で行った。測定方法は,JIS-C-6481に準じた。
実施例1〜6、比較例1〜2用評価用サンプルの吸湿耐熱試験を行った。基板の試験は各サンプルを121℃、湿度100%、2気圧の条件で2時間処理し、その後288℃のはんだ浴に20秒浸漬して,基板に膨れ等が発生しないかどうかの確認を行った。試験には平山製作所製飽和型PCT装置PC-242を用いた。
Claims (4)
- (A)アラルキル型エポキシ樹脂と(B)エポキシ樹脂硬化剤としてフェノール性水酸基を有するアラルキル型樹脂とを含むエポキシ樹脂組成物からなる厚さ0.1〜10μmの接着補助層。
- 前記(B)エポキシ樹脂硬化剤として、さらに,フェノール性水酸基を有するトリアジン環含有ノボラック型樹脂を3〜50当量%含むことを特徴とする請求項1に記載の接着補助層。
- 前記エポキシ樹脂組成物は、さらに(C)ゴム成分を含み,(A)成分100重量部に対し (C)成分が0.5〜25重量部であることを特徴とする請求項1または2に記載の接着補助層。
- 前記(C)成分がアクリロニトリルブタジエンゴム,カルボン酸変性アクリロニトリルブタジエンゴム,カルボン酸変性アクリロニトリルブタジエンゴム粒子,ブタジエンゴム−アクリル樹脂のコアシェル粒子,ポリビニルアセタール樹脂,カルボン酸変性ポリビニルアセタール樹脂から選択される少なくとも一種からなることを特徴とする請求項1から3のいずれかに記載の接着補助層。
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