JP2000511710A - 半導体ウェーハのプロセス装置 - Google Patents
半導体ウェーハのプロセス装置Info
- Publication number
- JP2000511710A JP2000511710A JP10533342A JP53334298A JP2000511710A JP 2000511710 A JP2000511710 A JP 2000511710A JP 10533342 A JP10533342 A JP 10533342A JP 53334298 A JP53334298 A JP 53334298A JP 2000511710 A JP2000511710 A JP 2000511710A
- Authority
- JP
- Japan
- Prior art keywords
- processing
- processing chamber
- reactor
- semiconductor wafer
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.処理室(24、29、30)であって、ウェーハを、貯蔵所又は別の処理 室から前記処理室に、又はその逆方向に輸送するための分配用システム(18) を有する前記処理室を備え、前記貯蔵所又は別の処理室に関し及び中央分配用シ ステムに関して前記処理室を閉鎖することが可能であり、更にリアクタ(31) 、並びに前記半導体ウェーハを前記処理室(30)内に配列された前記リアクタ に送りそしてここから取り出すための供給及び取出し手段(33、34)を備え 、少なくも第2のリアクタが前記処理室(30)内に配置され、この第2のリア クタには、半導体ウェーハを輸送するための第2の供給及び取出し手段(35) が設けられ、前記第1及び第2の取出し手段は前記半導体ウェーハを平行に供給 しそして取り出すように設計されていることを特徴とする半導体ウェーハ(13 )の処理装置(21)。 2.前記リアクタが同じ処理を行うように設計された請求項1による装置。 3.前記リアクタがオーブンを備える先行請求項の一つによる装置。 4.前記第1及び第2の供給及び取出し手段がターンテーブル(33)を備え 、これは、一方では、(カセット内の)半導体ウェーハを分配用システム(18 )から受け取りそしてこれらを分配用システム(18)に送り、他方では、(ボ ート内の)ウェーハを各リアクタ用の導入手段(34、35)に送りそしてここ から受け取る先行請求項の一つによる装置。 5.前記ターンテーブルが半導体ウェーハ及び/又はカセットを受け取るため の3個の位置をその上に有する請求項4による装置。 6.気密機構システムにより連結し得る少なくも2個の処理室(29、30) を備える先行請求項の一つによる装置。 7.各処理室が少なくも2個のリアクタを備える請求項6による装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1005102 | 1997-01-27 | ||
NL1005102A NL1005102C2 (nl) | 1997-01-27 | 1997-01-27 | Inrichting voor het behandelen van halfgeleiderschijven. |
PCT/NL1998/000055 WO1998036444A1 (en) | 1997-01-27 | 1998-01-27 | Device for processing semiconductor wafers |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000511710A true JP2000511710A (ja) | 2000-09-05 |
JP3403207B2 JP3403207B2 (ja) | 2003-05-06 |
Family
ID=19764285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53334298A Expired - Lifetime JP3403207B2 (ja) | 1997-01-27 | 1998-01-27 | 半導体ウェーハのプロセス装置 |
Country Status (9)
Country | Link |
---|---|
US (1) | US6607602B1 (ja) |
EP (1) | EP0960434B1 (ja) |
JP (1) | JP3403207B2 (ja) |
KR (1) | KR100411968B1 (ja) |
AU (1) | AU5682898A (ja) |
DE (1) | DE69804944T2 (ja) |
NL (1) | NL1005102C2 (ja) |
TW (1) | TW386242B (ja) |
WO (1) | WO1998036444A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002222804A (ja) * | 2001-01-25 | 2002-08-09 | Tokyo Electron Ltd | 熱処理方法及び熱処理装置 |
JP2015074818A (ja) * | 2013-10-11 | 2015-04-20 | Dowaサーモテック株式会社 | 浸炭焼入れ設備 |
Families Citing this family (229)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL1008143C2 (nl) | 1998-01-27 | 1999-07-28 | Asm Int | Stelsel voor het behandelen van wafers. |
NL1013989C2 (nl) | 1999-12-29 | 2001-07-02 | Asm Int | Werkwijze en inrichting voor het behandelen van een wafer. |
KR20020019414A (ko) * | 2000-09-05 | 2002-03-12 | 엔도 마코토 | 기판 처리 장치 및 기판 처리 장치를 이용한 반도체디바이스 제조 방법 |
US6860710B1 (en) * | 2002-08-30 | 2005-03-01 | Novellus Systems, Inc. | Lifting mechanism for integrated circuit fabrication systems |
JP2004103990A (ja) * | 2002-09-12 | 2004-04-02 | Hitachi Kokusai Electric Inc | 半導体製造装置および半導体装置の製造方法 |
US7351656B2 (en) * | 2005-01-21 | 2008-04-01 | Kabushiki Kaihsa Toshiba | Semiconductor device having oxidized metal film and manufacture method of the same |
DE202006007937U1 (de) * | 2006-05-18 | 2007-09-20 | Strämke, Siegfried, Dr.-Ing. | Plasmabehandlungsanlage |
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Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03125453A (ja) * | 1989-10-09 | 1991-05-28 | Toshiba Corp | 半導体ウエハ移送装置 |
KR0153250B1 (ko) * | 1990-06-28 | 1998-12-01 | 카자마 겐쥬 | 종형 열처리 장치 |
NL9200446A (nl) * | 1992-03-10 | 1993-10-01 | Tempress B V | Inrichting voor het behandelen van microschakeling-schijven (wafers). |
JP3258748B2 (ja) * | 1993-02-08 | 2002-02-18 | 東京エレクトロン株式会社 | 熱処理装置 |
US5855681A (en) * | 1996-11-18 | 1999-01-05 | Applied Materials, Inc. | Ultra high throughput wafer vacuum processing system |
-
1997
- 1997-01-27 NL NL1005102A patent/NL1005102C2/nl not_active IP Right Cessation
-
1998
- 1998-01-27 DE DE69804944T patent/DE69804944T2/de not_active Expired - Fee Related
- 1998-01-27 US US09/355,509 patent/US6607602B1/en not_active Expired - Lifetime
- 1998-01-27 JP JP53334298A patent/JP3403207B2/ja not_active Expired - Lifetime
- 1998-01-27 AU AU56828/98A patent/AU5682898A/en not_active Abandoned
- 1998-01-27 WO PCT/NL1998/000055 patent/WO1998036444A1/en active IP Right Grant
- 1998-01-27 EP EP98901135A patent/EP0960434B1/en not_active Expired - Lifetime
- 1998-01-27 KR KR10-1999-7006750A patent/KR100411968B1/ko not_active IP Right Cessation
- 1998-07-23 TW TW087112194A patent/TW386242B/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002222804A (ja) * | 2001-01-25 | 2002-08-09 | Tokyo Electron Ltd | 熱処理方法及び熱処理装置 |
JP2015074818A (ja) * | 2013-10-11 | 2015-04-20 | Dowaサーモテック株式会社 | 浸炭焼入れ設備 |
Also Published As
Publication number | Publication date |
---|---|
JP3403207B2 (ja) | 2003-05-06 |
EP0960434A1 (en) | 1999-12-01 |
DE69804944D1 (de) | 2002-05-23 |
DE69804944T2 (de) | 2002-11-07 |
TW386242B (en) | 2000-04-01 |
AU5682898A (en) | 1998-09-08 |
US6607602B1 (en) | 2003-08-19 |
EP0960434B1 (en) | 2002-04-17 |
WO1998036444A1 (en) | 1998-08-20 |
KR20000070506A (ko) | 2000-11-25 |
KR100411968B1 (ko) | 2003-12-24 |
NL1005102C2 (nl) | 1998-07-29 |
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